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1. 发明授权

US07171973B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07171973B2
公开(公告)日：2007-02-06
申请号：US10195453
申请日：2002-07-16
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： B08B3/02
CPC分类号： H01L21/67051 , C03C23/0075 , H01L21/67028 , H01L21/67178 , Y10S134/901 , Y10S134/902
摘要： The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
摘要翻译：衬底处理设备具有包围衬底支撑构件以限定处理空间的封闭结构。外壳结构具有由快门关闭的开口。供给处理流体（如化学液体）的处理流体供应单元容纳在壳体中。容纳在壳体中的处理流体供应单元通过外壳结构的打开而进入处理空间，以将处理流体供给到由基板支撑构件支撑的基板上。

2. 发明授权

US07543593B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07543593B2
公开(公告)日：2009-06-09
申请号：US11356364
申请日：2006-02-17
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： C25F1/00 , C25F3/30 , C25F5/00
CPC分类号： H01L21/6708 , B08B3/02
摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
摘要翻译：提供了一种基板处理装置。该装置包括用于供应不同加工流体的多个流体供应器61,61,63。在处理晶片W时，基板处理装置沿着晶片W的周边部分相对移动流体供给部61,62,63。流体供应部61,62,63沿着从晶片W的圆周向内延伸的方向配置。通过这种布置，尽管晶片W以低速旋转，该装置能够稳定地处理晶片W. 此外，可以提高抗蚀剂处理中的装置的生产量。

3. 发明申请

US20060130968A1 Substrate processing apparatus 有权
公开(公告)号：US20060130968A1
公开(公告)日：2006-06-22
申请号：US11356364
申请日：2006-02-17
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： H01L21/306
CPC分类号： H01L21/6708 , B08B3/02
摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

4. 发明授权

US07862680B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07862680B2
公开(公告)日：2011-01-04
申请号：US12149829
申请日：2008-05-08
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： H01L21/027 , H01L21/304 , B08B3/02
CPC分类号： H01L21/6708 , B08B3/02
摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
摘要翻译：提供了一种基板处理装置。该装置包括用于供应不同加工流体的多个流体供应器61,61,63。在处理晶片W时，基板处理装置沿着晶片W的周边部分相对移动流体供给部61,62,63。流体供应部61,62,63沿着从晶片W的圆周向内延伸的方向配置。通过这种布置，尽管晶片W以低速旋转，该装置能够稳定地处理晶片W. 此外，可以提高抗蚀剂处理中的装置的生产量。

5. 发明申请

US20080210278A1 Substrate processing apparatus 有权
公开(公告)号：US20080210278A1
公开(公告)日：2008-09-04
申请号：US12149829
申请日：2008-05-08
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： B08B3/00
CPC分类号： H01L21/6708 , B08B3/02
摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

6. 发明授权

US07332055B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07332055B2
公开(公告)日：2008-02-19
申请号：US10209617
申请日：2002-08-01
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01L21/6708 , B08B3/02
摘要： A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
摘要翻译：提供了一种基板处理装置。该装置包括用于供应不同加工流体的多个流体供应器61,61,63。在处理晶片W时，基板处理装置沿着晶片W的周边部分相对移动流体供给部61,62,63。流体供应部61,62,63沿着从晶片W的圆周向内延伸的方向配置。通过这种布置，尽管晶片W以低速旋转，该装置能够稳定地处理晶片W. 此外，可以提高抗蚀剂处理中的装置的生产量。

7. 发明申请

US20070105380A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20070105380A1
公开(公告)日：2007-05-10
申请号：US11616138
申请日：2006-12-26
申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
发明人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
IPC分类号： H01L21/302
CPC分类号： H01L21/67051 , C03C23/0075 , H01L21/67028 , H01L21/67178 , Y10S134/901 , Y10S134/902
摘要： The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

8. 发明授权

US07404407B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US07404407B2
公开(公告)日：2008-07-29
申请号：US11616075
申请日：2006-12-26
申请人： Takehiko Orii , Osamu Kuroda
发明人： Takehiko Orii , Osamu Kuroda
IPC分类号： B08B3/02
CPC分类号： H01L21/67051 , C03C23/0075 , H01L21/67028 , H01L21/67178 , Y10S134/901 , Y10S134/902
摘要： The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
摘要翻译：衬底处理设备具有包围衬底支撑构件以限定处理空间的封闭结构。外壳结构具有由快门关闭的开口。供给处理流体（如化学液体）的处理流体供应单元容纳在壳体中。容纳在壳体中的处理流体供应单元通过外壳结构的打开而进入处理空间，以将处理流体供给到由基板支撑构件支撑的基板上。

9. 发明申请

US20070105379A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20070105379A1
公开(公告)日：2007-05-10
申请号：US11616075
申请日：2006-12-26
申请人： Takehiko Orii , Osamu Kuroda
发明人： Takehiko Orii , Osamu Kuroda
IPC分类号： H01L21/302
CPC分类号： H01L21/67051 , C03C23/0075 , H01L21/67028 , H01L21/67178 , Y10S134/901 , Y10S134/902
摘要： The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
摘要翻译：衬底处理设备具有包围衬底支撑构件以限定处理空间的封闭结构。外壳结构具有由快门关闭的开口。供给处理流体（如化学液体）的处理流体供应单元容纳在壳体中。容纳在壳体中的处理流体供应单元通过外壳结构的打开而进入处理空间，以将处理流体供给到由基板支撑构件支撑的基板上。

10. 发明授权

US08651121B2 Substrate processing apparatus, substrate processing method, and storage medium 有权
标题翻译：基板处理装置，基板处理方法和存储介质
公开(公告)号：US08651121B2
公开(公告)日：2014-02-18
申请号：US12372265
申请日：2009-02-17
申请人： Takehiko Orii , Kenji Sekiguchi
发明人： Takehiko Orii , Kenji Sekiguchi
IPC分类号： B08B3/00
CPC分类号： H01L21/02052 , H01L21/67028 , H01L21/67034
摘要： A substrate processing apparatus includes a chamber configured to dispose a substrate to be processed with a substrate holder, a spin chuck to rotate the substrate, a gas discharging head configured to discharge a dehumidified gas to the substrate, a processing liquid supply nozzle, an IPA supply nozzle, and a driving device configured to move the gas discharging head between a retreat position of an upper part of the chamber and an approach position near the substrate. In particular, the gas discharging head is positioned at the approach position when the IPA is supplied to the substrate so that the dehumidified gas is supplied from the gas discharging head to the substrate when the IPA is supplied to the substrate.
摘要翻译：一种基板处理装置，包括：配置成用基板保持件配置被处理基板的室，旋转基板的旋转卡盘，将排出除湿气体排出到基板的排气头，处理液供给喷嘴，IPA 供给喷嘴和驱动装置，该驱动装置构造成使所述气体排出头在所述室的上部的后退位置和所述基板附近的接近位置之间移动。特别地，当将IPA提供给基板时，气体放电头位于接近位置，使得当将IPA供给到基板时，将除气从气体排出头供应到基板。

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