专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06617678B2 Semiconductor device 失效
公开(公告)号：US06617678B2
公开(公告)日：2003-09-09
申请号：US10145722
申请日：2002-05-16
申请人： Takashi Yamazaki , Mitsuyoshi Endo , Chiaki Takubo , Katsuhiko Oyama , Takashi Imoto , Mikio Matsui
发明人： Takashi Yamazaki , Mitsuyoshi Endo , Chiaki Takubo , Katsuhiko Oyama , Takashi Imoto , Mikio Matsui
IPC分类号： H01L2302
CPC分类号： H01L25/0657 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01039 , H01L2924/01078 , H01L2924/01079 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is disclosed a semiconductor device which comprises a first chip-mounting substrate on which at least one semiconductor chip having a plurality of terminals is mounted, and a plurality of relay terminals electrically connected to the respective terminals of the semiconductor chip are disposed to surround a portion with the semiconductor chip mounted thereon from the outside in the vicinity of the portion, a second chip-mounting substrate which is laminated on the first chip-mounting substrate and on which at least one semiconductor chip is mounted, a plurality of relay terminals electrically connected to the respective terminals of the semiconductor chip are disposed to surround a portion with the semiconductor chip mounted thereon from the outside in the vicinity of the portion, and at least one of the semiconductor chips has a center offset from a center of a whole arrangement of the relay terminals.

2. 发明授权

US06861738B2 Laminated-chip semiconductor device 失效
标题翻译：层压半导体器件
公开(公告)号：US06861738B2
公开(公告)日：2005-03-01
申请号：US10156819
申请日：2002-05-30
申请人： Katsuhiko Oyama , Mitsuyoshi Endo , Chiaki Takubo , Takashi Yamazaki , Takashi Imoto
发明人： Katsuhiko Oyama , Mitsuyoshi Endo , Chiaki Takubo , Takashi Yamazaki , Takashi Imoto
IPC分类号： H01L25/18 , H01L23/50 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/10 , H01L23/02
CPC分类号： H01L23/5382 , H01L25/0657 , H01L25/105 , H01L2224/16
摘要： There is disclosed a laminated-chip semiconductor device which comprises two chip-mounting substrates on each of which at least one semiconductor chip having a plurality of terminals for signals is mounted, and a plurality of chip connecting wirings electrically connected to the terminals for signals of the each semiconductor chip which are mounted on the chip-mounting substrates are formed in a same pattern, and which are laminated along a thickness direction, and one intermediate substrate which is arranged between the two chip-mounting substrates, and in which a plurality of interlayer connecting wirings electrically connected to each of the plurality of chip connecting wirings of the adjacent chip-mounting substrate are formed in a predetermined wiring pattern.
摘要翻译：公开了一种层叠芯片半导体器件，其包括两个芯片安装基板，每个芯片安装基板上安装有至少一个具有多个用于信号的端子的半导体芯片，以及电连接到端子的多个芯片连接布线，安装在芯片安装基板上的每个半导体芯片以相同的图案形成，并且沿着厚度方向层叠，并且一个中间基板被布置在两个芯片安装基板之间，并且其中多个电连接到相邻芯片安装基板的多个芯片连接布线中的每一个的层间连接布线以预定布线图形形成。

3. 发明申请

US20060270118A1 Surface mount type semiconductor device and method of manufacturing the same 审中-公开
标题翻译：表面贴装型半导体器件及其制造方法
公开(公告)号：US20060270118A1
公开(公告)日：2006-11-30
申请号：US11442996
申请日：2006-05-31
申请人： Hiroyuki Okura , Tetsuya Sato , Takashi Imoto , Katsuhiko Oyama
发明人： Hiroyuki Okura , Tetsuya Sato , Takashi Imoto , Katsuhiko Oyama
IPC分类号： H01L21/00 , H01L23/48
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/13 , H01L23/3135 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/05647 , H01L2224/06136 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48647 , H01L2224/73215 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element including electrode pads at least a central part thereof, the semiconductor element being mounted on the first surface such that the electrode pads are located within the slit, a width of the semiconductor element is less than a longitudinal length of the slit and both ends of the slit are located outside end portions of the semiconductor element, metal fine wires for electrically connecting the electrode pads to the connection terminals on the second surface, a first seal resin member provided to seal the semiconductor element on the first surface, and a second seal resin member provided to seal the slit on the second surface.
摘要翻译：表面安装型半导体器件包括具有相互相对的第一和第二表面并且在其中心部分具有狭缝的支撑衬底，半导体元件至少包括其中心部分的电极焊盘，半导体元件安装在第一表面上使得电极焊盘位于狭缝内，半导体元件的宽度小于狭缝的纵向长度，狭缝的两端位于半导体元件的外侧端部，用于电连接电极的金属细线衬垫连接到第二表面上的连接端子，设置用于密封第一表面上的半导体元件的第一密封树脂构件和设置成密封第二表面上的狭缝的第二密封树脂构件。

