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    • 7. 发明授权
    • Method of manufacturing a BiMOS device
    • 制造BiMOS器件的方法
    • US5340751A
    • 1994-08-23
    • US793540
    • 1991-11-18
    • Takeo MaedaHiroshi Momose
    • Takeo MaedaHiroshi Momose
    • H01L21/285H01L21/331H01L21/8249H01L2/265
    • H01L29/66272H01L21/28525H01L21/8249Y10S148/009
    • A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a gate and/or drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
    • 一种制造半导体器件的方法。 制备半导体衬底,并且在半导体衬底的表面上形成栅极氧化膜。 选择性地去除栅极氧化膜以暴露半导体衬底的部分,并且在所得半导体结构上形成第一多晶硅层。 将杂质注入多晶硅层,并将所得半导体结构退火以活化杂质。 图案化第一多晶硅层以形成双极晶体管的基极和MOS晶体管的栅极和/或漏电极。 然后在所得半导体结构上形成绝缘层。 然后选择性地暴露半导体衬底的部分,并且在所得半导体结构上形成第二多晶硅层。 然后将第二多晶硅层图案化以形成双极晶体管的发射极。
    • 8. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US5091322A
    • 1992-02-25
    • US572136
    • 1990-08-22
    • Takeo MaedaHiroshi Momose
    • Takeo MaedaHiroshi Momose
    • H01L29/73H01L21/285H01L21/331H01L21/8249H01L27/06H01L29/732
    • H01L29/66272H01L21/28525H01L21/8249Y10S148/009
    • A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a gate and/or drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
    • 一种制造半导体器件的方法。 制备半导体衬底,并且在半导体衬底的表面上形成栅极氧化膜。 选择性地去除栅极氧化膜以暴露半导体衬底的部分,并且在所得半导体结构上形成第一多晶硅层。 将杂质注入多晶硅层,并将所得半导体结构退火以活化杂质。 图案化第一多晶硅层以形成双极晶体管的基极和MOS晶体管的栅极和/或漏电极。 然后在所得半导体结构上形成绝缘层。 然后选择性地暴露半导体衬底的部分,并且在所得半导体结构上形成第二多晶硅层。 然后将第二多晶硅层图案化以形成双极晶体管的发射极。
    • 9. 发明授权
    • Method of manufacturing a BiMOS device
    • 制造BiMOS器件的方法
    • US5523242A
    • 1996-06-04
    • US243919
    • 1994-05-17
    • Takeo MaedaHiroshi Momose
    • Takeo MaedaHiroshi Momose
    • H01L21/285H01L21/331H01L21/8249H01L21/265
    • H01L29/66272H01L21/28525H01L21/8249Y10S148/009
    • A method of manufacturing a semiconductor device. A semiconductor substrate is prepared and a gate oxide film is formed on a surface of the semiconductor substrate. The gate oxide film is selectively removed to expose portions of the semiconductor substrate and a first polysilicon layer is formed on a resultant semiconductor structure. Impurities are implanted in the polysilicon layer and a resultant semiconductor structure is annealed to activate the impurities. The first polysilicon layer is patterned to form a base electrode of the bipolar transistor and a source drain electrode of the MOS transistor. An insulating layer is then formed on a resultant semiconductor structure. Portions of the semiconductor substrate are then selectively exposed and a second polysilicon layer is formed on a resultant semiconductor structure. The second polysilicon layer is then patterned to form an emitter electrode of the bipolar transistor.
    • 一种制造半导体器件的方法。 制备半导体衬底,并且在半导体衬底的表面上形成栅极氧化膜。 选择性地去除栅极氧化膜以暴露半导体衬底的部分,并且在所得半导体结构上形成第一多晶硅层。 将杂质注入多晶硅层,并将所得半导体结构退火以活化杂质。 图案化第一多晶硅层以形成双极晶体管的基极和MOS晶体管的源极漏极。 然后在所得半导体结构上形成绝缘层。 然后选择性地暴露半导体衬底的部分,并且在所得半导体结构上形成第二多晶硅层。 然后将第二多晶硅层图案化以形成双极晶体管的发射极。