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1. 发明申请

US20080143366A1 Contact Pin Probe Card and Electronic Device Test Apparatus Using Same 失效
标题翻译：接触针探针卡和电子设备测试仪器使用相同
公开(公告)号：US20080143366A1
公开(公告)日：2008-06-19
申请号：US10566463
申请日：2004-12-14
申请人： Fumio Kurotori , Takaji Ishikawa , Tadao Saito
发明人： Fumio Kurotori , Takaji Ishikawa , Tadao Saito
IPC分类号： G01R31/02
CPC分类号： G01R1/07371 , G01R1/06722 , G01R1/06727 , G01R1/06738 , G01R1/06761
摘要： A contact pin (50) for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer (51b) composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer (51c) composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material (51a) with the first conductive layer (51b) and second conductive layer (51c) formed at the outside, the first conductive layer (51b) being formed so as to closely contact the outside of the second conductive layer (51c), the first conductive layer (51b) and second conductive layer (51c) both being exposed at the front end face (50a) of the contact pin (50).
摘要翻译：用于接触晶片的端子并向该晶片提供信号的接触引脚（50）设置有第一导电层（51b），该导电层由具有比形成在端子上的氧化物膜的硬度更高的硬度的第一导电材料构成由具有比氧化物膜低的硬度的第二导电材料构成的第二导电层（51c）以及具有第一导电层（51b）和第二导电层（51b）的基底材料（51a） 51c）形成，第一导电层（51b）形成为紧密接触第二导电层（51c）的外部，第一导电层（51b）和第二导电层（51c））都暴露在接触销（50）的前端面（50a）处。

2. 发明授权

US07667471B2 Contact pin probe card and electronic device test apparatus using same 失效
标题翻译：接触针探针卡和电子设备测试仪使用相同
公开(公告)号：US07667471B2
公开(公告)日：2010-02-23
申请号：US10566463
申请日：2004-12-14
申请人： Fumio Kurotori , Takaji Ishikawa , Tadao Saito
发明人： Fumio Kurotori , Takaji Ishikawa , Tadao Saito
IPC分类号： G01R31/02
CPC分类号： G01R1/07371 , G01R1/06722 , G01R1/06727 , G01R1/06738 , G01R1/06761
摘要： A contact pin (50) for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer (51b) composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer (51c) composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material (51a) with the first conductive layer (51b) and second conductive layer (51c) formed at the outside, the first conductive layer (51b) being formed so as to closely contact the outside of the second conductive layer (51c), the first conductive layer (51b) and second conductive layer (51c) both being exposed at the front end face (50a) of the contact pin (50).
摘要翻译：用于接触晶片的端子并向该晶片提供信号的接触引脚（50）设置有第一导电层（51b），第一导电层（51b）由具有比形成在晶片的端子上的氧化物膜的相对较高的硬度的第一导电材料晶片，具有比氧化膜低的硬度的第二导电材料构成的第二导电层（51c）和形成有第一导电层（51b）的基材（51a）和第二导电层外部，第一导电层（51b）形成为紧密接触第二导电层（51c）的外部，第一导电层（51b）和第二导电层（51c）都在前端面（50）的（50a）。

3. 发明申请

US20050280428A1 Probe card and the production method 有权
标题翻译：探针卡和生产方法
公开(公告)号：US20050280428A1
公开(公告)日：2005-12-22
申请号：US11151664
申请日：2005-06-14
申请人： Takaji Ishikawa , Fumio Kurotori , Tadao Saito
发明人： Takaji Ishikawa , Fumio Kurotori , Tadao Saito
IPC分类号： G01R1/067 , G01R31/02 , G01R31/28 , H01L21/66
CPC分类号： G01R1/06722 , G01R31/2886
摘要： A probe card 1 is composed of a plurality of probe pins 50 having wafer-side plungers 51 at one end portion and substrate-side plungers 52 on the other end side; two probe guides 30 and 40 one above the other for supporting the plurality of probe pins 50, so that the plurality of probe pins 50 are arranged to be corresponding to an arrangement of external terminals of a semiconductor wafer and the wafer-side plungers 51 of the probe pins 50 protrude; a print substrate 10 having pads 13 for the substrate-side plungers 52 of the probe pins 50 supported by the probe guides 30 and 40 to contact; and a stiffener 20 provided on the back surface of the print substrate 10. The probe guides 30 and 40 are produced by a material having substantially the same thermal expansion coefficient as that of the semiconductor wafer, and fixed to the print substrate 10 and the stiffener 20 at the circumferential portion and the center portion. The probe card 1 configured as above is capable of maintaining high precision in needle positions of the probe pins 50 with respect to the external terminals of the semiconductor wafer and the pads 13 of the print substrate 10.
摘要翻译：探针卡1由在一端部具有晶片侧柱塞51和另一端侧的基板侧柱塞52的多个探针50构成。两个探针引导件30和40彼此重叠以支撑多个探针50，使得多个探针50被布置成对应于半导体晶片的外部端子和晶片侧柱塞51的布置探针50突出; 印刷基板10，其具有用于由探针引导件30和40支撑的探针30的基板侧柱塞52的垫13接触; 以及设置在印刷基板10的后表面上的加强件20.探针引导件30和40由具有与半导体晶片基本相同的热膨胀系数的材料制成，并且固定到印刷基板10和加强件 20在圆周部分和中心部分。如上构造的探针卡1能够相对于半导体晶片的外部端子和印刷基板10的焊盘13保持探针30的针位置的高精度。

