会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • ZOOM LENS AND IMAGING APPARATUS
    • 变焦镜头和成像装置
    • US20100289926A1
    • 2010-11-18
    • US12777917
    • 2010-05-11
    • Takashi TANAKA
    • Takashi TANAKA
    • H04N5/262G02B15/14G02B27/64
    • H04N5/23248G02B15/173G02B27/646H04N5/23287
    • A zoom lens includes a first lens group having a positive refractive power, a second lens group having a negative refractive power, a third lens group having a positive refractive power, and a fourth lens group having a positive refractive power, which are arranged in this order from an object side. The gap between the lens groups is changed to change power. The third lens group includes at least two partial lens groups. One of the partial lens groups is a camera shake correction group and is moved in a direction vertical to an optical axis to correct a camera shake. The camera shake correction group includes two single lenses, and at least one of the single lenses is a plastic lens.
    • 变焦透镜包括具有正折光力的第一透镜组,具有负折光力的第二透镜组,具有正折射光焦度的第三透镜组和具有正折射光焦度的第四透镜组, 从物体方面的顺序。 改变透镜组之间的间隙以改变功率。 第三透镜组包括至少两个部分透镜组。 部分透镜组中的一个是相机抖动校正组,并且在垂直于光轴的方向上移动以校正相机抖动。 相机抖动校正组包括两个单个透镜,并且单个透镜中的至少一个是塑料透镜。
    • 7. 发明申请
    • COATING TREATMENT METHOD, COMPUTER-READABLE STORAGE MEDIUM, AND COATING TREATMENT APPARATUS
    • 涂层处理方法,计算机可读存储介质和涂层处理设备
    • US20120135358A1
    • 2012-05-31
    • US13331307
    • 2011-12-20
    • Takashi TANAKA
    • Takashi TANAKA
    • G03F7/30
    • H01L21/6715G03F7/162
    • A substrate is first rotated at a first rotation speed, and a resist solution is applied. Rotation of the substrate is decelerated to a second rotation speed lower than the first rotation speed so that the substrate is rotated at the low speed to smooth the resist solution on the substrate. Rotation of the substrate is then accelerated to a third rotation speed higher than the second rotation speed, and a solvent for the coating solution and/or a dry gas are/is supplied to the resist solution on the substrate. The solvent gas is supplied to a portion of the resist solution on the substrate thicker than a set thickness, and the dry gas is supplied to a portion of the coating solution on the substrate thinner than the set thickness. This thins the thicker portion of the resist solution and thickens the thinner portion to uniform the resist solution.
    • 首先以第一转速旋转衬底,并施加抗蚀剂溶液。 基板的旋转减速到比第一旋转速度低的第二旋转速度,使得基板以低速旋转以平滑基板上的抗蚀剂溶液。 然后将衬底的旋转加速到高于第二转速的第三转速,并且将用于涂布溶液和/或干燥气体的溶剂供应到衬底上的抗蚀剂溶液。 将溶剂气体供给到比设定厚度厚的基板上的抗蚀剂溶液的一部分,并且将干燥气体供给到比设定厚度更薄的基板上的涂布溶液的一部分。 这使得抗蚀剂溶液的较厚部分变薄并使较薄部分变稠以使抗蚀剂溶液均匀。