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1. 发明授权

US08728914B2 Workpiece cutting method 有权
公开(公告)号：US08728914B2
公开(公告)日：2014-05-20
申请号：US13148097
申请日：2010-01-27
申请人： Takeshi Sakamoto , Aiko Nakagawa
发明人： Takeshi Sakamoto , Aiko Nakagawa
IPC分类号： H01L21/00 , H01L21/20 , H01L21/36 , H01L21/44
CPC分类号： H01L21/78 , B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , C03B33/0222 , H01L21/67092
摘要： Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).

2. 发明授权

US08790997B2 Laser machining method and chip 有权
标题翻译：激光加工方法和芯片
公开(公告)号：US08790997B2
公开(公告)日：2014-07-29
申请号：US13387261
申请日：2010-08-17
申请人： Aiko Nakagawa , Takeshi Sakamoto
发明人： Aiko Nakagawa , Takeshi Sakamoto
IPC分类号： H01L21/268 , B23K26/00
CPC分类号： H01L23/562 , B23K26/046 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/67092 , H01L2924/0002 , H01L2924/00
摘要： While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.
摘要翻译：在可靠地切割待处理物体的同时，提高了所得到的芯片的强度。用激光L照射待处理物体1，以形成沿着切割线5延伸并沿物体1的厚度方向对准的改质区域17,27,37,47。这里，形成改质区域17 使得改性区域形成部分17a和改质区域未成形部分17b沿着直线交替，并且改性区域47形成为使得改性区域形成部分47a和改质区域未成形部分47b沿着线交替。这可以抑制形成的改质区域7降低通过切割获得的切屑的背面21侧和前面3侧的强度。另一方面，位于改质区域17,47之间的改质区域27,37从管线5的一端侧到另一端侧连续地形成，能够可靠地确保物体1的切断性。

3. 发明申请

US20120119334A1 LASER MACHINING METHOD AND CHIP 有权
标题翻译：激光加工方法和芯片
公开(公告)号：US20120119334A1
公开(公告)日：2012-05-17
申请号：US13387261
申请日：2010-08-17
申请人： Aiko Nakagawa , Takeshi Sakamoto
发明人： Aiko Nakagawa , Takeshi Sakamoto
IPC分类号： H01L23/544 , H01L21/78
CPC分类号： H01L23/562 , B23K26/046 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/67092 , H01L2924/0002 , H01L2924/00
摘要： While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.
摘要翻译：在可靠地切割待处理物体的同时，提高了所得到的芯片的强度。用激光L照射待处理物体1，以形成沿着切割线5延伸并沿物体1的厚度方向对准的改质区域17,27,37,47。这里，形成改质区域17 使得改性区域形成部分17a和改质区域未成形部分17b沿着直线交替，并且改性区域47形成为使得改性区域形成部分47a和改质区域未成形部分47b沿着线交替。这可以抑制形成的改质区域7降低通过切割获得的切屑的背面21侧和前面3侧的强度。另一方面，位于改质区域17,47之间的改质区域27,37从管线5的一端侧到另一端侧连续地形成，能够可靠地确保物体1的切断性。

