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1. 发明申请

US20060201915A1 Welding process for stainless steel piping 审中-公开
标题翻译：不锈钢管道焊接工艺
公开(公告)号：US20060201915A1
公开(公告)日：2006-09-14
申请号：US11354910
申请日：2006-02-16
申请人： Takeshi Obana , Shoji Imanaga , Eiji Ashida , Xiangjun Luo , Hiroo Koide , Mitsuaki Haneda
发明人： Takeshi Obana , Shoji Imanaga , Eiji Ashida , Xiangjun Luo , Hiroo Koide , Mitsuaki Haneda
IPC分类号： B23K9/04
CPC分类号： B23K9/0213 , B23K2101/06 , B23K2103/05
摘要： The present invention has an object to reduce residual stress in a tensile direction of a weld on the inner side in contact with reactor water of austenitic stainless steel piping, and to change the residual stress into compressive stress, to reduce stress corrosive cracking. The present invention provides a welding process for stainless steel piping of laminating two types of welding wire made of different materials in a groove of austenitic stainless steel piping, including at least one of a first layer penetration welding step of performing a predetermined back bead width on the back side of the groove bottom and a tack welding step, a first lamination welding step of lamination welding of austenitic stainless steel wire from the bottom to the top of the groove, and a second lamination welding step of lamination welding of nickel-base alloy wire to a final layer at the top of the groove.
摘要翻译：本发明的目的是减少与奥氏体不锈钢管道的反应器水接触的内侧的焊缝的拉伸方向的残余应力，并且将残余应力变为压缩应力，以减少应力腐蚀开裂。本发明提供一种用于在奥氏体不锈钢管道的槽中层叠由不同材料制成的两种类型的焊丝的不锈钢管道的焊接工艺，其包括以下步骤中的至少一个：执行预定的后焊道宽度的第一层穿透焊接步骤凹槽底部的背面和定位焊接步骤，从底部到顶部的奥氏体不锈钢丝层压焊接的第一层压焊接步骤，以及镍基合金的层压焊接的第二层压焊接步骤导线到槽顶部的最后层。

2. 发明授权

US4244751A Method for melt nitriding of aluminum or its alloy 失效
标题翻译：铝或其合金的熔融氮化方法
公开(公告)号：US4244751A
公开(公告)日：1981-01-13
申请号：US52200
申请日：1979-06-26
申请人： Susumu Hioki , Toshihiro Yamada , Kazuyoshi Hatano , Mitsuaki Haneda , Shoji Imanaga
发明人： Susumu Hioki , Toshihiro Yamada , Kazuyoshi Hatano , Mitsuaki Haneda , Shoji Imanaga
IPC分类号： C23C26/00 , C22C1/02 , C23C8/24 , C22F1/04
CPC分类号： C23C8/24
摘要： Aluminum or its alloy is subjected to surface treatment wherein the surface is heated and melted by the heat of an electric arc in an atmosphere of a mixture of inert gas and nitrogen gas. By this treatment, a dense layer of aluminum nitride is formed on the surface of aluminum or its alloy so that material of increased wear resistance is obtained.
摘要翻译：对铝或其合金进行表面处理，其中表面在惰性气体和氮气的混合气氛中被电弧的热量加热和熔化。通过这种处理，在铝或其合金的表面上形成致密的氮化铝层，从而获得增加的耐磨性的材料。

3. 发明授权

US4610718A Method for manufacturing ultra-fine particles 失效
标题翻译：超细颗粒的制造方法
公开(公告)号：US4610718A
公开(公告)日：1986-09-09
申请号：US726651
申请日：1985-04-24
申请人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
发明人： Takeshi Araya , Ryoji Okada , Yoshiro Ibaraki , Susumu Hioki , Masatoshi Kanamaru , Yoshishige Endo , Mitsuaki Haneda
IPC分类号： B22F9/14 , H05H1/28 , B01J2/04
CPC分类号： B22F9/14 , H05H1/28 , B22F2998/00
摘要： In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.
摘要翻译：在将电弧撞击穿过材料蒸发成超细颗粒和电极的方法中，从而制造超细颗粒; 对于电极中的至少任一个设置变成超细颗粒的材料，并且从材料和电极产生等离子体电流，由此每单位输入的超细颗粒的形成速率增加，并且材料形成为棒状或线状，并且配置能够连续供给材料的馈线，由此可以连续地制造超细颗粒。