4. 发明授权

US07482821B2 Probe card and the production method 有权
标题翻译：探针卡和生产方法
公开(公告)号：US07482821B2
公开(公告)日：2009-01-27
申请号：US11151664
申请日：2005-06-14
申请人： Takaji Ishikawa , Fumio Kurotori , Tadao Saito
发明人： Takaji Ishikawa , Fumio Kurotori , Tadao Saito
IPC分类号： G01R31/02
CPC分类号： G01R1/06722 , G01R31/2886
摘要： A probe card 1 is composed of a plurality of probe pins 50 having wafer-side plungers51 at one end portion and substrate-side plungers52 on the other end side; two probe guides 30 and 40 one above the other for supporting the plurality of probe pins 50, so that the plurality of probe pins 50 are arranged to be corresponding to an arrangement of external terminals of a semiconductor wafer and the wafer-side plungers 51 of the probe pins 50 protrude; a print substrate 10 having pads 13 for the substrate-side plungers 52 of the probe pins 50 supported by the probe guides 30 and 40 to contact; and a stiffener 20 provided on the back surface of the print substrate 10.
摘要翻译：探针卡1由在一端部具有晶片侧柱塞51和另一端侧的基板侧柱塞52的多个探针50构成。两个探针引导件30和40彼此重叠以支撑多个探针50，使得多个探针50被布置成对应于半导体晶片的外部端子和晶片侧柱塞51的布置探针50突出; 印刷基板10，其具有用于由探针引导件30和40支撑的探针30的基板侧柱塞52的垫13接触; 以及设置在印刷基板10的背面上的加强件20。

5. 发明授权

US06932635B2 Electronic component testing socket and electronic component testing apparatus using the same 失效
标题翻译：电子元器件测试插座和使用该插座的电子元器件测试仪器
公开(公告)号：US06932635B2
公开(公告)日：2005-08-23
申请号：US10455800
申请日：2003-06-06
申请人： Takaji Ishikawa , Hiroto Nakamura
发明人： Takaji Ishikawa , Hiroto Nakamura
IPC分类号： G01R31/26 , G01R1/04 , G01R1/06 , G01R1/073 , G01R31/01 , G01R31/28 , H01R33/76 , H01R4/60
CPC分类号： G01R31/2863 , G01R1/0408 , G01R1/0458 , G01R31/01
摘要： To control the temperature of an electronic component testing socket without mixing any noise into a test signal to be applied to an electronic component and a respond signal to be read from the electronic component when conducting a test on the electronic component, a first space 67 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas outlet 65 and a gas inlet 76, and a second space 68 in the electronic component testing socket base 6 and a socket body inside space 75 in the electronic component testing socket 7 are connected via a gas inlet 66 and a gas outlet 77.
摘要翻译：为了控制电子部件测试插座的温度，在对电子部件进行测试时，不会将任何噪声混入到要应用于电子部件的测试信号和从电子部件读取的响应信号，第一空间67 电子部件测试用插座基座6和电子部件测试用插座7内的空间75内的插座主体经由气体出口65和气体导入口76连接，电子部件测试用插座基座6的第二空间68与插座电子部件测试插座7中的主体内部空间75经由气体入口66和气体出口77连接。

6. 发明申请

US20050081372A1 Connector connecting /disconnecting tool 失效
标题翻译：连接器连接/断开工具
公开(公告)号：US20050081372A1
公开(公告)日：2005-04-21
申请号：US10505652
申请日：2003-02-25
申请人： Masanori Kaneko , Hiroyuki Hama , Takaji Ishikawa , Shigeru Matsumura
发明人： Masanori Kaneko , Hiroyuki Hama , Takaji Ishikawa , Shigeru Matsumura
IPC分类号： H01R43/26 , B23P19/00
CPC分类号： H01R43/26 , Y10T29/53213 , Y10T29/53217 , Y10T29/53252 , Y10T29/53261 , Y10T29/53265 , Y10T29/53961 , Y10T29/53974 , Y10T29/53978 , Y10T29/53983
摘要： Even when many connectors are provided, all the connectors are easily and surely mated and demated at the same time. There is provided a jig for mating and demating a plurality of connectors mounted on a socket board 10 with and from a plurality of connectors mounted on a motherboard 20 corresponding thereto, and has: an adapter 30 that is arranged opposite to a surface on which semiconductor components are placed and which is different from the surface of the socket board on which the connectors are arranged and is moved forward and backward in a direction in which the connectors are mated and demated; pressing means 40 that is mounted in a protruding manner on the adapter 30 and abuts against the surface of the socket board 10 on which the semiconductor components are placed to press the socket board 10 to the motherboard 20 by lowering the adapter 30; and pulling means 50 each of which is mounted in a protruding manner on the adapter 30 and engages with an engaging hole 16 formed in the socket board 10 and pulls the socket board 10 in the direction in which the socket board 10 is separated from the motherboard 20 by lifting the adapter 30.
摘要翻译：即使提供了许多连接器，所有连接器也可以同时轻松，可靠地配合和分配。提供了一种夹具，用于将安装在插座板10上的多个连接器配置和定位成与安装在与其相对应的母板20上的多个连接器，并具有：适配器30，其布置成与半导体部件被放置并且不同于其上布置有连接器的插座板的表面，并且在连接器配合和分配的方向上向前和向后移动; 按压装置40以突出的方式安装在适配器30上，并抵靠在其上放置半导体部件的插座板10的表面，通过降低适配器30将插座板10推压到母板20; 以及拉动装置50，每个拉伸装置50以突出的方式安装在适配器30上，并与形成在插座板10中的接合孔16接合，并沿着插座板10与母板分离的方向拉动插座板10 20通过提升适配器30。

