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    • 1. 发明授权
    • Cathode-ray tube dividing apparatus and cathode-ray tube dividing method
    • 阴极射线管分割装置和阴极射线管分割方法
    • US6089937A
    • 2000-07-18
    • US316043
    • 1999-05-21
    • Takashi ShojiTadanori KawamuraTomoya Oikawa
    • Takashi ShojiTadanori KawamuraTomoya Oikawa
    • H01J9/50H01J9/52
    • H01J9/52Y02W30/828
    • Disclosed are a cathode-ray tube dividing apparatus and a cathode-ray tube dividing method intended to simply and stably divide a cathode-ray tube in a shortened time. The dividing apparatus includes a positioning means for fixedly positioning the used cathode-ray tube at a specific location, and a cathode-ray tube heating means which is brought into contact with a specific portion on side surfaces of the cathode-ray tube for linearly heating the specific portions. The cathode-ray tube heating means includes linear heating members for imparting thermal strain to the side surfaces of the cathode-ray tube upon receiving a power, thereby dividing the cathode-ray tube into the panel portion and the funnel portion, and a power supply for supplying a heating power to the linear heating members. The power supply is adapted to supply a first power for generating cracks on the side surfaces of the cathode-ray tube to the linear heating members, and to supply, after generation of the cracks, a second power larger than the first power to the linear heating members.
    • 公开了一种阴极射线管分割装置和阴极射线管分割方法,其目的是在缩短的时间内简单且稳定地分割阴极射线管。 分割装置包括:定位装置,用于将所用的阴极射线管固定在特定位置,阴极射线管加热装置与阴极射线管侧面的特定部分接触,用于线性加热 具体部分。 阴极射线管加热装置包括线性加热构件,用于在接收电力时向阴极射线管的侧表面施加热应变,从而将阴极射线管分成面板部分和漏斗部分,以及电源 用于向线性加热件提供加热功率。 电源适于在线性加热部件的阴极射线管的侧面产生产生裂纹的第一电力,并且在产生裂纹之后,将大于第一功率的第二功率提供给线性 加热构件。
    • 4. 发明申请
    • APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD
    • 用于焊接粉末的装置和将焊剂粉末加入电子电路板的方法
    • US20120292377A1
    • 2012-11-22
    • US13522547
    • 2011-01-18
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • B23K3/06B23K1/20
    • H05K3/3478B23K1/0016B23K1/203B23K3/06B23K2101/42H05K2203/0292H05K2203/0425H05K2203/1527H05K2203/1554
    • Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
    • 公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。 用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部,使得其表面大致面向上下方向; 倾斜装置,其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置,并且使容器沿与第一方向相反的第二方向从初始位置倾斜,并使容器倾斜 回到第一个方向; 以及设置有偏心马达的振动装置,所述偏心马达设置在容器的底部的中心,通过旋转轴的旋转而向容器的底部提供振动;以及控制装置,用于将偏心马达的旋转轴设置在 与容器的倾斜方向相同的方向。
    • 5. 发明申请
    • METHOD OF PRODUCING CIRCUIT BOARD
    • 生产电路板的方法
    • US20120042511A1
    • 2012-02-23
    • US13266379
    • 2010-04-12
    • Takashi ShojiTakekazu Sakai
    • Takashi ShojiTakekazu Sakai
    • H05K3/00
    • H05K3/3478H05K3/3489H05K2203/041H05K2203/043H05K2203/124Y10T29/49124Y10T29/49126Y10T29/49155Y10T29/49156
    • Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
    • 提供一种制造电路板的方法,其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。 制造电路板的方法包括以下步骤:通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上,并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。
    • 9. 发明授权
    • Radiation imaging apparatus
    • 辐射成像装置
    • US07498583B2
    • 2009-03-03
    • US11393838
    • 2006-03-31
    • Takashi ShojiMasakazu Nakajo
    • Takashi ShojiMasakazu Nakajo
    • G01T1/24
    • A61B6/4266A61B6/4291A61B6/4452A61B6/5235H04N5/32H04N5/3415
    • Radiation detector units provided with solid-state radiation detectors are supported on a supporting section, such that the radiation detector units are located at different distances from a radiation source and arrayed in a one-dimensional direction or two-dimensional directions. One of the radiation detector units is taken as a reference unit. Image size enlargement or reduction processing is performed on each of image signals outputted from the radiation detector units other than the reference unit and in accordance with a ratio between a distance from the radiation source to the reference unit and a distance from the radiation source to each of the radiation detector units other than the reference unit. Image composing processing is performed on the image signal outputted from the reference unit and processed image signals obtained from the image size enlargement or reduction processing.
    • 设置有固态放射线检测器的辐射检测器单元被支撑在支撑部分上,使得辐射检测器单元位于与辐射源不同的距离处并排列成一维方向或二维方向。 将其中一个辐射检测器单元作为参考单元。 对从除了参考单元之外的辐射检测器单元输出的每个图像信号以及从辐射源到参考单元的距离与从辐射源到每个基准单元的距离之间的比率执行图像尺寸放大或缩小处理 的除了参考单元之外的辐射探测器单元。 对从参考单元输出的图像信号和从图像尺寸放大或缩小处理获得的经处理的图像信号执行图像合成处理。
    • 10. 发明申请
    • Display Device
    • 显示设备
    • US20080303758A1
    • 2008-12-11
    • US12131202
    • 2008-06-02
    • Yoshihisa OoishiJunichi MaruyamaTakashi ShojiKikuo Ono
    • Yoshihisa OoishiJunichi MaruyamaTakashi ShojiKikuo Ono
    • G09G3/34
    • G09G3/2033G09G3/2037G09G3/36G09G3/3611G09G5/399G09G2340/02G09G2360/18
    • High-order bits to be utilized for current-frame display data and previous-frame display data, and low-order bits to be utilized for the current-frame display data alone are stored in independently controllable memory areas. For reading the current-frame display data from a frame memory, data of the high-order bits and data of the low-order bits are read. For reading the previous-frame data, the high-order bits alone are read. Thus, since a period during which the data of the low-order bits that is not utilized for the previous-frame display data is stored in the memory is shortened, a required memory capacity can be reduced. The data transfer time can be reduced by the time required for memory read for the data of the low-order bits that is not utilized for the previous-frame display data.
    • 用于当前帧显示数据和前一帧显示数据的高位数,以及仅用于当前帧显示数据的低位比特存储在独立可控存储区域中。 为了从帧存储器读取当前帧显示数据,读取高位数据和低位数据的数据。 为了读取前一帧数据,只读取高位。 因此,由于缩短了对前一帧显示数据未被利用的低位数据的数据存储在存储器中的时段,所以可以减少所需的存储器容量。 数据传输时间可以减少对于未用于前一帧显示数据的低位的数据的存储器读取所需的时间。