4. 发明授权

US5458460A Drainage pump and a hydraulic turbine incorporating a bearing member, and a method of manufacturing the bearing member 失效
标题翻译：排水泵和包括轴承构件的水轮机，以及制造轴承构件的方法
公开(公告)号：US5458460A
公开(公告)日：1995-10-17
申请号：US197312
申请日：1994-02-16
申请人： Ryoji Okada , Kooji Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
发明人： Ryoji Okada , Kooji Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
IPC分类号： C23C4/06 , F04D29/04 , F04D29/046 , F04D29/047 , F16C17/18 , F16C33/04
CPC分类号： F04D29/047 , C23C4/06 , F04D29/0465 , F16C17/18 , F16C33/043 , F05B2230/70
摘要： Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit.The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.
摘要翻译：公开了一种轴承单元，其可用于在不提供清水的情况下运行的排水泵或液压泵，其对含有砂土的水表现出优异的耐磨性和令人满意的组装设备，以及制造轴承单元的方法。由不锈钢和/或套筒制成的轴承的接触表面施加喷涂的涂层，其主要成分是WC，并且其包含一种或多种选自镍，铬和钴的元素作为其粘合剂材料或其主要成分为Cr 3 C 2并且包含NiCr作为粘合剂材料的喷涂涂层，在喷涂形成后，进行在300℃至550℃的加热 1小时以上，可以获得与WC-12％烧结体相当的硬度和耐磨性。

5. 发明授权

US5346316A Bearing unit, drainage pump and hydraulic turbine each incorporating the bearing unit 失效
标题翻译：轴承单元，排水泵和水轮机，每个都包含轴承单元
公开(公告)号：US5346316A
公开(公告)日：1994-09-13
申请号：US034379
申请日：1993-03-18
申请人： Ryoji Okada , Kooju Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
发明人： Ryoji Okada , Kooju Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
IPC分类号： C23C4/06 , F04D29/04 , F04D29/046 , F04D29/047 , F16C33/12 , F16C33/04
CPC分类号： F04D29/047 , C23C4/06 , F04D29/0465 , F16C33/12 , F16C33/122
摘要： Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit.The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC - 12% sintered article is attained.
摘要翻译：公开了一种轴承单元，其可用于在不提供清水的情况下运行的排水泵或液压泵，其对含有砂土的水表现出优异的耐磨性和令人满意的组装设备，以及制造轴承单元的方法。由不锈钢和/或套筒制成的轴承的接触表面施加喷涂的涂层，其主要成分是WC，并且其包含一种或多种选自镍，铬和钴的元素作为其粘合剂材料或其主要成分为Cr 3 C 2并且包含NiCr作为粘合剂材料的喷涂涂层，在喷涂形成后，进行在300℃至550℃的加热使其硬度和耐磨性达到等于WC-12％烧结制品的硬度和耐磨性。

6. 发明授权

US5295045A Plastic-molded-type semiconductor device and producing method therefor 失效
标题翻译：塑料成型型半导体器件及其制造方法
公开(公告)号：US5295045A
公开(公告)日：1994-03-15
申请号：US791551
申请日：1991-11-14
申请人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Nae Yoneda , Maya Obata , Ryuji Kohno , Mitsuaki Haneda
发明人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Nae Yoneda , Maya Obata , Ryuji Kohno , Mitsuaki Haneda
IPC分类号： H01L23/28 , H01L23/495 , H01L23/50 , H01L23/52 , H01L25/065 , H01L25/07 , H01L25/18 , H05K5/02
CPC分类号： H01L23/49575 , H01L23/4951 , H01L2224/05554 , H01L2224/32245 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19041
摘要： A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.
摘要翻译：具有高集成度的塑料模制型半导体器件将多个半导体芯片封装在封装单元中，每个芯片垂直于衬底设置用于安装。在每个芯片容纳电路的表面上或其背面上，引线框架之间插入绝缘材料。芯片和引线框架通过电线相互连接。引线框架垂直布置成并联设置的另一引线框架，通过焊接与引线框架相连接。可以使用印刷电路板代替所述后置引线框架。通过将芯片布置在由树脂制成的突起中，半导体器件的热阻降低。本发明对存储器IC特别有效。

7. 发明授权

US5571428A Semiconductor leadframe and its production method and plastic encapsulated semiconductor device 失效
公开(公告)号：US5571428A
公开(公告)日：1996-11-05
申请号：US423735
申请日：1995-04-18
申请人： Asao Nishimura , Akihiro Yaguchi , Mitsuaki Haneda , Ichiro Anjoh , Junichi Arita , Akihiko Iwaya , Masahiro Ichitani
发明人： Asao Nishimura , Akihiro Yaguchi , Mitsuaki Haneda , Ichiro Anjoh , Junichi Arita , Akihiko Iwaya , Masahiro Ichitani
IPC分类号： B23K26/00 , B23K26/20 , H01L23/495 , H01L23/50 , B23K28/02
CPC分类号： H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L2224/32245 , H01L2224/451 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01057 , H01L2924/12042 , Y10S428/901 , Y10T428/24917
摘要： A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.

