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1. 发明授权

US07626548B2 Antenna circuit, IC inlet and IC tag 失效
标题翻译：天线电路，IC入口和IC标签
公开(公告)号：US07626548B2
公开(公告)日：2009-12-01
申请号：US11570656
申请日：2005-06-20
申请人： Taiga Matsushita , Yasukazu Nakata , Takakazu Murakami
发明人： Taiga Matsushita , Yasukazu Nakata , Takakazu Murakami
IPC分类号： H01Q1/38 , H01Q1/36
CPC分类号： G06K19/07749 , G06K19/0775
摘要： The present invention discloses:an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
摘要翻译：本发明公开了一种IC入口110，其包括基板2，表面电路，其包括形成在基板上的普通线圈电路部分6和与平板线圈电路部分6的两端单独连接的相对电极8和12，以及与相对电极连接安装的IC芯片16，其中形成在所述表面电路的至少一部分中以便通过所述基板和所述表面电路的切断虚线22以及由所述基板和所述表面电路产生的IC标签使用IC入口。

2. 发明申请

US20080036677A1 Antenna Circuit, Ic Inlet and Ic Tag 失效
标题翻译：天线电路，Ic入口和Ic标签
公开(公告)号：US20080036677A1
公开(公告)日：2008-02-14
申请号：US11570656
申请日：2005-06-20
申请人： Taiga Matsushita , Yasukazu Nakata , Takakazu Murakami
发明人： Taiga Matsushita , Yasukazu Nakata , Takakazu Murakami
IPC分类号： H01Q7/00
CPC分类号： G06K19/07749 , G06K19/0775
摘要： The present invention discloses: an IC inlet 110 which comprises a substrate 2, a surface circuit including a plain coil circuit portion 6 formed on the substrate and opposed electrodes 8 and 12 individually connected with the two ends of the plain coil circuit portion 6, and an IC chip 16 mounted in connection with the opposed electrodes, wherein a cut-away broken line 22 formed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.
摘要翻译：本发明公开了一种IC入口110，其包括基板2，表面电路，其包括形成在基板上的普通线圈电路部分6和与平板线圈电路部分6的两端单独连接的相对电极8和12，以及与相对电极连接安装的IC芯片16，其中形成在所述表面电路的至少一部分中以便通过所述基板和所述表面电路的切断虚线22以及由所述基板和所述表面电路产生的IC标签使用IC入口。

3. 发明授权

US07294917B2 IC tag 有权
标题翻译： IC标签
公开(公告)号：US07294917B2
公开(公告)日：2007-11-13
申请号：US10535843
申请日：2003-11-20
申请人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
发明人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
IPC分类号： H01L23/02
CPC分类号： G06K19/0776 , G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，该IC标签具有层叠在基板的表面上的第一粘合剂层，包含旁路线的电路线和连接到电子电路的IC芯片的电子电路，第一粘合剂层的表面，层叠以覆盖电子电路和IC芯片的第二粘合剂层，以及部分地形成在与由电子电路和IC芯片组成的电路部分对应的位置形成的脱模剂层，所述基板和所述第一粘合层之间的界面，其中，在所述旁路管线与所述电路线之间的连接处的所述旁路管线的切线与所述连接处的所述电路线的切线所形成的角度为10度以上。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

4. 发明申请

US20060201703A1 Flip chip mounting substrate 有权
标题翻译：倒装芯片安装基板
公开(公告)号：US20060201703A1
公开(公告)日：2006-09-14
申请号：US10567358
申请日：2004-07-30
申请人： Yasukazu Nakata , Katsuyoshi Matsuura , Taiga Matsushita
发明人： Yasukazu Nakata , Katsuyoshi Matsuura , Taiga Matsushita
IPC分类号： H05K1/18
CPC分类号： H01L23/49838 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
摘要翻译：本发明提供了一种倒装芯片安装基板，其包括由电路线构成的电子电路和连接到形成在基片的一个表面上的电路线的两端的多个安装焊盘，其中多个安装焊盘彼此面对，间隔开垫间隙，并且在安装垫中形成一个或多个半导体安装膏引导路径。当在倒装芯片安装基板上倒装芯片安装IC芯片时，倒装芯片安装基板可以减少半导体安装膏中可能产生的空隙。

