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1. 发明授权

US07418603B2 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program 失效
标题翻译：移动终端，电路板，电路板设计辅助设备和方法，设计辅助程序，以及存储在其中的存储介质设计辅助程序
公开(公告)号：US07418603B2
公开(公告)日：2008-08-26
申请号：US10959987
申请日：2004-10-08
申请人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
发明人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
IPC分类号： G06F12/14
CPC分类号： G06F21/87 , G06F17/5068 , H01L2224/16225 , H05K1/0275 , H05K1/186 , H05K3/0005 , H05K2201/10151
摘要： The present invention provides a tamper resistant circuit board, an apparatus and method for aiding the design of the circuit board, a computer readable storage medium having stored therein a program for performing the method, and a mobile terminal containing the circuit board. The tamper resistant circuit board has a multilayer structure, including outermost substrates and an internal layer between the outermost substrates, and a signal line through which a confidential signal flows. The signal line is wired such as the confidential signal does not appear on the outer surfaces of the outermost substrates of the multilayer structure of the circuit board.
摘要翻译：本发明提供一种用于辅助电路板设计的防篡改电路板，装置和方法，其中存储有用于执行该方法的程序的计算机可读存储介质和包含电路板的移动终端。防篡改电路板具有包括最外层基板和最外层基板之间的内层的多层结构以及机密信号通过其的信号线。信号线被布线，例如机密信号不出现在电路板的多层结构的最外面的基板的外表面上。

2. 发明申请

US20050081049A1 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program 失效
标题翻译：移动终端，电路板，电路板设计辅助设备和方法，设计辅助程序，以及存储在其中的存储介质设计辅助程序
公开(公告)号：US20050081049A1
公开(公告)日：2005-04-14
申请号：US10959987
申请日：2004-10-08
申请人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
发明人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
IPC分类号： G06F17/50 , G06F21/87 , H05K1/02 , H05K1/18 , H05K3/00 , H04L9/00
CPC分类号： G06F21/87 , G06F17/5068 , H01L2224/16225 , H05K1/0275 , H05K1/186 , H05K3/0005 , H05K2201/10151
摘要： A circuit board is provided in which tamper resistance is improved by making probing by third parties difficult, while solving problems associated with the current techniques and manufacturing costs. A signal line through which a confidential signal requiring tamper resistance flows and components 32 and 33 connected to the signal line 21 by the terminals thereof, are laid out in a component-containing layer 13 of a circuit board 10. Only a confidential signal having been encrypted through a predetermined component 31 is outputted to an observation point 34 provided on a surface of the circuit board 10. External observation and control of the confidential signal is performed by decoding a cipher provided by the component 31 to the signal which appears at the observation point 34.
摘要翻译：提供了一种电路板，其中通过使第三方的探测困难，同时解决与当前技术和制造成本相关的问题，提高了防篡改性。要求篡改电阻的机密信号流过的信号线和其端子与信号线21连接的部件32和33布置在电路板10的部件含有层13中。只有机密信号已被通过预定部件31加密的信号被输出到设置在电路板10的表面上的观察点34.机密信号的外部观察和控制是通过将由部件31提供的密码解码为在观察时出现的信号点34。

3. 发明申请

US20080047137A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20080047137A1
公开(公告)日：2008-02-28
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R43/20 , H01R12/00 , H01R13/24
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

4. 发明授权

US07258549B2 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US07258549B2
公开(公告)日：2007-08-21
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R12/00
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

5. 发明申请

US20050184381A1 Connection member and mount assembly and production method of the same 有权
标题翻译：连接构件和安装组装及生产方法相同
公开(公告)号：US20050184381A1
公开(公告)日：2005-08-25
申请号：US11060550
申请日：2005-02-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H01R13/24 , H05K1/00 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/20 , H05K3/34 , H05K3/36 , H05K3/40 , H01R27/02 , H01L23/48 , H01R12/00 , H01R25/00 , H01R31/00 , H01R33/88 , H01R33/90 , H01R33/92 , H01R33/94
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member is provided which can be produced without a via-forming step. The connection member 100 includes an insulating substrate 10 which has an upper surface 10a, a lower surface 10b opposed to the upper surface 10b and a side surface 10c which connects these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface.
摘要翻译：提供了可以在没有通孔形成步骤的情况下制造的连接构件。连接构件100包括绝缘基板10，其具有上表面10a，与上表面10b相对的下表面10b和连接这些表面的侧表面10c; 至少一个布线20，其通过侧表面从上表面延伸到下表面。

6. 发明授权

US07748110B2 Method for producing connection member 有权
标题翻译：连接部件的制造方法
公开(公告)号：US07748110B2
公开(公告)日：2010-07-06
申请号：US11826758
申请日：2007-07-18
申请人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
发明人： Toshiyuki Asahi , Seiji Karashima , Takashi Ichiryu , Seiichi Nakatani , Tousaku Nishiyama , Koichi Hirano , Osamu Shibata , Takeshi Nakayama , Yoshiyuki Saito
IPC分类号： H05K3/36
CPC分类号： H05K3/403 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H01R13/2414 , H05K1/0218 , H05K1/0284 , H05K1/141 , H05K1/145 , H05K1/182 , H05K3/20 , H05K3/3442 , H05K3/361 , H05K3/366 , H05K3/368 , H05K2201/043 , H05K2201/048 , H05K2201/049 , H05K2201/055 , H05K2201/056 , H05K2201/09036 , H05K2201/10515 , H05K2201/10689 , H05K2203/302 , Y10T29/49117 , Y10T29/49126 , Y10T29/49208 , H01L2924/00
摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
摘要翻译：可以在没有通孔形成步骤的情况下制造连接构件。连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

