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    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110068404A1
    • 2011-03-24
    • US12726300
    • 2010-03-17
    • Kuniaki SUGIURATakeshi KAJIYAMAYoshiaki ASAO
    • Kuniaki SUGIURATakeshi KAJIYAMAYoshiaki ASAO
    • H01L29/78H01L21/336
    • H01L29/41791H01L29/66795H01L29/785H01L2029/7858
    • A semiconductor device includes a first semiconductor layer and a second semiconductor layer that have a form of fins and are arranged a predetermined distance apart from each other, in which a center portion of each serves as a channel region, and side portions sandwiching the center portion serve as source/drain regions, a gate electrode formed on two side surfaces of each of the channel regions of the first semiconductor layer and the second semiconductor layer, with a gate insulating film interposed therebetween, an insulating film formed to fill a gap between the source/drain regions of the first semiconductor layer and the source/drain regions of the second semiconductor layer, and silicide layers formed on side surfaces of the source/drain regions of the first semiconductor layer and the source/drain regions of the second semiconductor layer that are not covered by the insulating film.
    • 半导体器件包括第一半导体层和第二半导体层,该第一半导体层和第二半导体层具有散热片的形式并且彼此隔开预定距离,其中每个半导体层的中心部分用作沟道区域;以及侧部分夹着中心部分 作为源极/漏极区域,形成在第一半导体层和第二半导体层的每个沟道区域的两个侧面上的栅电极,隔着栅极绝缘膜,形成为填充第二半导体层之间的间隙的绝缘膜 第一半导体层的源极/漏极区域和第二半导体层的源极/漏极区域以及形成在第一半导体层的源极/漏极区域和第二半导体层的源极/漏极区域的侧表面上的硅化物层 不被绝缘膜覆盖。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20110215382A1
    • 2011-09-08
    • US13035168
    • 2011-02-25
    • Yoshiaki ASAOTakeshi KAJIYAMAKuniaki SUGIURA
    • Yoshiaki ASAOTakeshi KAJIYAMAKuniaki SUGIURA
    • H01L29/82
    • H01L29/82
    • According to one embodiment, a semiconductor memory device is disclosed. The device includes MOSFET1 and MOSFET2 arranged in a first direction, variable resistive element (hereafter R1) above MOSFET1 and MOSFET2, a lower end of the R1 being connected to drains of MOSFET1 and MOSFET2, MOSFET3 and MOSFET4 arranged in the first direction, variable resistive element (hereafter R2) above MOSFET3 and MOSFET4, and a lower end of the R2 being connected to drains of MOSFET3 and MOSFET4. The device further includes first wiring line extending in the first direction and connected to sources of MOSFET1 and MOSFET2, second wiring line extending in the first direction and connected to sources of MOSFET3 and MOSFET4, upper electrode connecting upper end of the R1 and upper end of the R2, and third wiring line extending in the first direction and connected to the upper electrode.
    • 根据一个实施例,公开了一种半导体存储器件。 该器件包括在第一方向上布置的MOSFET1和MOSFET2,MOSFET1和MOSFET2上方的可变电阻元件(以下称为R1),R1的下端连接到沿第一方向布置的MOSFET1和MOSFET2,MOSFET3和MOSFET4的漏极,可变电阻 元件(以下称为R2),MOSFET3和MOSFET4之上,R2的下端连接到MOSFET3和MOSFET4的漏极。 该器件还包括沿第一方向延伸并连接到MOSFET1和MOSFET2的源极的第一布线,第二布线沿第一方向延伸并连接到MOSFET3和MOSFET4的源极,上电极连接R1的上端和上端 R2和第三布线沿第一方向延伸并连接到上电极。
    • 6. 发明申请
    • MAGNETORESISTIVE MEMORY AND MANUFACTURING METHOD THEREOF
    • 磁性记忆及其制造方法
    • US20110037108A1
    • 2011-02-17
    • US12854724
    • 2010-08-11
    • Kuniaki SUGIURAYoshiaki ASAOTakeshi KAJIYAMA
    • Kuniaki SUGIURAYoshiaki ASAOTakeshi KAJIYAMA
    • H01L29/82H01L21/02
    • H01L27/228H01L43/08H01L43/12
    • According to one embodiment, a magnetoresistive memory includes first and second contact plugs in a first interlayer insulating film, a lower electrode on the first interlayer insulating film, a magnetoresistive effect element on the lower electrode, and an upper electrode on the magnetoresistive effect element. The lower electrode has a tapered cross-sectional shape in which a dimension of a bottom surface of the lower electrode is longer than a dimension of an upper surface of the lower electrode, one end of the lower electrode is in contact with an upper surface of the first contact plug. The magnetoresistive effect element is provided at a position shifted from a position immediately above the first contact plug in a direction parallel to a surface of the semiconductor substrate.
