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    • 4. 发明授权
    • Process for producing high-density and high-strength carbon artifacts
showing a fine mosaic texture of optical anisotropy
    • 用于生产高密度和高强度碳伪影的方法,其显示光学各向异性的细微马赛克纹理
    • US5609800A
    • 1997-03-11
    • US529439
    • 1995-09-18
    • Isao MochidaRyuji FujiuraTakashi KojimaHitoshi Sakamoto
    • Isao MochidaRyuji FujiuraTakashi KojimaHitoshi Sakamoto
    • C04B35/528C10C3/00C01B31/02
    • C04B35/528C10C3/00
    • Self-adhesive carbonaceous grains for use in the manufacture of high-density and high-strength carbon artifacts containing 0.5-1.5 wt % of a quinoline-soluble but pyridine-insoluble component and at least 97 wt % of a quinoline-insoluble component and which are prepared by heat-treating in a nonoxidizing atmosphere a mesophase pitch that is obtained by polymerizing condensed polycyclic hydrocarbons or substances containing them in the presence of a superacid consisting of hydrogen fluoride and boron trifluoride. The carbonaceous grains are molded and the mold is baked at a sufficient temperature to achieve its carbonization, with the heating rate being not more than 20.degree. C./h in the temperature range from 400 .degree. to 600.degree. C. In this way, high-density and high-strength carbon artifacts showing a homogeneous fine mosaic texture of optical anisotropy can be efficiently manufactured in high carbon yield.
    • 用于制造含有0.5-1.5重量%喹啉可溶但不溶于吡啶的组分和至少97重量%喹啉不溶组分的高密度和高强度碳伪影的自粘碳质颗粒,其中 通过在非氧化性气氛中通过在由氟化氢和三氟化硼组成的超强酸的存在下聚合冷凝的多环烃或含有它们的物质而获得的中间相沥青来制备。 碳质颗粒被模制,模具在足够的温度下烘烤以实现其碳化,加热速率在400℃至600℃的温度范围内不超过20℃/小时。这样高 可以高产率地有效地制造显示光学各向异性的均匀的细微马赛克纹理的密度和高强度碳伪影。
    • 7. 发明申请
    • ELECTRONIC SUBSTRATE AND AN ELECTRONIC APPARATUS
    • 电子基板和电子设备
    • US20140190738A1
    • 2014-07-10
    • US14240348
    • 2012-08-15
    • Hitoshi SakamotoMinoru YoshikawaMasaki ChibaKenichi InabaArihiro Matsunaga
    • Hitoshi SakamotoMinoru YoshikawaMasaki ChibaKenichi InabaArihiro Matsunaga
    • H05K1/02
    • H05K1/021F28D15/0266G06F1/20H05K7/2029
    • An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently.
    • 电子基板100D具有片状基材110,其可以安装加热元件120和冷却加热器元件120的冷却结构。电子基板100可以在壳体200中沿几乎平行于 基体材料110的表面。冷却结构安装在片状基材110上,并具有中空形状的第一散热部160D和传热部700.具有中空形状的第一散热部160D辐射 安装在基材中的加热器元件120产生的热量。 传热部700将发热元件120的发热传递到第一散热部160D。 第一散热部分160D具有沿着基本材料110的插入和移除方向W几乎垂直的面形成的第一接合表面165.第一散热部分160D连接到设置在第一辐射部分260B中的第二辐射部分260B 壳体200热穿过第一接合表面165.结果,可以充分地辐射加热器元件的产生的热量。
    • 10. 发明授权
    • Process for producing silicon compound
    • 硅化合物生产工艺
    • US07776751B2
    • 2010-08-17
    • US11919484
    • 2006-05-17
    • Yoshiyuki OobaHitoshi Sakamoto
    • Yoshiyuki OobaHitoshi Sakamoto
    • H01L21/302H01L21/461
    • C23C16/4488C01B33/06C23C16/325C23C16/42H01L21/2807H01L21/28097H01L21/28518H01L31/032
    • A process for producing a silicon compound can minimize the number of steps and can form a desired compound in a low-temperature environment. The process comprises: allowing a radical of a halogen gas to act on a member 11 to be etched, which is disposed within a chamber 1 and is formed of a material containing an element capable of forming a compound with Si, while keeping the member 11 at a relatively high temperature, to form a gas of a precursor 24, which is a compound of the material and the halogen; holding a substrate 3 accommodated within the chamber 1 at a relatively low temperature, with the Si interface of the substrate 3 being exposed, to adsorb the precursor 24 onto the Si interface of the substrate 3; and then allowing the radical of the halogen gas to act on the precursor 24 adsorbed onto the Si interface to reduce the precursor 24, thereby producing a compound of the material and Si.
    • 硅化合物的制造方法可以使步骤的数量最少化,并能在低温环境下形成所需化合物。 该方法包括:使卤素气体基团作用在要蚀刻的构件11上,该构件设置在室1内,并且由含有能够与Si形成化合物的元素的材料形成,同时保持构件11 在相对高的温度下形成作为该材料和卤素的化合物的前体24的气体; 在相对较低的温度下保持容纳在室1内的基板3,使基板3的Si界面露出,以将前体24吸附到基板3的Si界面上; 然后使卤素气体的基团作用于吸附在Si界面上的前体24上以还原前体24,从而产生该材料和Si的化合物。