7. 发明授权

US08134381B2 Connection board, probe card, and electronic device test apparatus comprising same 失效
标题翻译：连接板，探针卡和包括该连接板的电子设备测试装置
公开(公告)号：US08134381B2
公开(公告)日：2012-03-13
申请号：US12532688
申请日：2008-03-18
申请人： Yoshihiro Abe , Takaji Ishikawa , Noriaki Shimasaki , Shigeru Matsumura
发明人： Yoshihiro Abe , Takaji Ishikawa , Noriaki Shimasaki , Shigeru Matsumura
IPC分类号： G01R31/00
CPC分类号： G01R31/2886 , G01R1/07342
摘要： A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
摘要翻译：提供一种探针卡，其包括：电接触形成在半导体晶片W上的IC器件的输入/输出端的探针; 安装有探针的安装基座; 支撑所述安装基座的支撑柱，具有通过接合线电连接到所述探针的互连图案的电路板; 以及用于加强探针卡的基部构件和加强件。安装座和电路板是非接触式的。

8. 发明申请

US20100102837A1 CONNECTION BOARD, PROBE CARD, AND ELECTRONIC DEVICE TEST APPARATUS COMPRISING SAME 失效
标题翻译：连接板，探针卡和电子装置测试装置
公开(公告)号：US20100102837A1
公开(公告)日：2010-04-29
申请号：US12532688
申请日：2008-03-18
申请人： Yoshihiro Abe , Takaji Ishikawa , Noriaki Shimasaki , Shigeru Matsumura
发明人： Yoshihiro Abe , Takaji Ishikawa , Noriaki Shimasaki , Shigeru Matsumura
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R31/2886 , G01R1/07342
摘要： A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.
摘要翻译：提供一种探针卡，其包括：电接触形成在半导体晶片W上的IC器件的输入/输出端的探针; 安装有探针的安装基座; 支撑所述安装基座的支撑柱，具有通过接合线电连接到所述探针的互连图案的电路板; 以及用于加强探针卡的基部构件和加强件。安装座和电路板是非接触式的。

9. 发明授权

US07484285B2 System for mating and demating multiple connectors mounted on board of semiconductor test apparatus 失效
标题翻译：用于配合和定位安装在半导体测试装置的板上的多个连接器的系统
公开(公告)号：US07484285B2
公开(公告)日：2009-02-03
申请号：US10505652
申请日：2003-02-25
申请人： Masanori Kaneko , Hiroyuki Hama , Takaji Ishikawa , Shigeru Matsumura
发明人： Masanori Kaneko , Hiroyuki Hama , Takaji Ishikawa , Shigeru Matsumura
IPC分类号： B25B27/14
CPC分类号： H01R43/26 , Y10T29/53213 , Y10T29/53217 , Y10T29/53252 , Y10T29/53261 , Y10T29/53265 , Y10T29/53961 , Y10T29/53974 , Y10T29/53978 , Y10T29/53983
摘要： A system for mating and demating a plurality of connectors mounted on a socket board with and from a plurality of corresponding connectors mounted on a motherboard includes: an adapter that is arranged above a surface opposite to the socket board surface on which the connectors are arranged and is movable in a direction in which the connectors are mated and demated; pressing means which contacts the surface of the socket board on which the semiconductor components are placed to press the socket board to the motherboard by lowering the adapter; and pulling means each of which engages with an engaging hole formed in the socket board and pulls the socket board in the direction in which the socket board is separated from the motherboard by lifting the adapter.
摘要翻译：一种用于将安装在插座板上的多个连接器和从安装在母板上的多个对应的连接器安装在其上的多个连接器的系统，包括：适配器，其布置在与插座基板表面相对的表面上，连接器布置在该表面上方，可以在连接器配合和排出的方向上移动; 按压装置，其与放置半导体部件的插座板的表面接触，通过降低适配器将插座板压入母板; 以及拉动装置，每个拉动装置与形成在插座板中的接合孔接合，并通过提升适配器而将插座板沿着插座板与母板分离的方向拉动插座板。

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