    • 根据一个实施例,磁阻存储器包括第一层间绝缘膜中的第一和第二接触插塞,第一层间绝缘膜上的下电极,下电极上的磁阻效应元件和磁阻效应元件上的上电极。 下电极具有锥形横截面形状,其中下电极的底表面的尺寸比下电极的上表面的尺寸长,下电极的一端与上电极的上表面接触 第一个接触插头。 磁阻效应元件设置在与第一接触插塞正上方的位置在平行于半导体衬底的表面的方向上偏移的位置处。
    • 7. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100193850A1
    • 2010-08-05
    • US12697912
    • 2010-02-01
    • Yoshiaki ASAOTakeshi KAJIYAMAMinoru AMANOYoshikuni TATEYAMAAtsushi SHIGETA
    • Yoshiaki ASAOTakeshi KAJIYAMAMinoru AMANOYoshikuni TATEYAMAAtsushi SHIGETA
    • H01L29/82
    • H01L27/228H01L27/105
    • First and second transistors are formed on a substrate. An interlayer insulating film is formed on the first transistor. A first contact is formed in the interlayer film on a source or a drain of the first transistor. A second contact is formed in the interlayer film on the other of the source or the drain. A first interconnect is formed on the first contact. A magnetoresistive element is formed on the second contact. The magnetoresistive element is arranged in a layer having a height equal to that of the first interconnect from a substrate surface. A third contact is formed in the interlayer film on a source or a drain of the second transistor. A second interconnect is formed on the third contact. The second interconnect is arranged in a layer having a height equal to those of the first interconnect and the magnetoresistive element from the substrate surface.
    • 第一和第二晶体管形成在衬底上。 在第一晶体管上形成层间绝缘膜。 在第一晶体管的源极或漏极上的层间膜中形成第一接触。 在源极或漏极中的另一个的层间膜中形成第二接触。 在第一接触件上形成第一互连。 在第二触点上形成磁阻元件。 磁阻元件从衬底表面布置成具有与第一互连的高度相同的高度的层。 在第二晶体管的源极或漏极上的层间膜中形成第三接触。 在第三触点上形成第二互连。 第二互连布置在具有与来自衬底表面的第一互连和磁阻元件的高度相同的高度的层中。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100103718A1
    • 2010-04-29
    • US12559335
    • 2009-09-14
    • Yoshiaki ASAOTakeshi KAJIYAMATsuneo INABA
    • Yoshiaki ASAOTakeshi KAJIYAMATsuneo INABA
    • G11C11/00G11C5/06G11C11/14
    • G11C11/1659
    • A semiconductor memory device includes first and second bit line provided in the same level layer above a semiconductor substrate, a first variable-resistance element disposed under the first bit line, having one terminal connected to one end of a current path of a first MOSFET, a second variable-resistance element disposed under the second bit line, and having one terminal connected to one end of a current path of a second MOSFET, a first interconnect layer connecting the first bit line to the other terminal of the first variable-resistance element, and connecting the first bit line to the other end of the current path of the second MOSFET, and a second interconnect layer connecting the second bit line to the other terminal of the second variable-resistance element, and connecting the second bit line to the other end of the current path of the first MOSFET.
    • 半导体存储器件包括设置在半导体衬底上的同一电平层中的第一和第二位线,设置在第一位线下方的第一可变电阻元件,其一端连接到第一MOSFET的电流通路的一端, 第二可变电阻元件,设置在第二位线下方,并且具有连接到第二MOSFET的电流通路的一端的一个端子,将第一位线连接到第一可变电阻元件的另一端子的第一互连层 并且将第一位线连接到第二MOSFET的电流路径的另一端,以及将第二位线连接到第二可变电阻元件的另一端的第二互连层,并将第二位线连接到第二位线 第一个MOSFET的电流通路的另一端。