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    • 7. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06803619B2
    • 2004-10-12
    • US10615920
    • 2003-07-10
    • Keiji HosotaniKentaro Nakajima
    • Keiji HosotaniKentaro Nakajima
    • H01L2976
    • H01L27/228B82Y10/00
    • A magnetic memory device capable of achieving high reliability and superior operation characteristics of tunneling magneto-resistive (TMR) elements is provided. This magnetic memory device includes a semiconductor substrate, a transistor which is formed above the semiconductor substrate, and a TMR element which is formed on or above an interlayer dielectric film that covers the transistor of the substrate. The device also includes a first wiring line which is buried in the interlayer dielectric film and connected to a source/drain diffusion layer of the transistor, a second wiring line which is buried under the TMR element while overlying the first wiring line within the interlayer dielectric film and which is used to apply a current-created magnetic field to the TMR element during writing, and a third wiring line connected to an upper surface of the TMR element and provided to cross the second wiring line. The third wiring line is for applying a current magnetic field to the TMR element during writing and also for causing a cell current to flow during reading. The second wiring line is formed by patterning techniques so that its both edges are placed outside of a pattern of the TMR element.
    • 提供了能够实现隧道磁阻(TMR)元件的高可靠性和优异的操作特性的磁存储器件。 该磁存储器件包括半导体衬底,形成在半导体衬底上方的晶体管,以及形成在覆盖衬底晶体管的层间绝缘膜上或之上的TMR元件。 该器件还包括埋在层间电介质膜中并连接到晶体管的源极/漏极扩散层的第一布线,埋在TMR元件下面的第二布线,同时覆盖层间电介质中的第一布线 并且其用于在写入期间向TMR元件施加电流产生的磁场,以及第三布线,连接到TMR元件的上表面并且被提供以跨越第二布线。 第三布线用于在写入期间向TMR元件施加电流磁场,并且还用于在读取期间使单元电流流动。 第二布线通过图案化技术形成,使得它的两个边缘被放置在TMR元件的图案之外。