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    • 1. 发明授权
    • Network system including a plurality of lan systems and an intermediate network having independent address schemes
    • 包括多个lan系统的网络系统和具有独立地址方案的中间网络
    • US06173334B2
    • 2001-01-09
    • US09166860
    • 1998-10-06
    • Takanori MatsuzakiHiroshi Sakurai
    • Takanori MatsuzakiHiroshi Sakurai
    • G06F1300
    • H04L29/12367H04L12/4604H04L29/12009H04L29/12424H04L61/2514H04L61/2535
    • A network system is constructed by: a first LAN system having first terminal equipment; a second LAN system having second terminal equipment; an intermediate network to connect the first and second LAN systems; first communication equipment to transfer a packet between the first LAN system and the intermediate network; and second communication equipment to transfer a packet between the second LAN system and the intermediate network. To transfer the packet from the first terminal equipment to the second terminal equipment, the first communication equipment converts an address showing a transmission destination of the packet transmitted from the first terminal equipment from an address defined on the first LAN system to an address defined on the intermediate network and transfers the converted address from the first LAN system to the intermediate network. The second communication equipment converts an address showing the transmission destination of the packet on the intermediate network from the address defined on the intermediate network to an address defined on the second LAN system and transfers the converted address from the intermediate network to the second LAN system.
    • 网络系统由以下部分构成:具有第一终端设备的第一LAN系统; 具有第二终端设备的第二LAN系统; 连接第一和第二LAN系统的中间网络; 第一通信设备,用于在第一LAN系统和中间网络之间传送分组; 以及用于在第二LAN系统和中间网络之间传送分组的第二通信设备。 为了将分组从第一终端设备传送到第二终端设备,第一通信设备将表示从第一终端设备发送的分组的发送目的地的地址从在第一LAN系统上定义的地址转换为 并将转换的地址从第一LAN系统传送到中间网络。 第二通信设备将表示中间网络上的分组的发送目的地的地址从中间网络上定义的地址转换为在第二LAN系统上定义的地址,并将转换的地址从中间网络传送到第二LAN系统。
    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08357963B2
    • 2013-01-22
    • US13185965
    • 2011-07-19
    • Kiyoshi KatoTakanori Matsuzaki
    • Kiyoshi KatoTakanori Matsuzaki
    • H01L27/108
    • H01L27/11521H01L27/108H01L27/11524H01L27/11551H01L27/1156H01L27/1225
    • A semiconductor device includes a material with which off-state current of a transistor can be sufficiently small; for example, an oxide semiconductor material is used. Further, transistors of memory cells of the semiconductor device, which include an oxide semiconductor material, are connected in series. Further, the same wiring (the j-th word line (j is a natural number greater than or equal to 2 and less than or equal to m)) is used as a wiring electrically connected to one of terminals of a capacitor of the j-th memory cell and a wiring electrically connected to a gate terminal of a transistor, in which a channel is formed in an oxide semiconductor layer, of the (j−1)-th memory cell. Therefore, the number of wirings per memory cell and the area occupied by one memory cell are reduced.
    • 半导体器件包括晶体管的截止电流足够小的材料; 例如,使用氧化物半导体材料。 此外,包括氧化物半导体材料的半导体器件的存储单元的晶体管串联连接。 此外,使用相同的布线(第j字线(j为大于等于2且小于等于m的自然数))作为与j的电容器的端子之一电连接的布线 第(j-1)个存储单元和与第一第(j-1)个存储单元形成沟道的晶体管的栅极端子电连接的布线。 因此,每个存储单元的布线数和一个存储单元占用的面积减少。
    • 4. 发明申请
    • Semiconductor Device
    • 半导体器件
    • US20120236621A1
    • 2012-09-20
    • US13489628
    • 2012-06-06
    • Takanori Matsuzaki
    • Takanori Matsuzaki
    • G11C5/06
    • H01L27/108G11C11/4023H01L27/10894
    • A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.