7. 发明申请

US20050289269A1 Slave device, master device and stacked device 有权
标题翻译：从设备，主设备和堆叠设备
公开(公告)号：US20050289269A1
公开(公告)日：2005-12-29
申请号：US11149171
申请日：2005-06-10
申请人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
发明人： Takeshi Nakayama , Eiji Takahashi , Yoshiyuki Saito , Yukihiro Ishimaru , Hideki Iwaki
IPC分类号： G06F13/00 , G06F13/40 , G06F13/42
CPC分类号： G06F13/409 , G06F13/4226 , H01L2224/05001 , H01L2224/05009 , H01L2224/05568 , H01L2224/16145 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.
摘要翻译：公开了一种容易制造的堆叠式装置，同时识别堆叠在堆叠装置中的多个装置。堆叠式装置包括多个从装置的堆叠和具有相同端子装置的主装置。这里，主设备包括命令传输单元，其被配置为向相邻从设备的终端输入识别命令。此外，从设备包括用于互连同一设备的至少一个终端和相邻从设备的通线; 命令接收单元，被配置为接收所述识别命令; ID（识别符）设定部，其基于所述识别命令来设定同一设备的ID; 与相邻从设备互连的终端的位置在每个从设备中不同，从而在每个从设备中，从设备命令接收单元接收作为转接通线的结果具有修改值的标识命令，被连接在每个从设备中的不同位置。

8. 发明申请

US20050287871A1 Device, method, and program for computer aided design of flexible substrates 审中-公开
标题翻译：柔性基板计算机辅助设计的装置，方法和程序
公开(公告)号：US20050287871A1
公开(公告)日：2005-12-29
申请号：US11156659
申请日：2005-06-21
申请人： Takeshi Nakayama , Shin-ichi Tanimoto , Yoshiyuki Saito
发明人： Takeshi Nakayama , Shin-ichi Tanimoto , Yoshiyuki Saito
IPC分类号： G06F17/50 , H01R25/00 , H05K1/00 , H05K3/00
CPC分类号： G06F17/5068 , G06F2217/40 , H05K1/0393 , H05K3/0005
摘要： A device, method, and program too facilitate the design of flexible printed circuit boards is disclosed which generates, as a prohibited space, a position assumed to be occupied by a part on an opposing printed circuit board when the printed circuit board is bent from a bend position. Design preparation of a bendable flexible printed circuit board can be efficiently checked by checking for the presence/absence of interference between parts and prohibited spaces.
摘要翻译：一种装置，方法和程序太容易设计出柔性印刷电路板的设计，当印刷电路板从一个印刷电路板弯曲时，该柔性印刷电路板被设计为被禁止的空间，该位置被假定为由相对的印刷电路板上的一部分占据的位置弯曲位置。通过检查部件和禁止空间之间是否存在干扰，可以有效地检查可弯曲的柔性印刷电路板的设计准备。

9. 发明授权

US08878559B2 IC current measuring apparatus and IC current measuring adapter 有权
标题翻译： IC电流测量仪和IC电流测量适配器
公开(公告)号：US08878559B2
公开(公告)日：2014-11-04
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R31/26 , G01R31/28 , G01R1/20 , G01R31/02
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译： IC电流测量装置设置在IC和基板之间。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

10. 发明申请

US20120112737A1 IC CURRENT MEASURING APPARATUS AND IC CURRENT MEASURING ADAPTER 有权
标题翻译： IC电流测量装置和IC电流测量适配器
公开(公告)号：US20120112737A1
公开(公告)日：2012-05-10
申请号：US13382690
申请日：2011-04-19
申请人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
发明人： Takeshi Nakayama , Yoshiyuki Saito , Masahiro Ishii , Kouichi Ishino , Yukihiro Ishimaru
IPC分类号： G01R1/20
CPC分类号： G01R1/203 , G01R31/021 , G01R31/2801 , G01R31/2886 , G01R31/2889 , G01R31/2896
摘要： Provided is an IC current measuring apparatus provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.
摘要翻译：提供了设置在IC和基板之间的IC电流测量装置。 IC电流测量装置将多个面向IC的端子和多个面向衬底的端子中的每一个电连接。特别地，电阻分别插入到测量对象的IC终端和与其对应的基板端子之间的路径中。此外，IC电流测量装置设置有用于测量与其对应的插入电阻的两端之间的电压的端子。因此，测量流过面向IC的端子的电流的测量器可以通过在用于测量的IC和基板之间提供IC电流测量装置来测量流过面向IC的端子的电流，并且测量两端之间的电压与IC端子相对应的插入电阻，他/她希望通过电流测量流动。

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