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1. 发明申请

US20110256662A1 CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME 有权
标题翻译：芯片嵌入式基板及其制造方法
公开(公告)号：US20110256662A1
公开(公告)日：2011-10-20
申请号：US13167203
申请日：2011-06-23
申请人： Takaharu YAMANO , Hajime IIZUKA , Hideaki SAKAGUCHI , Toshio KOBAYASHI , Tadashi ARAI , Tsuyoshi KOBAYASHI , Tetsuya KOYAMA , Kiyoaki IIDA , Tomoaki MASHIMA , Koichi TANAKA , Yuji KUNIMOTO , Takashi YANAGISAWA
发明人： Takaharu YAMANO , Hajime IIZUKA , Hideaki SAKAGUCHI , Toshio KOBAYASHI , Tadashi ARAI , Tsuyoshi KOBAYASHI , Tetsuya KOYAMA , Kiyoaki IIDA , Tomoaki MASHIMA , Koichi TANAKA , Yuji KUNIMOTO , Takashi YANAGISAWA
IPC分类号： H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/56 , H01L21/563 , H01L21/565 , H01L21/6835 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/97 , H01L25/105 , H01L25/16 , H01L25/162 , H01L2221/68345 , H01L2224/0401 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81005 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/85 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/207 , H01L2924/3025 , H01L2924/3511 , H05K1/185 , H05K1/186 , H05K3/20 , H05K3/4614 , H05K3/462 , H05K3/4644 , H05K2201/10007 , H05K2201/10378 , H05K2201/10674 , H05K2201/10977 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00
摘要： A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
摘要翻译：公开了一种制造芯片嵌入式基板的方法。该方法包括将半导体芯片安装在其上形成有第一布线的第一基板上的第一步骤; 以及将第一基板与形成有第二布线的第二基板接合的第二步骤。在第二步骤中，将半导体芯片封装在第一基板和第二基板之间，并且在第一布线和第二布线之间形成电连接，以形成连接到半导体芯片的多层布线。

2. 发明申请

US20120319274A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法和半导体器件
公开(公告)号：US20120319274A1
公开(公告)日：2012-12-20
申请号：US13526821
申请日：2012-06-19
申请人： Koichi TANAKA , Nobuyuki KURASHIMA , Hajime IIZUKA , Tetsuya KOYAMA
发明人： Koichi TANAKA , Nobuyuki KURASHIMA , Hajime IIZUKA , Tetsuya KOYAMA
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/568 , H01L23/3135 , H01L25/105 , H01L2224/16225 , H01L2224/73253 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/3511
摘要： A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad. The resin layer is formed between the mounting surface of the circuit substrate and the support plate and the support plate is subsequently removed, whereby a truncated-cone-shaped via is formed in the resin layer along the truncated-cone-shaped solder layer. A reflow process is thereafter performed, whereby the truncated-cone-shaped solder layer is formed into a spherical solder layer within the truncated-cone-shaped via.
摘要翻译：具有安装有半导体芯片的安装面的电路基板和形成在安装面上的至少一个连接焊盘连接到具有至少一个直径大于连接焊盘直径的安装部分的支撑板上，通过基于安装部分的直径和连接焊盘的直径之间的差异，由至少一个焊球形成的截锥形焊料层。树脂层形成在电路基板的安装面和支撑板之间，随后移除支撑板，从而沿着截锥形焊料层在树脂层中形成截锥形的通孔。此后进行回流工艺，由此截锥锥形焊料层在截锥形通孔内形成球形焊料层。

3. 发明申请

US20130135977A1 OPTICAL PICKUP APPARATUS 审中-公开
公开(公告)号：US20130135977A1
公开(公告)日：2013-05-30
申请号：US13676594
申请日：2012-11-14
申请人： Hajime IIZUKA , Satoshi SEKIGUCHI
发明人： Hajime IIZUKA , Satoshi SEKIGUCHI
IPC分类号： G11B7/1263
CPC分类号： G11B7/1263 , G11B7/12 , G11B7/1275 , G11B2007/0006
摘要： An optical-pickup apparatus includes: a first laser-light source to emit a first laser beam to a first optical disc; a first photodetector to output a first monitor signal indicative of intensity of the first laser beam; a second laser-light source to emit a second laser beam to a second optical disc; a second photodetector to output a second monitor signal indicative of intensity of the second laser beam; a signal-selection unit to select the first monitor signal when recording or reading of information is performed for the first optical disc, and select the second monitor signal when recording or reading of information is performed for the second optical disc; and a signal-transmission unit to transmit, via a common transmission path, the first monitor signal or the second monitor signal selected by the single-selection unit to a control circuit configured to control intensity of the first laser and second laser beams.
摘要翻译：光拾取装置包括：向第一光盘发射第一激光束的第一激光光源; 第一光电检测器，用于输出指示第一激光束强度的第一监视信号; 将第二激光束发射到第二光盘的第二激光光源; 第二光电检测器，用于输出指示第二激光束的强度的第二监视信号; 当对第一光盘执行信息的记录或读取时，选择第一监视信号的信号选择单元，当对第二光盘进行信息的记录或读取时，选择第二监视信号; 以及信号传输单元，用于经由公共传输路径将由单选单元选择的第一监视信号或第二监视信号发送到被配置为控制第一激光和第二激光束的强度的控制电路。

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