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    • 9. 发明授权
    • Nonvolatile memory element comprising a resistance variable element and a diode
    • 非易失性存储元件包括电阻可变元件和二极管
    • US08796660B2
    • 2014-08-05
    • US12375881
    • 2007-09-21
    • Takeshi TakagiTakumi Mikawa
    • Takeshi TakagiTakumi Mikawa
    • H01L29/02H01L47/00H01L29/04H01L29/06H01L29/08H01L31/0352H01L45/00H01L27/24H01L27/10H01L21/00G11C11/00
    • H01L45/04H01L27/101H01L27/2409H01L27/2418H01L27/2463H01L45/1233H01L45/1273H01L45/146H01L45/1683
    • A nonvolatile memory element (20) of the present invention comprises a resistance variable element (14) and a diode (18) which are formed on a substrate (10) such that the resistance variable element (14) has a resistance variable layer (11) sandwiched between a lower electrode (12) and an upper electrode (13), and the diode (18) which is connected in series with the resistance variable element (14) in the laminating direction and has an insulating layer or semiconductor layer (15) sandwiched between a first electrode (16) at the lower side and a second electrode (17) at the upper side. The resistance variable layer (11) is embedded in a first contact hole (21) formed on the lower electrode (12). A first area (22) where insulating layer or semiconductor layer (15) of the diode (18) is in contact with a first electrode (16) of the diode (18) is larger than at least one of a second area (23) where the resistance variable layer (11) is in contact with the upper electrode (13) and a third area (24) where the resistance variable layer (11) is in contact with the lower electrode (12).
    • 本发明的非易失性存储元件(20)包括形成在基板(10)上的电阻可变元件(14)和二极管(18),使得电阻可变元件(14)具有电阻变化层(11 )和位于下电极(12)和上电极(13)之间的二极管(18),以及与电阻可变元件(14)在层叠方向上串联连接并具有绝缘层或半导体层(15)的二极管 )夹在下侧的第一电极(16)和上侧的第二电极(17)之间。 电阻变化层(11)嵌入形成在下电极(12)上的第一接触孔(21)中。 二极管(18)的绝缘层或半导体层(15)与二极管(18)的第一电极(16)接触的第一区域(22)大于第二区域(23)中的至少一个, 其中电阻变化层(11)与上电极(13)接触,电阻变化层(11)与下电极(12)接触的第三区域(24)。
    • 10. 发明授权
    • Nonvolatile semiconductor memory apparatus and manufacturing method thereof
    • 非易失性半导体存储装置及其制造方法
    • US08258493B2
    • 2012-09-04
    • US12515379
    • 2007-11-13
    • Takumi MikawaTakeshi Takagi
    • Takumi MikawaTakeshi Takagi
    • H01L29/00
    • H01L27/101G11C13/0007G11C2213/32G11C2213/72G11C2213/73H01L27/0688H01L27/112H01L27/115H01L27/2409H01L27/2418H01L27/2463H01L27/2481H01L45/04H01L45/1233H01L45/146H01L45/1683
    • A nonvolatile semiconductor memory apparatus (10) of the present invention comprises a substrate (10), lower-layer electrode wires (15) provided on the substrate (11), an interlayer insulating layer (16) which is disposed on the substrate (11) including the lower-layer electrode wires (15) and is provided with contact holes at locations respectively opposite to the lower-layer electrode wires (15), resistance variable layers (18) which are respectively connected to the lower-layer electrode wires (15); and non-ohmic devices (20) which are respectively provided on the resistance variable layers (18) such that the non-ohmic devices are respectively connected to the resistance variable layers (18). The non-ohmic devices (20) each has a laminated-layer structure including plural semiconductor layers, a laminated-layer structure including a metal electrode layer and an insulator layer, or a laminated-layer structure including a metal electrode layer and a semiconductor layer. One layer of the laminated-layer structure is embedded to fill each of the contact holes and the semiconductor layer or the insulator layer which is the other layer of the laminated-layer structure has a larger area than an opening of each of the contact holes and is provided on the interlayer insulating layer (16).
    • 本发明的非易失性半导体存储装置(10)具备基板(10),设置在基板(11)上的下层电极布线(15),设置在基板(11)上的层间绝缘层(16) ),并且在分别与下层电极线(15)相对的位置设置接触孔,电阻变化层(18)分别与下层电极线(15)连接 15); 和非欧姆器件(20),其分别设置在电阻变化层(18)上,使得非欧姆器件分别连接到电阻变化层(18)。 非欧姆装置(20)各自具有包括多个半导体层的层叠层结构,包括金属电极层和绝缘体层的层叠层结构,或者包括金属电极层和半导体层的层叠层结构 。 嵌入层叠层结构的一层以填充每个接触孔,作为层叠层结构的另一层的半导体层或绝缘体层的面积比每个接触孔的开口大, 设置在层间绝缘层(16)上。