    • 提供了包括存储单元的半导体器件。 存储单元包括晶体管和电容器,以及电阻器和二极管之一。 晶体管的栅极电连接到字线,并且晶体管的源极和漏极中的一个电连接到位线。 电容器的一个端子电连接到晶体管的源极和漏极中的另一个,并且电容器的另一个端子电连接到布线。 电阻器和二极管中的一个的一个端子电连接到晶体管的源极和漏极中的另一个,并且电阻器和二极管中的一个的另一个端子电连接到布线。
    • 5. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08199551B2
    • 2012-06-12
    • US12570619
    • 2009-09-30
    • Takanori Matsuzaki
    • Takanori Matsuzaki
    • G11C5/06
    • H01L27/108G11C11/4023H01L27/10894
    • A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.
    • 提供了包括存储单元的半导体器件。 存储单元包括晶体管和电容器,以及电阻器和二极管之一。 晶体管的栅极电连接到字线,并且晶体管的源极和漏极中的一个电连接到位线。 电容器的一个端子电连接到晶体管的源极和漏极中的另一个,并且电容器的另一个端子电连接到布线。 电阻器和二极管中的一个的一个端子电连接到晶体管的源极和漏极中的另一个,并且电阻器和二极管中的一个的另一个端子电连接到布线。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120063205A1
    • 2012-03-15
    • US13230093
    • 2011-09-12
    • Takanori MatsuzakiShuhei NagatsukaHiroki Inoue
    • Takanori MatsuzakiShuhei NagatsukaHiroki Inoue
    • G11C11/24
    • H01L27/1052G11C8/08G11C11/403G11C11/405G11C11/4085G11C16/02G11C16/0433G11C16/0483G11C16/08G11C2211/4016
    • A semiconductor device in which stored data can be held even when power is not supplied and there is no limitation on the number of writing operations is provided. A semiconductor device is formed using a material which can sufficiently reduce the off-state current of a transistor, such as an oxide semiconductor material that is a wide-gap semiconductor. When a semiconductor material which can sufficiently reduce the off-state current of a transistor is used, the semiconductor device can hold data for a long period. In addition, by providing a capacitor or a noise removal circuit electrically connected to a write word line, a signal such as a short pulse or a noise input to a memory cell can be reduced or removed. Accordingly, a malfunction in which data written into the memory cell is erased when a transistor in the memory cell is instantaneously turned on can be prevented.
    • 即使在不提供电力的情况下也可以保存存储的数据,并且没有限制写入操作的数量的半导体装置。 使用可以充分降低诸如作为宽间隙半导体的氧化物半导体材料的晶体管的截止电流的材料形成半导体器件。 当使用可以充分降低晶体管的截止电流的半导体材料时,半导体器件可以长期保存数据。 此外,通过提供电连接到写字线的电容器或噪声去除电路,可以减少或去除诸如短脉冲或输入到存储器单元的噪声的信号。 因此,可以防止当存储单元中的晶体管瞬间导通时擦除写入存储单元的数据的故障。
    • 10. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07919861B2
    • 2011-04-05
    • US12510603
    • 2009-07-28
    • Takanori Matsuzaki
    • Takanori Matsuzaki
    • H01L29/40
    • H01L23/5225H01L23/552H01L27/124H01L27/13H01L29/78624H01L29/78633H01L2223/6677H01L2924/0002H01L2924/12044H01L2924/3011H01L2924/00
    • The invention provides a technology for manufacturing a higher performance and higher reliability semiconductor device at low cost and with high yield. The semiconductor device of the invention has a first conductive layer over a first insulating layer; a second insulating layer over the first conductive layer, which includes an opening extending to the first conductive layer; and a signal wiring layer for electrically connecting an integrated circuit portion to an antenna and a second conductive layer adjacent to the signal wiring layer, which are formed over the second insulating layer. The second conductive layer is in contact with the first conductive layer through the opening, and the first conductive layer overlaps the signal wiring layer with the second insulating layer interposed therebetween.
    • 本发明提供了以低成本和高产率制造更高性能和更高可靠性的半导体器件的技术。 本发明的半导体器件在第一绝缘层上具有第一导电层; 在第一导电层上的第二绝缘层,其包括延伸到第一导电层的开口; 以及用于将集成电路部分电连接到天线的信号布线层和与所述信号布线层相邻的第二导电层,所述第二导电层形成在所述第二绝缘层上。 第二导电层通过开口与第一导电层接触,并且第一导电层与信号布线层重叠,其间插入第二绝缘层。