4. 发明申请

US20110300691A1 WORKPIECE CUTTING METHOD 有权
标题翻译：工作切割方法
公开(公告)号：US20110300691A1
公开(公告)日：2011-12-08
申请号：US13148097
申请日：2010-01-27
申请人： Takeshi Sakamoto , Aiko Nakagawa
发明人： Takeshi Sakamoto , Aiko Nakagawa
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , C03B33/0222 , H01L21/67092
摘要： Fractures (17a, 17b) are generated from modified regions (7a, 7b) to front and rear faces (12a, 12b) of a object to be processed (1), respectively, while an unmodified region (2) is interposed between the modified regions (7a, 7b). This can prevent fractures from continuously advancing in the thickness direction of a silicon substrate (12) when forming a plurality of rows of modified regions (7). By generating a stress in the object (1), the fractures (17a, 17b) are connected to each other in the unmodified region (2), so as to cut the object (1). This can prevent fractures from meandering in the rear face (12b) of the object (1) and so forth, whereby the object (1) can be cut accurately along a line to cut the object (5).
摘要翻译：从修饰区域（7a，7b）分别向被处理物体（1）的前后面（12a，12b）分别产生断裂（17a，17b），而未改性区域（2）区域（7a，7b）。这可以防止当形成多行修改区域（7）时在硅衬底（12）的厚度方向上的断裂连续前进。通过在物体（1）中产生应力，裂纹（17a，17b）在未修改区域（2）中彼此连接，从而切割物体（1）。这可以防止在物体（1）的后表面（12b）等中产生蜿蜒的折痕，从而可以沿着切割物体（5）的线被精确地切割物体（1）。

5. 发明授权

US09903009B2 Rare earth magnet and method for manufacturing same 有权
公开(公告)号：US09903009B2
公开(公告)日：2018-02-27
申请号：US13352172
申请日：2012-01-17
申请人： Masashi Miwa , Takeshi Sakamoto , Jun Hagiwara , Masami Mori
发明人： Masashi Miwa , Takeshi Sakamoto , Jun Hagiwara , Masami Mori
IPC分类号： C22C33/02 , H01F41/02 , H01F1/057 , C09D5/08 , C23C22/18 , C23C22/42 , C23C22/73 , C23C22/74 , B22F3/24 , B22F9/04
CPC分类号： C22C33/0278 , B22F2003/248 , B22F2009/041 , B22F2009/043 , B22F2009/044 , B22F2998/10 , B22F2999/00 , C09D5/08 , C23C22/18 , C23C22/42 , C23C22/73 , C23C22/74 , H01F1/0572 , H01F1/0577 , H01F41/026 , Y10T428/26 , Y10T428/31678 , B22F9/04 , B22F3/02 , B22F3/10 , B22F3/24 , B22F2202/05 , B22F2201/10 , B22F2201/20
摘要： A rare-earth element including a magnet body containing a rare-earth element, and a protective layer formed on a surface of the magnet body. The protective layer may include a first layer covering the magnet body and containing a rare-earth element, and a second layer covering the first layer and containing substantially no rare-earth element. Another protective layer in accordance may include an inner protective layer and an outer protective layer successively from the magnet body side. The outer protective layer is any of an oxide layer, a resin layer, a metal salt layer, and a layer containing an organic-inorganic hybrid compound.

6. 发明授权

US09295969B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US09295969B2
公开(公告)日：2016-03-29
申请号：US13979178
申请日：2011-12-15
申请人： Junji Okuma , Takeshi Sakamoto
发明人： Junji Okuma , Takeshi Sakamoto
IPC分类号： B23K26/53 , B01J19/12 , B23K26/00 , B23K26/08 , B28D5/00 , H01L21/304 , H01L29/16 , C30B29/36 , C30B33/06
CPC分类号： H01L21/268 , B23K26/0006 , B23K26/0622 , B23K26/0853 , B23K26/53 , B23K2101/18 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C30B29/36 , C30B33/06 , H01L21/304 , H01L21/78 , H01L23/544 , H01L29/1608 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A planar object to be processed 1 comprising a hexagonal SiC substrate 12 having a front face 12a forming an angle corresponding to an off-angle with a c-plane is prepared. Subsequently, the object 1 is irradiated with pulse-oscillated laser light L along lines to cut 5a, 5m such that a pulse pitch becomes 10 μm to 18 μm while locating a converging point P of the laser light L within the SiC substrate 12. Thereby, modified regions 7a, 7m to become cutting start points are formed within the SiC substrate 12 along the lines 5a, 5m.
摘要翻译：准备待处理的平面物体1，其包括具有形成与c面成偏角相对应的角度的正面12a的六边形SiC衬底12。随后，将激光L的会聚点P定位在SiC衬底12内，使脉冲间距变为10μm〜18μm，沿着切割线5a，5m照射脉冲振荡激光L. 沿着线5a，5m形成SiC基板12内的成为切断起点的改质区域7a，7m。