8. 发明授权

US4855102A Sintering method 失效
标题翻译：烧结方法
公开(公告)号：US4855102A
公开(公告)日：1989-08-08
申请号：US171461
申请日：1988-03-21
申请人： Ryoji Okada , Mitsuaki Haneda , Takeshi Araya , Susumu Hioki
发明人： Ryoji Okada , Mitsuaki Haneda , Takeshi Araya , Susumu Hioki
IPC分类号： C04B35/64 , B22F3/10 , B22F3/105 , B22F7/02 , B22F7/04 , B22F7/06 , B23K26/18 , B23K26/20 , B23K35/22 , H01L21/60 , H01L21/768
CPC分类号： H01L24/86 , B22F3/10 , B22F3/1055 , B22F7/02 , B22F7/06 , B23K26/009 , B23K26/18 , B23K26/24 , B23K26/342 , B23K35/226 , H01L24/11 , H01L24/13 , H01L24/80 , B22F2003/1052 , B23K2201/36 , H01L2224/11505 , H01L2224/13082 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , Y02P10/295
摘要： A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.

9. 发明授权

US5839880A Bearing unit, drainage pump and hydraulic turbine each incorporating the bearing unit, and method of manufacturing the bearing unit 失效
标题翻译：各轴承单元，排水泵，水轮机，以及轴承单元的制造方法
公开(公告)号：US5839880A
公开(公告)日：1998-11-24
申请号：US503627
申请日：1995-07-18
申请人： Ryoji Okada , Kooji Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
发明人： Ryoji Okada , Kooji Aizawa , Masayuki Yamada , Kenji Otani , Kunio Takada , Mitsuaki Haneda , Toshihiro Yamada
IPC分类号： C23C4/06 , F04D29/04 , F04D29/046 , F04D29/047 , F16C17/18 , F16C33/04
CPC分类号： F04D29/047 , C23C4/06 , F04D29/0465 , F16C17/18 , F16C33/043 , F05B2230/70
摘要： Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit. The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.
摘要翻译：公开了一种轴承单元，其可用于在不提供清水的情况下运行的排水泵或液压泵，其对含有砂土的水表现出优异的耐磨性和令人满意的组装设备，以及制造轴承单元的方法。由不锈钢和/或套筒制成的轴承的接触表面施加喷涂的涂层，其主要成分是WC，并且其包含一种或多种选自镍，铬和钴的元素作为其粘合剂材料或其主要成分为Cr 3 C 2并且包含NiCr作为粘合剂材料的喷涂涂层，在喷涂形成后，进行在300℃至550℃的加热 1小时以上，可以获得与WC-12％烧结体相当的硬度和耐磨性。

10. 发明授权

US5437915A Semiconductor leadframe and its production method and plastic encapsulated semiconductor device 失效
标题翻译：半导体引线框及其制造方法和塑料封装半导体器件
公开(公告)号：US5437915A
公开(公告)日：1995-08-01
申请号：US261230
申请日：1994-06-16
申请人： Asao Nishimura , Akihiro Yaguchi , Mitsuaki Haneda , Ichiro Anjoh , Junichi Arita , Akihiko Iwaya , Masahiro Ichitani
发明人： Asao Nishimura , Akihiro Yaguchi , Mitsuaki Haneda , Ichiro Anjoh , Junichi Arita , Akihiko Iwaya , Masahiro Ichitani
IPC分类号： B23K26/00 , B23K26/20 , H01L23/495 , H01L23/50 , B32B9/00
CPC分类号： H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L2224/32245 , H01L2224/451 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01057 , H01L2924/12042 , Y10S428/901 , Y10T428/24917
摘要： A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.
摘要翻译：一种制造用于半导体器件的引线框架的方法包括以下步骤：在要重叠和焊接的引线1a和1b之间形成空间，并且在包括该空间的区域中焊接引线并熔化并切断一个的领导。在熔化的一个引线中，熔融金属的内聚和分离发生在空间周围的区域中。结果，当通过焊接连接引线时，可以切断用于定位的诸如用于定位的外框之类的不必要的部分。因此，实现了多个元件引线框架的高精度定位以及高的组装生产率。

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