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    • 2. 发明授权
    • Resin composition
    • 树脂组成
    • US5543474A
    • 1996-08-06
    • US318833
    • 1994-10-17
    • Takao KawakiAkikazu AmagaiToshiaki YamadaHidefumi HaradaHajime BanYuji TakedaKoji Yamamoto
    • Takao KawakiAkikazu AmagaiToshiaki YamadaHidefumi HaradaHajime BanYuji TakedaKoji Yamamoto
    • C08L67/02C08L79/08C08L81/02C08L59/02
    • C08L67/02C08L79/08C08L81/02
    • There is provided a resin composition having well balanced moldability, heat resistance and mechanical strength, which comprises (A) all aromatic polyamideimide resin and (B) a Polyester resin, (C) a polyphenylene sulfide resin or (D) a resin capable of forming an anisotropic molten phase, said aromatic polyamideimide resin containing 5 to 95 mol % of a recurring unit of the formula (1) and 5 to 95 mol % of at least one of a recurring unit of the formula (2) and a recurring unit of the formula (3). Said aromatic polyamideimide resin is prepared by conducting a polymerization reaction of an aromatic tricarboxylic acid anhydride and at least any one of all aromatic dicarboxylic acid and an aliphatic dicarboxylic acid with a diisocyanate compound in plural steps in which in the first step the polymerization reaction is conducted in a temperature range of 50.degree. to 110.degree. C. and in the second and subsequent steps the polymerization reaction is conducted in a temperature range of higher than 110.degree. C. but not higher than 200.degree. C. ##STR1## wherein Ar denotes a trivalent aromatic group, Ar.sub.1 denotes a divalent aromatic group, R.sub.1 denotes a divalent aliphatic group, and R denotes a divalent aromatic or aliphatic group.
    • PCT No.PCT / JP94 / 00232 Sec。 371日期:1994年10月17日 102(e)日期1994年10月17日PCT 1994年2月16日PCT PCT。 出版物WO94 / 19410 日本1994年9月1日提供了具有良好平衡的成型性,耐热性和机械强度的树脂组合物,其包含(A)全芳香族聚酰胺酰亚胺树脂和(B)聚酯树脂,(C)聚苯硫醚树脂或(D) 能够形成各向异性熔融相的树脂,所述芳香族聚酰胺酰亚胺树脂含有5〜95摩尔%的式(1)的重复单元和5〜95摩尔%的式(2)的重复单元中的至少一种, 和式(3)的重复单元。 所述芳香族聚酰胺酰亚胺树脂通过芳族三羧酸酐和至少任意一种芳族二羧酸和脂族二羧酸与二异氰酸酯化合物进行多步反应来制备,其中在第一步中进行聚合反应 在50〜110℃的温度范围内,在第二和随后的步骤中,聚合反应在高于110℃但不高于200℃的温度范围内进行。 (3)其中Ar表示三价芳族基团,Ar 1表示二价芳族基团,R 1表示二价脂肪族基团,R表示二价芳香族或脂肪族基团。
    • 5. 发明授权
    • Resin composition
    • 树脂组成
    • US07098273B2
    • 2006-08-29
    • US10871063
    • 2004-06-21
    • Toshiaki YamadaHajime BanHiroyuki Kudo
    • Toshiaki YamadaHajime BanHiroyuki Kudo
    • C08L77/00C08L79/08
    • C08L79/08C08K5/372C08L77/00C08L81/02C08L81/04C08L81/00C08L2666/20
    • An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance.A resin composition comprising: (1) 5 to 60 parts by weight of aromatic polyamide imide resin (A) having a weight average molecular weight (Mw) of 1,000 to 100,000 and having an amino group in an amount of 0.00002 to 0.002 mol/g in a molecule, (2) 95 to 40 parts by weight of polyarylene sulfide resin (B), and (3) 0.01 to 10 parts by weight of episulfide compound (C) based on 100 parts by weight of the total of (A) and (B).
    • 本发明的目的是提高包含PAI树脂和PAS树脂的树脂组合物的相容性,以提供当熔融,强度,韧性和耐热性时流动性优异的树脂组合物。 1.一种树脂组合物,其含有:(1)5〜60重量份的重均分子量(Mw)为1,000〜100,000,氨基的量为0.00002〜0.002mol / g的芳香族聚酰胺酰亚胺树脂(A) 在分子中,(2)95〜40重量份的聚芳硫醚树脂(B),和(3)0.01〜10重量份的环硫化合物(C),相对于(A)总计100重量份, 和(B)。