4. 发明申请

US20070238062A1 Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus 审中-公开
标题翻译：垂直式热处理装置及垂直式热处理装置中传送机构的控制方法
公开(公告)号：US20070238062A1
公开(公告)日：2007-10-11
申请号：US11723392
申请日：2007-03-19
申请人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
发明人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
IPC分类号： F27D5/00
CPC分类号： F27D3/0084 , F27B17/0025 , H01L21/67265 , H01L21/67288 , H01L21/67781 , H01L21/68707
摘要： The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor an encoder value outputted from an encoder of the pitch-change driving part during an operation of the to-and-fro driving part of the substrate supporter; and the controller is adapted to judge upon a change of the encoder value that the transfer mechanism is abnormally driven, and then is adapted to stop the drive of the transfer mechanism.
摘要翻译：本发明是一种立式热处理装置，包括：加热炉; 能够被加载到热处理炉中并从其中卸载的保持器，其中以等级方式在其中以预定的垂直间隔保持多个要处理的物体; 包括能够垂直移动和旋转的基台的传送机构和能够在基台上水平移动的基板支撑件; 以及用于控制所述传送机构的控制器; 其中所述传送机构适于在预定间隔内容纳要处理的多个物体的容器和所述保持器之间传送待加工物体; 衬底支撑件包括用于在水平方向上驱动衬底支撑件的来回驱动部分和用于改变支撑待处理对象的间距的音调变化驱动部分; 控制器适于在衬底支撑件的来回驱动部分的操作期间监视从变桨驱动部分的编码器输出的编码器值; 并且所述控制器适于根据所述编码器值改变所述传送机构异常驱动，然后适于停止所述传送机构的驱动。

5. 发明授权

US07205670B2 Semiconductor device and manufacturing method therefor 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US07205670B2
公开(公告)日：2007-04-17
申请号：US10649940
申请日：2003-08-28
申请人： Katsuhiko Oyama
发明人： Katsuhiko Oyama
IPC分类号： H01L23/48 , H01L23/52 , H01L23/29 , H01L23/02 , H01L29/40
CPC分类号： H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2225/06524 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2224/05599
摘要： A semiconductor device is disclosed which comprises a plurality of semiconductor chips having a plurality of terminals, two chip mounting bases on each of which at least one of the semiconductor chips is mounted and a plurality of chip interconnections electrically connected to the terminals of the mounted semiconductor chip are formed into substantially the same pattern and which are stacked in two layers, one interconnection base which is interposed between the two chip mounting bases and on which a plurality of intermediate interconnections electrically connected to the chip interconnections are formed into a pattern different from the pattern of the chip interconnections, and a plurality of interlevel interconnections which are formed in a plurality of through holes extending through the chip mounting bases and the interconnection base at once along a stacking direction and electrically connect the chip interconnections and the intermediate interconnections.
摘要翻译：公开了一种半导体器件，其包括具有多个端子的多个半导体芯片，其上安装有至少一个半导体芯片的两个芯片安装基座以及电连接到所安装的半导体的端子的多个芯片互连芯片形成为基本相同的图案并且堆叠成两层，一个互连基座，其插入在两个芯片安装基座之间，并且其上电连接到芯片互连件的多个中间互连形成为不同于芯片互连的图案，以及多个层间互连，其形成在沿堆叠方向一次延伸穿过芯片安装基座和互连基座的多个通孔中并且电连接芯片互连和中间互连。

