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1. 发明授权

US08423175B2 Thermal processing apparatus, thermal processing method, and storage medium 有权
公开(公告)号：US08423175B2
公开(公告)日：2013-04-16
申请号：US12548873
申请日：2009-08-27
申请人： Yo Abe , Kiichi Takahashi , Junya Sato , Yoshinobu Motodate
发明人： Yo Abe , Kiichi Takahashi , Junya Sato , Yoshinobu Motodate
IPC分类号： G06F7/00
CPC分类号： H01L21/67098 , H01L21/67109 , H01L21/67766 , H01L21/67781
摘要： When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.

2. 发明授权

US08231381B2 Processing system for process object and thermal processing method for process object 有权
标题翻译：过程对象处理系统和过程对象的热处理方法
公开(公告)号：US08231381B2
公开(公告)日：2012-07-31
申请号：US12285320
申请日：2008-10-01
申请人： Katsuyuki Hishiya , Kiichi Takahashi
发明人： Katsuyuki Hishiya , Kiichi Takahashi
IPC分类号： F27D5/00
CPC分类号： H01L21/67248 , H01L21/67109 , H01L21/67276 , H01L21/67754 , H01L21/67766 , Y10S414/138
摘要： To provide a processing system for a process object capable of preventing a transport arm mechanism from being thermally damaged, so as to effectively perform a transport operation of the process object. A processing system 2, which takes out a process object W from a storage box 6 for process object, and thermally process the process object, includes: a vertical processing unit 24; a process-object transport area 10 disposed below the processing unit; a plurality of process-object boats 20 configured to hold the process objects; a boat elevating means 68 configured to vertically move the process-object boat 20; a boat table for transport 52, on which the process-object boat can be placed; and a transport arm mechanism configured to transport the process objects between the storage box 6 and the process-object boat 20 placed on the boat table for transport 52. The transport arm mechanism 56 is vertically moved by an arm elevating means 58. A temperature measuring means 86 is disposed in an upper part in the process-object transport area. The transport arm mechanism 58 and the arm elevating means 58 are controlled by a transport control part 88 based on a measured value of the temperature measuring means 86, so that a transport operation of the transport arm mechanism is controlled.
摘要翻译：为了提供一种能够防止运输臂机构受热损伤的加工对象的处理系统，以有效地进行加工对象的搬运动作。处理系统2从处理对象的存储箱6取出处理对象W，并对处理对象进行热处理，包括：垂直处理单元24; 布置在处理单元下方的处理对象传送区域10; 配置成保持处理对象的多个处理对象船20; 构造成垂直移动处理对象船20的船升降装置68; 运输船52，可以放置过程对象船; 以及运送臂机构，其构造成在放置在船台上的储存箱6和处理对象船20之间输送处理物体以进行运输52.运送臂机构56通过臂提升装置58垂直移动。温度测量装置86设置在处理对象传送区域的上部。输送臂机构58和臂升降装置58由运送控制部88基于温度测量装置86的测量值进行控制，从而控制输送臂机构的输送动作。

3. 发明授权

US07905700B2 Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus 有权
标题翻译：垂直式热处理装置及垂直式热处理装置中传送机构的控制方法
公开(公告)号：US07905700B2
公开(公告)日：2011-03-15
申请号：US11723399
申请日：2007-03-19
申请人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
发明人： Satoshi Asari , Kiichi Takahashi , Katsuhiko Oyama
IPC分类号： H01L21/00
CPC分类号： H01L21/67098 , H01L21/67766 , H01L21/67781 , H01L21/68707
摘要： The present invention is a vertical-type heat processing apparatus comprising: a heat processing furnace; a holder capable of being loaded into the heat processing furnace and unloaded therefrom, with holding therein a plurality of objects to be processed at predetermined vertical intervals in a tier-like manner; a transfer mechanism including a base table capable of vertically moving and rotating, and a substrate supporter capable of horizontally moving on the base table; and a controller for controlling the transfer mechanism; wherein the transfer mechanism is adapted to transfer an object to be processed between a container containing a plurality of objects to be processed at predetermined intervals, and the holder; the substrate supporter includes a to-and-fro driving part for driving the substrate supporter in the horizontal direction, and a pitch-change driving part for changing a pitch at which the objects to be processed are supported; the controller is adapted to monitor at least one information of position, velocity and current fed back to a motor for driving the transfer mechanism; and the controller is adapted to judge, by comparing the monitored information with predetermined information corresponding to a normal drive, that the transfer mechanism is abnormally driven, and then is adapted to stop the drive of the transfer mechanism.
摘要翻译：本发明是一种立式热处理装置，包括：加热炉; 能够被加载到热处理炉中并从其中卸载的保持器，其中以等级方式在其中以预定的垂直间隔保持多个要处理的物体; 包括能够垂直移动和旋转的基台的传送机构和能够在基台上水平移动的基板支撑件; 以及用于控制所述传送机构的控制器; 其中所述传送机构适于在预定间隔内容纳要处理的多个物体的容器和所述保持器之间传送待加工物体; 衬底支撑件包括用于在水平方向上驱动衬底支撑件的来回驱动部分和用于改变支撑待处理对象的间距的音调变化驱动部分; 控制器适于监视反馈到电动机的位置，速度和电流的至少一个信息，以驱动传送机构; 并且所述控制器适于通过将所监视的信息与对应于正常驱动的预定信息进行比较来判断所述传送机构异常驱动，然后适于停止所述传送机构的驱动。