7. 发明授权

US09175346B2 Evaluation method for arteriosclerosis 有权
标题翻译：动脉硬化评估方法
公开(公告)号：US09175346B2
公开(公告)日：2015-11-03
申请号：US13643590
申请日：2011-04-19
申请人： Hiroko Hanzawa , Takeshi Sakamoto , Naomi Manri , Yuji Kuge
发明人： Hiroko Hanzawa , Takeshi Sakamoto , Naomi Manri , Yuji Kuge
IPC分类号： G01N31/00 , G01N33/53 , C12Q1/68 , G01N33/564 , G01N33/86 , G01N33/18
CPC分类号： C12Q1/6883 , C12Q2600/112 , C12Q2600/158 , G01N33/18 , G01N33/1826 , G01N33/564 , G01N33/86 , G01N2333/4716 , G01N2800/323 , G01N2800/50 , G01N2800/52
摘要： Arteriosclerosis induces cerebral infarction and myocardial infarction. A multi-marker (a group of protein markers) that assesses the accurate pathogenesis of arteriosclerosis and enables the selection of an adequate treatment method for arteriosclerosis and prediction of the progression of arteriosclerosis, and an evaluation method for the diagnosis, prevention, and treatment of arteriosclerosis that uses said marker group as an indicator have been sought. The present invention relates to A method for evaluation of arteriosclerosis comprising the steps of (a) measuring the expression of von Willebrand factor and/or complement factor D in a sample derived from a subject, (b) measuring the expression of complement component C8 and/or vitamin K-dependent protein Z in the sample derived from the subject, and (c) evaluating arteriosclerosis in the subject on the basis of the results from (a) and (b).
摘要翻译：动脉硬化引起脑梗死和心肌梗死。评估动脉硬化的准确发病机理的多标记物（一组蛋白质标记物），能够选择适当的动脉硬化治疗方法和预测动脉硬化的进展，以及诊断，预防和治疗的评价方法已经寻求使用所述标记物组作为指标的动脉硬化。本发明涉及一种动脉硬化评估方法，其特征在于，包括以下步骤：（a）测定衍生自受试者的样品中血管性血友病因子和/或补体因子D的表达，（b）测量补体成分C8和 /或来自受试者的样品中的维生素K依赖性蛋白质Z，（c）基于（a）和（b）的结果评价受试者的动脉硬化。

8. 发明授权

US09005780B2 Rare earth magnet, method for producing same and method for producing multilayer body 有权
标题翻译：稀土磁体，其制造方法以及多层体的制造方法
公开(公告)号：US09005780B2
公开(公告)日：2015-04-14
申请号：US10594437
申请日：2005-03-28
申请人： Takeshi Sakamoto , Masami Mori , Yoshitomo Tanaka , Masashi Miwa
发明人： Takeshi Sakamoto , Masami Mori , Yoshitomo Tanaka , Masashi Miwa
IPC分类号： C22C38/00 , B32B15/01 , H01F7/02 , H01F41/02
CPC分类号： C22C38/005 , B32B15/01 , H01F7/0221 , H01F41/026 , Y10T428/32
摘要： The present invention aims to provide a rare earth magnet having sufficiently excellent anticorrosion property. The rare earth magnet 1 according to the present invention to solve the above problems includes a magnet body 10 containing rare earth elements, a substantial amorphous layer 20 formed on a surface of the magnet body 10, and a protecting layer 30 on a surface of the amorphous layer 20, and the amorphous layer 20 contains material identical to main component elements of magnet material contained in the magnet body 10.
摘要翻译：本发明的目的是提供一种具有足够优异的耐腐蚀性能的稀土磁体。为了解决上述问题，本发明的稀土类磁体1包括：含有稀土元素的磁铁体10，形成在磁铁体10的表面的实质的非晶体层20，以及在磁体10的表面上形成的保护层30 非晶层20和非晶层20包含与包含在磁体10中的磁体材料的主要成分元素相同的材料。