6. 发明申请

US20070248439A1 Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus 有权
标题翻译：垂直式热处理装置及垂直式热处理装置中传送机构的控制方法
公开(公告)号：US20070248439A1
公开(公告)日：2007-10-25
申请号：US11723399
申请日：2007-03-19
申请人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
发明人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
IPC分类号： H01L21/677
CPC分类号： H01L21/67098 , H01L21/67766 , H01L21/67781 , H01L21/68707
摘要： The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor at least one information of position, velocity and current fed back to a motor for driving the transfer mechanism; and the controller is adapted to judge, by comparing the monitored information with predetermined information corresponding to a normal drive, that the transfer mechanism is abnormally driven, and then is adapted to stop the drive of the transfer mechanism.
摘要翻译：本发明是一种立式热处理装置，包括：加热炉; 能够被加载到热处理炉中并从其中卸载的保持器，其中以等级方式在其中以预定的垂直间隔保持多个要处理的物体; 包括能够垂直移动和旋转的基台的传送机构和能够在基台上水平移动的基板支撑件; 以及用于控制所述传送机构的控制器; 其中所述传送机构适于在预定间隔内容纳要处理的多个物体的容器和所述保持器之间传送待加工物体; 衬底支撑件包括用于在水平方向上驱动衬底支撑件的来回驱动部分和用于改变支撑待处理对象的间距的音调变化驱动部分; 控制器适于监视反馈到电动机的位置，速度和电流的至少一个信息，以驱动传送机构; 并且所述控制器适于通过将所监视的信息与对应于正常驱动的预定信息进行比较来判断所述传送机构异常驱动，然后适于停止所述传送机构的驱动。

7. 发明申请

US20050173358A1 Receiving container body for object to be processed 失效
标题翻译：接收被处理物体的容器体
公开(公告)号：US20050173358A1
公开(公告)日：2005-08-11
申请号：US10516511
申请日：2003-05-26
申请人： Katsuhiko Oyama
发明人： Katsuhiko Oyama
IPC分类号： B65D85/86 , B65G49/00 , B65G49/07 , H01L21/673 , H01L21/677 , A47G19/08
CPC分类号： H01L21/67369 , H01L21/67373 , H01L21/67379 , Y10S414/14
摘要： The present invention includes: a box case having a size capable of containing an open type of cassette that can hold a plurality of first objects to be processed and capable of containing a plurality of second objects to be processed, the second objects to be processed being larger than the first objects to be processed; a supporting part provided at an inside wall surface of the box case, the supporting part being capable of supporting the second objects to be processed in a tier-like manner; an open-close lid provided at an opening part of the box case in a removable and attachable manner; and a positioning-engaging part provided at a bottom part of the box case in a removable and attachable manner. The open-close lid is capable of sealing the box case. The positioning-engaging part is capable of engaging with a positioning part provided at a lower surface of a bottom part of the cassette to position the cassette.
摘要翻译：本发明包括：具有能够容纳能够容纳待处理的多个第一待处理对象的能够容纳多个待处理对象的开放式盒的大小的箱体，第二待处理对象为大于第一个要处理的物体; 支撑部，其设置在所述盒壳体的内壁面上，所述支撑部能够以层状的方式支撑待处理的第二物体; 以可拆卸和可附接的方式设置在箱壳的开口部分处的开闭盖; 以及以可拆卸和可附接的方式设置在箱体的底部的定位接合部。打开的盖子能够密封箱体。定位接合部能够与设置在盒的底部的下表面处的定位部分接合以定位盒。

8. 发明授权

US5677246A Method of manufacturing semiconductor devices 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US5677246A
公开(公告)日：1997-10-14
申请号：US575046
申请日：1995-11-28
申请人： Hideaki Maeta , Katsuhiko Oyama , Hiroshi Iwasaki , Yumiko Ohshima , Takahito Nakazawa
发明人： Hideaki Maeta , Katsuhiko Oyama , Hiroshi Iwasaki , Yumiko Ohshima , Takahito Nakazawa
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L21/561 , H01L21/563 , H01L24/29 , H01L24/743 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2224/92225 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/14
摘要： In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented. The disclosed manufacturing method comprises the step of using a guide plate for pouring resin and bringing one end of the guide plate into contact with one face end of a substrate or with a portion of one major surface near at least one side face of a chip in filling sealing resin between the chip and the substrate after the semiconductor chip has been mounted, with the face down, on one major surface of a wiring substrate having the wiring containing a connection section, the step of inclining the guide plate so that the guide plate may meet one major surface of the substrate at a specified angle, when or after one end of the guide plate is brought into contact with the substrate, and the step of supplying the resin to the opening between the chip and the substrate by supplying the resin onto the top surface of the guide plate and allowing the resin to flow over the top surface of the guide plate.
摘要翻译：在所公开的制造具有单侧树脂密封封装结构的半导体器件的方法中，当树脂填充到芯片和基板之间时，封装的精加工尺寸的变化或外观上的缺陷的发生包装被阻止。所公开的制造方法包括以下步骤：使用用于浇注树脂的引导板，并且使引导板的一端与基板的一个面端部或与芯片的至少一个侧面附近的一个主表面的一部分接触在半导体芯片已经被安装在芯片和基板之后，在具有包括连接部分的布线的布线基板的一个主表面上，将芯片和基板之间填充密封树脂，使引导板倾斜的步骤当引导板的一端与基板接触时或之后，可以以特定的角度与基板的一个主表面相遇，以及通过供给树脂将树脂供给到芯片和基板之间的开口的步骤在引导板的顶表面上并允许树脂流过导向板的顶表面。

