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    • 5. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08542519B2
    • 2013-09-24
    • US13035168
    • 2011-02-25
    • Yoshiaki AsaoTakeshi KajiyamaKuniaki Sugiura
    • Yoshiaki AsaoTakeshi KajiyamaKuniaki Sugiura
    • G11C11/02
    • H01L29/82
    • According to one embodiment, a semiconductor memory device is disclosed. The device includes MOSFET1 and MOSFET2 arranged in a first direction, variable resistive element (hereafter R1) above MOSFET1 and MOSFET2, a lower end of the R1 being connected to drains of MOSFET1 and MOSFET2, MOSFET3 and MOSFET4 arranged in the first direction, variable resistive element (hereafter R2) above MOSFET3 and MOSFET4, and a lower end of the R2 being connected to drains of MOSFET3 and MOSFET4. The device further includes first wiring line extending in the first direction and connected to sources of MOSFET1 and MOSFET2, second wiring line extending in the first direction and connected to sources of MOSFET3 and MOSFET4, upper electrode connecting upper end of the R1 and upper end of the R2, and third wiring line extending in the first direction and connected to the upper electrode.
    • 根据一个实施例,公开了一种半导体存储器件。 该器件包括在第一方向上布置的MOSFET1和MOSFET2,MOSFET1和MOSFET2上方的可变电阻元件(以下称为R1),R1的下端连接到沿第一方向布置的MOSFET1和MOSFET2,MOSFET3和MOSFET4的漏极,可变电阻 元件(以下称为R2),MOSFET3和MOSFET4之上,R2的下端连接到MOSFET3和MOSFET4的漏极。 该器件还包括沿第一方向延伸并连接到MOSFET1和MOSFET2的源极的第一布线,第二布线沿第一方向延伸并连接到MOSFET3和MOSFET4的源极,上电极连接R1的上端和上端 R2和第三布线沿第一方向延伸并连接到上电极。
    • 6. 发明授权
    • Magnetoresistive memory and manufacturing method
    • 磁阻记忆及制造方法
    • US08829580B2
    • 2014-09-09
    • US12854724
    • 2010-08-11
    • Kuniaki SugiuraYoshiaki AsaoTakeshi Kajiyama
    • Kuniaki SugiuraYoshiaki AsaoTakeshi Kajiyama
    • H01L29/82
    • H01L27/228H01L43/08H01L43/12
    • According to one embodiment, a magnetoresistive memory includes first and second contact plugs in a first interlayer insulating film, a lower electrode on the first interlayer insulating film, a magnetoresistive effect element on the lower electrode, and an upper electrode on the magnetoresistive effect element. The lower electrode has a tapered cross-sectional shape in which a dimension of a bottom surface of the lower electrode is longer than a dimension of an upper surface of the lower electrode, one end of the lower electrode is in contact with an upper surface of the first contact plug. The magnetoresistive effect element is provided at a position shifted from a position immediately above the first contact plug in a direction parallel to a surface of the semiconductor substrate.
    • 根据一个实施例,磁阻存储器包括第一层间绝缘膜中的第一和第二接触插塞,第一层间绝缘膜上的下电极,下电极上的磁阻效应元件和磁阻效应元件上的上电极。 下电极具有锥形横截面形状,其中下电极的底表面的尺寸比下电极的上表面的尺寸长,下电极的一端与上电极的上表面接触 第一个接触插头。 磁阻效应元件设置在与第一接触插塞正上方的位置在平行于半导体衬底的表面的方向上偏移的位置处。