9. 发明授权

US08655185B2 Optical node, optical network system, and method for measuring polarization mode dispersion 有权
标题翻译：光节点，光网络系统和偏振模色散测量方法
公开(公告)号：US08655185B2
公开(公告)日：2014-02-18
申请号：US13004532
申请日：2011-01-11
申请人： Takeshi Sakamoto , Katsumi Fukumitsu , Kosuke Komaki
发明人： Takeshi Sakamoto , Katsumi Fukumitsu , Kosuke Komaki
IPC分类号： H04B10/00
CPC分类号： H04B10/0775 , H04B2210/074 , H04B2210/078
摘要： An optical node disposed along a transmission line that uses optical fiber. The optical node includes a first signal generator and a monitor. The first signal generator generates a first measurement signal for measuring polarization mode dispersion values and transmits the first measurement signal along the transmission line. The monitor detects a second measurement signal from the transmission line and measures polarization mode dispersion values by performing signal processing with respect to the second measurement signal.
摘要翻译：沿着使用光纤的传输线设置的光学节点。光节点包括第一信号发生器和监视器。第一信号发生器产生用于测量偏振模色散值的第一测量信号，并沿传输线发送第一测量信号。监视器从传输线检测第二测量信号，并通过对第二测量信号执行信号处理来测量偏振模色散值。

10. 发明申请

US20130040851A1 Evaluation Method for Arteriosclerosis 有权
标题翻译：动脉硬化评估方法
公开(公告)号：US20130040851A1
公开(公告)日：2013-02-14
申请号：US13643590
申请日：2011-04-19
申请人： Hiroko Hanzawa , Takeshi Sakamoto , Naomi Manri , Yuji Kuge
发明人： Hiroko Hanzawa , Takeshi Sakamoto , Naomi Manri , Yuji Kuge
IPC分类号： G01N27/62 , C40B30/04 , C12Q1/68 , G01N33/566 , G01N21/64
CPC分类号： C12Q1/6883 , C12Q2600/112 , C12Q2600/158 , G01N33/18 , G01N33/1826 , G01N33/564 , G01N33/86 , G01N2333/4716 , G01N2800/323 , G01N2800/50 , G01N2800/52
摘要： Arteriosclerosis induces cerebral infarction and myocardial infarction. A multi-marker (a group of protein markers) that assesses the accurate pathogenesis of arteriosclerosis and enables the selection of an adequate treatment method for arteriosclerosis and prediction of the progression of arteriosclerosis, and an evaluation method for the diagnosis, prevention, and treatment of arteriosclerosis that uses said marker group as an indicator have been sought. The present invention relates to A method for evaluation of arteriosclerosis comprising the steps of (a) measuring the expression of von Willebrand factor and/or complement factor D in a sample derived from a subject, (b) measuring the expression of complement component C8 and/or vitamin K-dependent protein Z in the sample derived from the subject, and (c) evaluating arteriosclerosis in the subject on the basis of the results from (a) and (b).
摘要翻译：动脉硬化引起脑梗死和心肌梗死。评估动脉硬化的准确发病机理的多标记物（一组蛋白质标记物），能够选择适当的动脉硬化治疗方法和预测动脉硬化的进展，以及诊断，预防和治疗的评价方法已经寻求使用所述标记物组作为指标的动脉硬化。本发明涉及一种动脉硬化评估方法，其特征在于，包括以下步骤：（a）测定衍生自受试者的样品中血管性血友病因子和/或补体因子D的表达，（b）测量补体成分C8和 /或来自受试者的样品中的维生素K依赖性蛋白质Z，（c）基于（a）和（b）的结果评价受试者的动脉硬化。

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