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    • 6. 发明授权
    • Electronic component and display device and a method of manufacturing the same
    • 电子元件及显示装置及其制造方法
    • US07972949B2
    • 2011-07-05
    • US12201391
    • 2008-08-29
    • Seiji Suzuki
    • Seiji Suzuki
    • H01L21/22H01L21/38G03G17/04
    • H01L27/1288H01L27/1214
    • An electronic component or display device of the present invention can be provided by using a following pattern formation method. On a substrate treated with a first etching with a first resist pattern as a first mask, a second resist pattern is transfer-printed on the first resist patterns so as to partially overlap with the first resist pattern and partially extended from the first resist pattern. And then a second etching is performed by using the first resist pattern and the second resist pattern as a second mask. The first resist pattern and the second resist pattern are used for forming wirings and/or terminals, and the extended portion of the second resist pattern is used to make the wirings to have a cross section of a stair-like edge shape.
    • 本发明的电子部件或显示装置可以通过使用以下图案形成方法来提供。 在用第一抗蚀剂图案作为第一掩模的第一蚀刻处理的基板上,将第二抗蚀剂图案转印印刷在第一抗蚀剂图案上,以便与第一抗蚀剂图案部分重叠并且部分地从第一抗蚀剂图案延伸。 然后通过使用第一抗蚀剂图案和第二抗蚀剂图案作为第二掩模来执行第二蚀刻。 第一抗蚀剂图案和第二抗蚀剂图案用于形成布线和/或端子,并且第二抗蚀剂图案的延伸部分用于使布线具有阶梯状边缘形状的横截面。
    • 8. 发明申请
    • DISPLAY DEVICE
    • 显示设备
    • US20100289997A1
    • 2010-11-18
    • US12812558
    • 2009-01-21
    • Seiji Suzuki
    • Seiji Suzuki
    • G02F1/1333H01L33/00
    • G02F1/13458H01L21/288H01L21/76804H01L21/76805H01L21/76877H01L27/124H01L29/41733H01L29/458
    • There is provided a contact hole including a lower layer metal disposed on an insulating substrate; an insulating film disposed on the lower layer metal film and having an opening; an interlayer connection layer formed by solidifying a conductive liquid material disposed extending to cover at least the lower layer metal film exposed by the opening and an insulating film edge portion at the opening; and an upper layer metal film disposed on the interlayer connection layer so that the upper layer metal film extends across a coverage boundary region of the interlayer connection layer to come in contact with the insulating film. The film thickness of the lower layer metal film exposed by the opening is thinner than the film thickness of the lower layer metal film not exposed by the opening.
    • 提供了一种接触孔,其包括设置在绝缘基板上的下层金属; 设置在下层金属膜上并具有开口的绝缘膜; 通过固化导电性液体材料而形成的层间连接层,所述导电性液体材料被设置成至少覆盖由所述开口暴露的下层金属膜和所述开口处的绝缘膜边缘部分; 以及设置在层间连接层上的上层金属膜,使得上层金属膜延伸穿过层间连接层的覆盖边界区域以与绝缘膜接触。 由开口露出的下层金属膜的膜厚比未露出开口的下层金属膜的膜厚薄。