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    • 1. 发明授权
    • Mammogram recording and read-out apparatus
    • 乳房X线照相记录和读出装置
    • US07342994B2
    • 2008-03-11
    • US11128172
    • 2005-05-13
    • Takashi ShojiToshitaka Agano
    • Takashi ShojiToshitaka Agano
    • A61B6/04
    • A61B6/502A61B6/4233G01N23/04Y10S128/915
    • A mammogram recording and read-out apparatus comprises a radiation image detector having a rectangular shape, a detector support section, and a breast support section. A support state of the detector support section is capable of being changed over between a first support state, in which the radiation image detector is supported in an orientation such that a short side of the radiation image detector stands facing the chest wall of an object, and a second support state, in which the radiation image detector is supported in an orientation such that a long side of the radiation image detector stands facing the chest wall of the object.
    • 乳房X线照相记录和读出装置包括具有矩形形状的放射线图像检测器,检测器支撑部分和乳房支撑部分。 检测器支撑部分的支撑状态能够在第一支撑状态之间切换,其中放射线图像检测器被支撑在使得辐射图像检测器的短边面对物体的胸壁的方向上, 以及第二支撑状态,其中所述放射线图像检测器被支撑在使得所述放射线图像检测器的长边面对所述物体的胸壁的方向。
    • 6. 发明申请
    • APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD
    • 用于焊接粉末的装置和将焊剂粉末加入电子电路板的方法
    • US20120292377A1
    • 2012-11-22
    • US13522547
    • 2011-01-18
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • B23K3/06B23K1/20
    • H05K3/3478B23K1/0016B23K1/203B23K3/06B23K2101/42H05K2203/0292H05K2203/0425H05K2203/1527H05K2203/1554
    • Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
    • 公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。 用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部,使得其表面大致面向上下方向; 倾斜装置,其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置,并且使容器沿与第一方向相反的第二方向从初始位置倾斜,并使容器倾斜 回到第一个方向; 以及设置有偏心马达的振动装置,所述偏心马达设置在容器的底部的中心,通过旋转轴的旋转而向容器的底部提供振动;以及控制装置,用于将偏心马达的旋转轴设置在 与容器的倾斜方向相同的方向。
    • 7. 发明申请
    • METHOD OF PRODUCING CIRCUIT BOARD
    • 生产电路板的方法
    • US20120042511A1
    • 2012-02-23
    • US13266379
    • 2010-04-12
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • H05K3/00
    • H05K3/3478H05K3/3489H05K2203/041H05K2203/043H05K2203/124Y10T29/49124Y10T29/49126Y10T29/49155Y10T29/49156
    • Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
    • 提供一种制造电路板的方法,其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。 制造电路板的方法包括以下步骤:通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上,并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。