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    • 4. 发明授权
    • Biaxially drawn laminated films prepared by sequential stretching
    • 通过连续拉伸制备的双轴拉伸叠层膜
    • US4690792A
    • 1987-09-01
    • US861571
    • 1986-05-09
    • Hitoshi MatsudaTsuguo OkumuraKazuharu Abe
    • Hitoshi MatsudaTsuguo OkumuraKazuharu Abe
    • B29C55/02B29C55/14B29K7/00B29K55/00B29K77/00B29L9/00B32B27/28B29C55/26
    • B29C55/143B29C55/023Y10S264/73Y10T428/3175
    • A biaxially drawn laminated films having a good oxygen barrier property, a good mechanical strength and high thickness uniformity are made by a process comprising:a first step of forming a substantially amorphous unoriented laminated film comprising a saponified ethylene/vinyl acetate copolymer having an ethylene content of 25 to 45 mole % and a polyamide, and drawing the film in the longitudinal direction at a deformation rate of at least 10,000%/min and a draw ratio of 2.7 to 3.5 at 45.degree. to 65.degree. C. by using a roll drawing machine;a second step of transferring the film drawn at the first step to the transverse drawing-initiating point of a tenter type transverse drawing machine, expanding the width of the film at an angle of not larger than 6.degree. with respect to the central line of the film at least until the mechanically set ratio of the tenter clip distance to the original distance becomes at least 1.4 while maintaining the temperature of the tenter clips at a level lower than the temperature of the film and drawing the film in the transverse direction at an average deformation rate of 2,000 to 10,000%/min and a draw ratio of 3 to 5 under temperature conditions such that, from the transverse drawing-initiating point, the temperature of the film is elevated stepwise so that the temperature of the film is from 70.degree. to 100.degree. C. at the point of termination of the transverse drawing; anda third step of heat-treating the film drawn at the second step at a temperature form 110.degree. C. to the temperature lower by 10.degree. C. than the melting point of the starting polyamide.
    • 具有良好的阻氧性,良好的机械强度和高的厚度均匀性的双轴向拉伸的叠层膜是通过以下方法制备的:第一步骤,形成基本上无定形的未取向的层压膜,其包含乙烯含量为乙烯/ 25〜45摩尔%的聚酰胺和聚酰胺,以45℃〜65℃的变形速度,以45℃〜65℃的拉伸倍率,纵向拉伸薄膜, 机; 将在第一步骤中拉伸的薄膜转印到拉幅机横向拉伸机的横向拉伸起始点的第二步骤,使薄膜的宽度相对于中心线以不大于6°的角度 薄膜至少直到拉幅机夹距离与原始距离的机械设定比例变得至少为1.4,同时将拉幅机夹的温度保持在低于薄膜温度的水平,并将薄膜沿横向拉平 变形率为2000〜10000%/ min,拉伸倍率为3〜5,在横向拉伸起始点,膜的温度逐步升高,膜的温度为70℃ 在横向拉伸终点时为100℃; 以及第三步,在110℃的温度下将在第二步骤中拉伸的薄膜热处理至比原始聚酰胺的熔点低10℃的温度。
    • 8. 发明授权
    • Composite material, method for producing the same, and apparatus for producing the same
    • 复合材料及其制造方法及其制造方法
    • US09028982B2
    • 2015-05-12
    • US12991902
    • 2009-03-02
    • Shinji YaeTatsuya HiranoHitoshi Matsuda
    • Shinji YaeTatsuya HiranoHitoshi Matsuda
    • B32B9/00B32B19/00B32B9/04B32B9/06H01L21/02C23C18/16C23C18/44C23C18/54
    • H01L21/02697C23C18/1651C23C18/1658C23C18/44C23C18/54Y10S977/721Y10S977/779
    • Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate (102), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate (102) is immersed into a second solution (24), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate (102) is covered with the metal or an alloy of the metal (108) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.
    • 公开了一种复合材料,其中硅表面和电镀材料之间的粘附性增强。 还公开了一种用于生产复合材料的方法和装置。 复合材料的制造方法包括:分散/分配步骤,其中将作为至少具有最外层的硅层的基体的硅基板(102)的表面浸入含有金(Au )离子,使得用作第一金属并被硅层的一部分取代的颗粒状或岛状金(Au)分散/分配在基体表面上,以及电镀步骤,其中硅基板(102)浸没 进入第二溶液(24),其含有金(Au)表现出催化剂活性的还原剂和可被还原剂还原的金属离子,使得硅衬底(102)的表面被金属覆盖 或通过使用金(Au)作为起点的自催化无电镀形成的金属(108)的合金。