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1. 发明授权

US09781994B2 Wafer cleaning 有权
公开(公告)号：US09781994B2
公开(公告)日：2017-10-10
申请号：US13707947
申请日：2012-12-07
申请人： Taiwan Semiconductor Manufacturing Company Limited
发明人： Shang-Yuan Yu , Ming-Te Chen , Chi-Fu Yu , Shao-Yen Ku , Tzu-Yang Chung , Hsiao Chien-Wen , Shan-Ching Lin
IPC分类号： H01L21/64 , A46B9/00 , A46B11/00 , H01L21/67
CPC分类号： A46B9/00 , A46B11/00 , H01L21/6704 , H01L21/67046
摘要： One or more techniques or systems for cleaning wafers during semiconductor fabrication or an associated brush are provided herein. In some embodiments, the brush includes a brush body and one or more inner hole supports within the brush body. For example, a first inner hole support and a second inner hole support define a first inner hole associated with a first size. For another example, a third inner hole support and a fourth inner hole support define a second inner hole associated with a second size different than the first size. In some embodiments, a cleaning solution is applied to a wafer based on a first flow rate at a first brush position and based on a second flow rate at a second brush position. In this manner, a flow field associated with wafer cleaning is provided, thus enhancing cleaning efficiency, for example.

2. 发明申请

US20140158155A1 WAFER CLEANING 有权
公开(公告)号：US20140158155A1
公开(公告)日：2014-06-12
申请号：US13707947
申请日：2012-12-07
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
发明人： Shang-Yuan Yu , Ming-Te Chen , Chi-Fu Yu , Shao-Yen Ku , Tzu-Yang Chung , Hsiao Chien-Wen , Shan-Ching Lin
IPC分类号： B08B1/00 , A46B9/00
CPC分类号： A46B9/00 , A46B11/00 , H01L21/6704 , H01L21/67046
摘要： One or more techniques or systems for cleaning wafers during semiconductor fabrication or an associated brush are provided herein. In some embodiments, the brush includes a brush body and one or more inner hole supports within the brush body. For example, a first inner hole support and a second inner hole support define a first inner hole associated with a first size. For another example, a third inner hole support and a fourth inner hole support define a second inner hole associated with a second size different than the first size. In some embodiments, a cleaning solution is applied to a wafer based on a first flow rate at a first brush position and based on a second flow rate at a second brush position. In this manner, a flow field associated with wafer cleaning is provided, thus enhancing cleaning efficiency, for example.
摘要翻译：本文提供了用于在半导体制造期间清洁晶片或相关联的刷子的一种或多种技术或系统。在一些实施例中，刷子包括刷体和刷体内的一个或多个内孔支撑件。例如，第一内孔支撑件和第二内孔支撑件限定与第一尺寸相关联的第一内孔。另一个例子，第三内孔支撑件和第四内孔支架限定与不同于第一尺寸的第二尺寸相关联的第二内孔。在一些实施例中，基于第一刷位置处的第一流量并且基于在第二刷位置处的第二流量将清洁溶液施加到晶片。以这种方式，提供了与晶片清洁相关联的流场，从而提高了清洁效率。

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