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    • 5. 发明授权
    • Sensor attachment structure and ultrasonic sensing device
    • 传感器附件结构和超声波感应装置
    • US07490517B2
    • 2009-02-17
    • US11488140
    • 2006-07-18
    • Takahiko YoshidaMakiko SugiuraYasuyuki OkudaYuta Hasebe
    • Takahiko YoshidaMakiko SugiuraYasuyuki OkudaYuta Hasebe
    • G01H5/00
    • G01D11/30G01S7/521
    • A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.
    • 传感器附接结构包括用于接收超声波的声音接收构件,附接到声音接收构件的超声波传感器。 超声波传感器包括具有彼此相对的第一和第二表面的半导体衬底和从半导体衬底的第一表面凹陷的衬底凹部,以在半导体衬底中形成膜。 此外,盖构件位于声音接收构件和半导体衬底之间以覆盖半导体衬底的第二表面。 此外,盖构件具有接合到声音接收构件的第一表面和在膜的外周部分处接合到半导体衬底的第二表面的第二表面,同时在盖构件和盖构件之间具有间隙 膜。
    • 6. 发明申请
    • Sensor attachment structure and ultrasonic sensing device
    • 传感器附件结构和超声波感应装置
    • US20070079661A1
    • 2007-04-12
    • US11488140
    • 2006-07-18
    • Takahiko YoshidaMakiko SugiuraYasuyuki OkudaYuta Hasebe
    • Takahiko YoshidaMakiko SugiuraYasuyuki OkudaYuta Hasebe
    • G01D21/00
    • G01D11/30G01S7/521
    • A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.
    • 传感器附接结构包括用于接收超声波的声音接收构件,附接到声音接收构件的超声波传感器。 超声波传感器包括具有彼此相对的第一和第二表面的半导体衬底和从半导体衬底的第一表面凹陷的衬底凹部,以在半导体衬底中形成膜。 此外,盖构件位于声音接收构件和半导体衬底之间以覆盖半导体衬底的第二表面。 此外,盖构件具有接合到声音接收构件的第一表面和在膜的外周部分处接合到半导体衬底的第二表面的第二表面,同时在盖构件和盖构件之间具有间隙 膜。
    • 9. 发明申请
    • Ultrasonic sensor having vibrator mounted on substrate
    • 具有安装在基板上的振动器的超声波传感器
    • US20070204697A1
    • 2007-09-06
    • US11712511
    • 2007-03-01
    • Kazuaki WatanabeTakahiko YoshidaMakiko SugiuraNoboru EndohYasuyuki Okuda
    • Kazuaki WatanabeTakahiko YoshidaMakiko SugiuraNoboru EndohYasuyuki Okuda
    • G01H11/00
    • G10K9/122
    • An ultrasonic sensor composed of a substrate and a piezoelectric vibrator mounted on the substrate is advantageously used as a sensor for detecting a distance to an object located in front of an automotive vehicle. Ultrasonic waves transmitted from the sensor are reflected by the object, and the reflected waves are received by the sensor. Based on the reflected waves, the distance from the vehicle to the object is calculated. To reduce rigidity and thereby to lower a resonant frequency of the substrate to a desirable level, grooves are formed in the substrate. A thickness of the substrate is not reduced to maintain its mechanical strength against an impact force. A resonant frequency which is desirable to realize a sufficiently high directivity and sensitivity is obtained in this manner without enlarging a size of the ultrasonic sensor.
    • 作为用于检测到位于机动车辆前方的物体的距离的传感器,有利地使用由基板和安装在基板上的压电振动器构成的超声波传感器。 从传感器发射的超声波被物体反射,反射波被传感器接收。 基于反射波,计算从车辆到物体的距离。 为了降低刚性,从而将基板的谐振频率降低到期望的水平,在基板中形成凹槽。 不降低基板的厚度以保持其抵抗冲击力的机械强度。 以这种方式获得期望实现足够高的方向性和灵敏度的共振频率,而不扩大超声波传感器的尺寸。