4. 发明申请

US20100057249A1 THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND STORAGE MEDIUM 有权
标题翻译：热处理设备，热处理方法和储存介质
公开(公告)号：US20100057249A1
公开(公告)日：2010-03-04
申请号：US12548873
申请日：2009-08-27
申请人： Yo ABE , Kiichi TAKAHASHI , Junya SATO , Yoshinobu MOTODATE
发明人： Yo ABE , Kiichi TAKAHASHI , Junya SATO , Yoshinobu MOTODATE
IPC分类号： H01L21/68
CPC分类号： H01L21/67098 , H01L21/67109 , H01L21/67766 , H01L21/67781
摘要： When a substrate is transferred by a holding arm to a multiple tier wafer boat, contact between the holding arm and the substrate is prevented. When the wafer boat is not subjected to a thermal effect, a normal height position of a ring member is obtained by relatively elevating and lowering a transfer base member with respect to the wafer boat. Before a wafer, which is not yet thermally processed, is transferred to the wafer boat, a height position of the corresponding ring member is obtained. By comparing a difference between the normal height position of the ring member and the height position of the ring member before the wafer is transported, with a threshold value, whether to transfer the wafer by the wafer transfer mechanism to the wafer boat can be judged.
摘要翻译：当基板被保持臂转移到多层晶片舟皿时，防止了保持臂和基板之间的接触。当晶片舟不受热效应时，通过相对于晶片舟相对地升高和降低转印基底构件，获得环形构件的正常高度位置。在尚未热处理的晶片被转移到晶片舟皿之前，获得相应的环件的高度位置。通过比较环状构件的正常高度位置与晶片运送前环状构件的高度位置之间的差异，可以判断是否通过晶片传送机构将晶片转移到晶片舟皿上。

5. 发明申请

US20080056861A1 Processing apparatus and processing method 审中-公开
标题翻译：处理装置及处理方法
公开(公告)号：US20080056861A1
公开(公告)日：2008-03-06
申请号：US11896458
申请日：2007-08-31
申请人： Kiichi Takahashi , Katsuhiko Oyama
发明人： Kiichi Takahashi , Katsuhiko Oyama
IPC分类号： B65H1/00
CPC分类号： H01L21/67772 , H01L21/67775
摘要： A processing apparatus according to the present invention comprises: a container 3 that contains a plurality of objects to be processed w, the container including an outlet port 3a formed in a front surface thereof for taking out the object to be processed w, and a lid 3b for hermetically sealing the outlet port 3a; a loading area Sa into which the container 3 is loaded; a conveying area Sb whose atmosphere differs from an atmosphere in the loading area Sa; a partition wall 6 that separates the loading area Sa and the conveying area Sb from each other, and has an opening 13; a door 14 for opening and closing the opening 13 in the partition wall 6; and a stage 10 for placing the container 3 at a position near the opening 13 in the loading area Sa. Parts to be pressed 20 are provided on opposite sides on a side of the front surface of the container 3. The partition wall 6 is provided with a pressing and holding mechanism 23 having a pressing roller 22 that rides on the part to be pressed 20 of the container 3 from a lateral side to press the container 3 against the opening 13 in the partition wall 6 and hold the container 3 tightly in place.
摘要翻译：根据本发明的处理装置包括：包含多个待处理物体w的容器3，容器包括形成在其前表面中的用于取出待处理物体w的出口端口3a，以及用于气密地密封出口3a的盖子3b; 装载容器3的装载区域Sa; 输送区域Sb，其气氛不同于装载区域Sa中的气氛; 分隔壁6，其将装载区域Sa和输送区域Sb彼此分离，并具有开口13; 用于打开和关闭分隔壁6中的开口13的门14; 以及用于将容器3放置在靠近装载区域Sa中的开口13的位置的台架10。被挤压部件20设置在容器3的前表面的相对侧上。分隔壁6设置有按压保持机构23，该按压保持机构23具有骑在待按压部件20上的按压辊22 容器3从侧面将容器3压靠隔壁6中的开口13，并将容器3紧紧地保持在适当位置。