9. 发明授权

US08338287B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08338287B2
公开(公告)日：2012-12-25
申请号：US13030356
申请日：2011-02-18
申请人： Masayuki Miura , Katsuhiko Oyama
发明人： Masayuki Miura , Katsuhiko Oyama
IPC分类号： H01L21/00
CPC分类号： B23K1/0016 , B23K35/262 , B23K2101/40 , H01L21/563 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05655 , H01L2224/05664 , H01L2224/11334 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81024 , H01L2224/81191 , H01L2224/81411 , H01L2224/831 , H01L2224/8385 , H01L2224/83855 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H01L2924/35121 , H01L2924/3651 , H05K3/3436 , H05K3/3463 , H05K2201/0341 , H05K2201/10674 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2224/81805 , H01L2924/00012
摘要： In one embodiment, a preliminary solder layer made of a Sn alloy is formed on a connecting pad of a wiring substrate. A solder bump made of a Sn alloy is formed on an electrode pad of a semiconductor chip. After contacting the preliminary solder layer and the solder bump, the preliminary solder layer and the solder bump are melted by heating to a temperature of their melting points or higher to form a solder connecting part made of a Sn alloy containing Ag and Cu. Only the preliminary solder layer of the preliminary solder layer and the solder bump is composed of a Sn alloy containing Ag.
摘要翻译：在一个实施例中，在布线基板的连接焊盘上形成由Sn合金制成的预备焊料层。在半导体芯片的电极焊盘上形成由Sn合金构成的焊料凸块。在与预焊接层和焊料凸块接触之后，通过加热到预熔焊料层和焊料凸块的熔点以上，形成由含有Ag和Cu的Sn合金构成的焊料连接部。只有预焊料层和焊料凸块的初步焊料层由含有Ag的Sn合金组成。

10. 发明申请

US20120230808A1 SUBSTRATE TRANSPORT APPARATUS, SUBSTRATE TRANSPORT METHOD, AND RECORDING MEDIUM 有权
标题翻译：基板运输装置，基板运输方法和记录介质
公开(公告)号：US20120230808A1
公开(公告)日：2012-09-13
申请号：US13410447
申请日：2012-03-02
申请人： Katsuhiko Oyama , Yasushi Takeuchi
发明人： Katsuhiko Oyama , Yasushi Takeuchi
IPC分类号： B05C13/00 , C23C16/44
CPC分类号： H01L21/67742 , C23C16/4583 , H01L21/67303 , H01L21/67309 , H01L21/67757 , H01L21/67766 , H01L21/67781 , H01L21/68707
摘要： A substrate transport apparatus includes a first fork which is disposed to be movable in a forward/backward direction to a substrate holding part to transport a stacked member to or receive the stacked member from the substrate holding part. A second fork is arranged to be reversible and disposed above the first fork to be movable in a forward/backward direction to an accommodating part that accommodates substrates and spacer members to transport a substrate or a spacer member between the accommodating part and the first fork. A first grip module is disposed on a first surface of the second fork to hold and support the substrate from an upward direction. A second grip module is disposed on the first surface of the second fork on the same side as the first grip module to hold and support the spacer member from an upward direction.
摘要翻译：一种基板输送装置，包括：第一叉，其设置成能够向前/后方向移动到基板保持部，以将堆叠构件从基板保持部输送到或接收所述堆叠构件。第二叉被布置为可逆的并且设置在第一叉上方，以可向前/向后方向移动到容纳部分的容纳部分，以容纳衬底和间隔构件，以将基片或间隔构件输送在容纳部分和第一叉之间。第一夹持模块设置在第二叉的第一表面上，以从上方保持和支撑基板。第二夹持模块设置在与第一夹持模块相同侧的第二叉的第一表面上，以从上方保持并支撑间隔构件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式