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    • 5. 发明授权
    • Process for preparing .alpha., .beta.-unsaturated aldehydes
    • 制备α,β-不饱和醛的方法
    • US4745229A
    • 1988-05-17
    • US15095
    • 1987-02-13
    • Junzo OteraShigeaki SuzukiTakashi OnishiYoshiji Fujita
    • Junzo OteraShigeaki SuzukiTakashi OnishiYoshiji Fujita
    • C07C45/27C07C45/28C07C45/56C07C47/21C07C69/145
    • C07C47/21C07C45/27C07C45/28C07C45/56C07C67/29
    • A process for preparing .alpha.,.beta.-unsaturated aldehydes of the general formula (I) ##STR1## in which R.sup.1, R.sup.2 and R.sup.3 are independently a hydrogen atom, or an alkyl or alkenyl group with or without being substituted with a lower acyloxy group. The aldehyde of the general formula (I) is prepared by reaction between an allylic chloride of the following general formula (IIa) ##STR2## in which R.sup.1, R.sup.2 and R.sup.3 have, respectively, the same meanings as defined above, and an amine oxide selected from the group consisting of tri(lower alkyl)amine N-oxides of the formula,R.sub.3.sup.4 N.sup.+ O.sup.-,in which R.sup.4 represents a lower alkyl group having from 2 to 4 carbon atoms, and N-lower alkylmorpholine N-oxides of the following formula ##STR3## in which R.sup.5 represents a lower alkyl group having from 1 to 4 carbon atoms. Alternatively, the aldehyde of the formula (I) is obtained by reaction between an allylic chloride of the following general formula (IIb) ##STR4## in which R.sup.1, R.sup.2 and R.sup.3 have, respectively, the same meanings as defined above, and an amine oxide selected from the group consisting of tri(lower alkyl)amine N-oxides of the formula,R.sub.3.sup.4 N.sup.+ O.sup.-,in which R.sup.4 has the same meaning as defined above, and N-lower alkylmorpholine N-oxides of the following formula ##STR5## in which R.sup.5 has the same meaning as defined above, in the presence of an alkali metal iodide or a copper halide.
    • 制备通式(I)的α,β-不饱和醛的方法,其中R 1,R 2和R 3独立地为氢原子,或具有或不具有低级烷基或烯基的烷基或烯基 酰氧基。 通式(I)的醛通过以下通式(IIa)的烯丙基氯与其中R 1,R 2和R 3分别具有与上述相同的含义和 选自下列的三(低级烷基)胺N-氧化物的氧化胺,其中R 4表示具有2至4个碳原子的低级烷基的式R 34 N + O-,和N-低级烷基吗啉N- 下式“IMAGE”的氧化物,其中R 5表示具有1至4个碳原子的低级烷基。 或者,式(I)的醛通过以下通式(IIb)的烯丙基氯(IIb)(其中R1,R2和R3分别具有与上述相同的含义) 和选自下式的三(低级烷基)胺N-氧化物的氧化胺,其中R 4具有与上述相同的含义的R 34 N + O-,以及下述的N-低级烷基吗啉N-氧化物 在碱金属碘化物或卤化铜存在下,其中R 5具有与上述相同的含义的式“IMAGE”。
    • 8. 发明授权
    • Metal thin film for interconnection of semiconductor device
    • 用于半导体器件互连的金属薄膜
    • US07928573B2
    • 2011-04-19
    • US11465626
    • 2006-08-18
    • Takashi OnishiMasao MizunoMikako Takeda
    • Takashi OnishiMasao MizunoMikako Takeda
    • H01L23/48
    • H01L23/53233H01L21/2855H01L21/76882H01L23/5226H01L2924/0002H01L2924/00
    • A metal thin film used in fabricating a damascene interconnection of a semiconductor device which exhibits excellent high temperature fluidity during high pressure annealing, and which can fabricate an interconnection for a semiconductor device which has a low electric resistance and stable high quality is provided. Also provided is an interconnection for a semiconductor device. More specifically, a metal thin film for use as an interconnection of a semiconductor device comprising a Cu alloy containing N at a content of not less than 0.4 at % to not more than 2.0 at %; and an interconnection for a semiconductor device fabricated by forming the metal thin film on an insulator film which is formed on a semiconductor substrate and which has grooves formed therein, and filling the metal thin film in the interior of the grooves by a high pressure annealing process are provided.
    • 提供了用于制造半导体器件的镶嵌互连的金属薄膜,其在高压退火期间表现出优异的高温流动性,并且可以制造具有低电阻和稳定高质量的半导体器件的互连。 还提供了用于半导体器件的互连。 更具体地说,一种用作半导体器件的互连的金属薄膜,其包含含有不小于0.4原子%至不大于2.0原子%的含有N的Cu合金; 以及通过在形成在半导体衬底上并形成有凹槽的绝缘体膜上形成金属薄膜而制造的半导体器件的互连,并且通过高压退火工艺在槽内填充金属薄膜 被提供。