6. 发明申请

US20050175952A1 Vertical heat treating equipment 有权
公开(公告)号：US20050175952A1
公开(公告)日：2005-08-11
申请号：US10506688
申请日：2003-03-27
申请人： Katsuya Toba , Kiichi Takahashi , Mitsuru Obara
发明人： Katsuya Toba , Kiichi Takahashi , Mitsuru Obara
IPC分类号： H01L21/22 , H01L21/00 , H01L21/205 , H01L21/31 , H01L21/324 , F27D3/12
CPC分类号： H01L21/67109
摘要： A vertical heat-processing apparatus (1) includes a vertical heat-processing furnace (2) having a furnace port (3), a lid (5) movable up and down to open and close the furnace port, and a rotation mechanism (15) disposed on the lid to rotate a holder (13) that holds a number of target substrates (W). The rotation mechanism (15) includes a rotary shaft (16), and a support unit (19) that supports the rotary shaft (16) rotatably through a bearing (17) and sealing member (18). The rotary shaft (16) has a hollow structure with a thin wall, and is supplied with a cooling gas to flow inside and outside the rotary shaft. The support unit (19) has a cooling passage (32) surrounding an upper portion of the rotary shaft (16), and is supplied with a coolant to flow through the cooling passage.

7. 发明授权

US5857848A Transfer apparatus and vertical heat-processing system using the same 失效
标题翻译：传送装置和使用其的垂直加热处理系统
公开(公告)号：US5857848A
公开(公告)日：1999-01-12
申请号：US926475
申请日：1997-09-10
申请人： Kiichi Takahashi , Hiroshi Kikuchi
发明人： Kiichi Takahashi , Hiroshi Kikuchi
IPC分类号： H01L21/677 , B65G49/07 , C30B35/00 , H01L21/205 , F27D5/00
CPC分类号： C30B35/005 , Y10S414/137 , Y10S414/14
摘要： A vertical heat treatment system has a transfer apparatus for transferring semiconductor wafers and a cassette serving as a transport container for the semiconductor wafers. The transfer apparatus has a base disposed to be vertically movable and rotatable within a horizontal plane. Wafer arms for transferring the wafers placed on them are disposed on the base. The wafer arms can reciprocally move on the base between a standby position and an advanced position in the horizontal direction. A cassette arm for transferring a cassette placed on it is also disposed on the base. The cassette arm can reciprocally move on the base between a retreat position and a protruded position in the horizontal direction. The wafer arms and the cassette arm are reciprocally movable in opposite directions to oppose each other. While the wafer arms and the cassette arm are at the standby position and the retreat position, respectively, a holding portion of the cassette arm is present immediately above the wafer arms.
摘要翻译：立式热处理系统具有用于转移半导体晶片的转移装置和用作半导体晶片的运输容器的盒。传送装置具有设置成在水平面内可垂直移动和旋转的基座。将放置在其上的晶片转移的晶片臂设置在基座上。晶片臂可以在待机位置和水平方向上的前进位置之间在基座上往复移动。用于传送放置在其上的盒的盒式臂也设置在基座上。盒臂可以在水平方向上的退避位置和突出位置之间在基座上往复运动。晶片臂和盒臂在相反的方向上可往复运动以相互对置。当晶片臂和盒臂分别处于待机位置和退避位置时，盒臂的保持部分紧接在晶片臂的上方。

