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    • 4. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US09046763B2
    • 2015-06-02
    • US12727025
    • 2010-03-18
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • Takeshi KoshibaIkuo YonedaTetsuro Nakasugi
    • B27N3/18G03F7/00B82Y10/00B82Y40/00
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 5. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • US20100237045A1
    • 2010-09-23
    • US12727025
    • 2010-03-18
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • Takeshi KOSHIBAIkuo YonedaTetsuro Nakasugi
    • B44C1/22B05D5/00B05D3/06
    • B05D1/322B82Y10/00B82Y40/00G03F7/0002
    • A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.
    • 图案形成方法包括确定在基材上形成的固化性树脂的量,所述固化性树脂具有挥发性,所述固化性树脂的量是通过考虑了固化性树脂的挥发性损失的计算而计算的, 基板的多个区域,在基板上形成具有确定量的固化树脂,对基板的多个区域中的每一个进行固化树脂的形成,使形成在基板上的可固化树脂与模板接触, 模板包括通过接触填充固化树脂的图案,并且在可固化树脂与模板接触的条件下固化可固化树脂。
    • 6. 发明申请
    • MOLD AND MOLD BLANK SUBSTRATE
    • 模具和模具底座
    • US20140072668A1
    • 2014-03-13
    • US13731617
    • 2012-12-31
    • Ikuo YONEDATetsuro Nakasugi
    • Ikuo YONEDATetsuro Nakasugi
    • B29C59/02
    • B29C59/02B29C33/424G03F7/0002Y10T428/24488
    • According to one embodiment, a mold includes a base material, a pedestal portion and a pattern portion. The base material includes a first surface and a second surface. The pedestal portion protruded from the first surface of the base material and includes a side surface. The pattern portion is provided in the pedestal portion and includes an concave-convex pattern. The pedestal portion includes a first region and a second region. The first region is provided with the concave-convex pattern. The second region is provided between the first region and the side surface. The second region has maximum height equal to maximum height of the first region. The second region has a first height of the second region on the side surface side and a second height of the second region on the first region side. The first height is lower than the second height.
    • 根据一个实施例,模具包括基底材料,基座部分和图案部分。 基材包括第一表面和第二表面。 所述基座部从所述基材的第一表面突出并且包括侧面。 图案部分设置在基座部分中并且包括凹凸图案。 基座部分包括第一区域和第二区域。 第一区域设置有凹凸图案。 第二区域设置在第一区域和侧面之间。 第二区域具有等于第一区域的最大高度的最大高度。 所述第二区域具有在所述第一区域侧上的所述第二区域的侧表面侧的第一高度和所述第二区域的第二高度。 第一个高度低于第二个高度。
    • 10. 发明授权
    • Character pattern extracting method, charged particle beam drawing method, and character pattern extracting program
    • 字符图案提取方法,带电粒子束绘制方法和字符图案提取程序
    • US07889910B2
    • 2011-02-15
    • US11797531
    • 2007-05-04
    • Tetsuro NakasugiTakumi OtaTakeshi KoshibaNoriaki Sasaki
    • Tetsuro NakasugiTakumi OtaTakeshi KoshibaNoriaki Sasaki
    • G06K9/00
    • H01J37/3174B82Y10/00B82Y40/00
    • A character pattern extracting method includes ranking character patterns whose number is larger than a maximum number of character patterns in an aperture, depending on the number of reference times in design data of a semiconductor device, extracting first extraction patterns whose number is smaller than the maximum number from the large number of read character patterns in a descending order of the reference time number, defining character patterns except the first extraction patterns out of the larger number of character patterns as candidate patterns, selecting from the candidate patterns a plurality of candidate patterns whose number corresponds to a difference between the number of extracted patterns from the maximum number, and creating combinations of the selected candidate patterns, and extracting second extraction patterns included in a combination among the combinations of candidate patterns, in which a manufacturing time of the semiconductor device is most shortened.
    • 字符图案提取方法包括根据半导体器件的设计数据中的参考时间的数量来排列数量大于孔径中的最大字符图案数量的字符图案,提取数量小于最大值的第一提取图案 以大量的读取字符图案的数量以参考时间数字的降序排列,将除了较大数量的字符图案之外的第一提取模式除外的字符图案作为候选图案,从候选图案中选择多个候选图案, 数字对应于从最大数量提取的图案的数量之间的差异,以及创建所选择的候选图案的组合,以及提取包括在候选图案的组合中的组合中的第二提取图案,其中半导体器件的制造时间 最缩短。