8. 外观设计

USD242809S Tape recorder 失效
公开(公告)号：USD242809S
公开(公告)日：1976-12-21
申请号：US592639
申请日：1975-07-02
申请人： Yoshinori Fukuda , Kiichi Takahashi
设计人： Yoshinori Fukuda , Kiichi Takahashi

9. 发明授权

US08979469B2 Heat treatment apparatus and method of transferring substrates to the same 有权
标题翻译：热处理装置和将基板转印到其上的方法
公开(公告)号：US08979469B2
公开(公告)日：2015-03-17
申请号：US13559084
申请日：2012-07-26
申请人： Kiichi Takahashi , Terumi Kamada , Ittetsu Oikawa
发明人： Kiichi Takahashi , Terumi Kamada , Ittetsu Oikawa
IPC分类号： H01L21/677 , H01L21/687
CPC分类号： H01L21/67766 , H01L21/67757 , H01L21/67781 , H01L21/68707 , Y10S414/137 , Y10S414/14
摘要： A heat treatment apparatus includes a vessel loading unit on which a substrate vessel configured to accommodate a plurality of substrates at a first interval is loaded, a substrate holder configured to hold the plurality of substrates at a second interval which is smaller than the first interval, a substrate transfer unit capable of supporting the substrates and configured to transfer the plurality of substrates between the substrate holder and the substrate vessel and includes at least two substrate supporting parts stacked with the first interval therebetween and configured to be simultaneously advanced and retreated relative to the substrate vessel and individually advanced and retreated relative to the substrate holder, and a control unit configured to control an upper one of the at least two substrate supporting parts to be in an inoperative state when a lower one is supporting the substrate.
摘要翻译：热处理装置包括：容器装载单元，载置配置成以第一间隔容纳多个基板的基板容器;衬底保持器，其构造成以比第一间隔小的第二间隔保持多个基板; 基板传送单元，其能够支撑所述基板并且被配置为在所述基板保持器和所述基板容器之间传送所述多个基板，并且包括至少两个基板支撑部分，所述至少两个基板支撑部分以其间的第一间隔堆叠并且被构造成相对于所述基板保持器衬底容器，并且相对于衬底保持器单独地前进和后退;以及控制单元，被配置为当下部衬底支撑衬底时，控制所述至少两个衬底支撑部件中的上部衬底支撑部件处于非工作状态。

10. 发明申请

US20130028687A1 HEAT TREATMENT APPARATUS AND METHOD OF TRANSFERRING SUBSTRATES TO THE SAME 有权
标题翻译：热处理装置和将基板转移到其上的方法
公开(公告)号：US20130028687A1
公开(公告)日：2013-01-31
申请号：US13559084
申请日：2012-07-26
申请人： Kiichi TAKAHASHI , Terumi KAMADA , Ittetsu OIKAWA
发明人： Kiichi TAKAHASHI , Terumi KAMADA , Ittetsu OIKAWA
IPC分类号： H01L21/677
CPC分类号： H01L21/67766 , H01L21/67757 , H01L21/67781 , H01L21/68707 , Y10S414/137 , Y10S414/14
摘要： A heat treatment apparatus includes a vessel loading unit on which a substrate vessel configured to accommodate a plurality of substrates at a first interval is loaded, a substrate holder configured to hold the plurality of substrates at a second interval which is smaller than the first interval, a substrate transfer unit capable of supporting the substrates and configured to transfer the plurality of substrates between the substrate holder and the substrate vessel and includes at least two substrate supporting parts stacked with the first interval therebetween and configured to be simultaneously advanced and retreated relative to the substrate vessel and individually advanced and retreated relative to the substrate holder, and a control unit configured to control an upper one of the at least two substrate supporting parts to be in an inoperative state when a lower one is supporting the substrate.
摘要翻译：热处理装置包括：容器装载单元，载置配置成以第一间隔容纳多个基板的基板容器;衬底保持器，其构造成以比第一间隔小的第二间隔保持多个基板; 基板传送单元，其能够支撑所述基板并且被配置为在所述基板保持器和所述基板容器之间传送所述多个基板，并且包括至少两个基板支撑部分，所述至少两个基板支撑部分以其间的第一间隔堆叠并且被构造成相对于所述基板保持器衬底容器，并且相对于衬底保持器单独地前进和后退;以及控制单元，被配置为当下部衬底支撑衬底时，控制所述至少两个衬底支撑部件中的上部衬底支撑部件处于非工作状态。

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