5. 发明授权

US07397672B2 Flip chip mounting substrate 有权
标题翻译：倒装芯片安装基板
公开(公告)号：US07397672B2
公开(公告)日：2008-07-08
申请号：US10567358
申请日：2004-07-30
申请人： Yasukazu Nakata , Katsuyoshi Matsuura , Taiga Matsushita
发明人： Yasukazu Nakata , Katsuyoshi Matsuura , Taiga Matsushita
IPC分类号： H05K1/02 , H05K7/02
CPC分类号： H01L23/49838 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
摘要翻译：本发明提供了一种倒装芯片安装基板，其包括由电路线构成的电子电路和连接到形成在基片的一个表面上的电路线的两端的多个安装焊盘，其中多个安装焊盘彼此面对，间隔开垫间隙，并且在安装垫中形成一个或多个半导体安装膏引导路径。当在倒装芯片安装基板上倒装芯片安装IC芯片时，倒装芯片安装基板可以减少半导体安装膏中可能产生的空隙。

6. 发明授权

US06853286B2 Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag 失效
标题翻译：扁平线圈部件，扁平线圈部件的特性调整方法，ID标签，ID标签的特性调整方法
公开(公告)号：US06853286B2
公开(公告)日：2005-02-08
申请号：US10141976
申请日：2002-05-10
申请人： Yoshio Nikawa , Taiga Matsushita , Yasukazu Nakata , Yuichi Iwakata
发明人： Yoshio Nikawa , Taiga Matsushita , Yasukazu Nakata , Yuichi Iwakata
IPC分类号： B42D15/10 , G06K19/07 , G06K19/077 , H01F5/00 , H01F17/00 , H01F21/12 , H01F41/04 , H01Q7/00
CPC分类号： G06K19/0726 , G06K19/07749 , H01F5/003 , H01F21/12 , H01F41/045 , Y10T29/4902
摘要： To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.
摘要翻译：呈现包括扁平线圈分量的ID标签，以及能够抑制关于期望特性的产品波动的ID标签的特性调整方法。本发明的ID标签的扁平线圈部件包括由在绝缘基板上连续且螺旋地设置的导电材料构成的扁平线圈，以及设置在具有绝缘的扁平线圈上的跳线，从该端子的内端或外端扁平线圈到平线圈的外部或内部，其中另一端被定位，其中跳线由多个可调节的多个跳线组成。通过改变用于形成平行布置的有效片的数量来调整特性。

7. 发明申请

US20060139174A1 Ic tag 有权
标题翻译： Ic标签
公开(公告)号：US20060139174A1
公开(公告)日：2006-06-29
申请号：US10535843
申请日：2003-11-20
申请人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
发明人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
IPC分类号： G08B13/14
CPC分类号： G06K19/0776 , G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，该IC标签具有层叠在基板的表面上的第一粘合剂层，包含旁路线的电路线和连接到电子电路的IC芯片的电子电路，第一粘合剂层的表面，层叠以覆盖电子电路和IC芯片的第二粘合剂层，以及部分地形成在与由电子电路和IC芯片组成的电路部分对应的位置形成的脱模剂层，所述基板和所述第一粘合层之间的界面，其中，在所述旁路管线与所述电路线路之间的连接处的所述旁路管线的切线与所述连接处的所述电路线的切线所形成的角度为10度以上。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

8. 发明授权

US07804021B2 Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof 有权
标题翻译：透光太阳能电池模块及其制造方法及其太阳能电池板
公开(公告)号：US07804021B2
公开(公告)日：2010-09-28
申请号：US11678377
申请日：2007-02-23
申请人： Kazuya Katoh , Yasukazu Nakata
发明人： Kazuya Katoh , Yasukazu Nakata
IPC分类号： H01L31/052
CPC分类号： H01L31/042 , H01L31/02008 , H01L31/043 , H01L31/0508 , H01L31/0547 , Y02E10/52
摘要： A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a mirror electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the mirror electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the mirror electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.
摘要翻译：一种透光太阳能电池模块，包括：太阳能电池单元，其包括透明基板，设置在所述透明基板的一部分表面上的镜电极层和设置在所述镜电极层上的太阳能电池单元，水平; 电连接到设置在太阳能电池部分的表面侧的电极的第一连接线; 以及电连接到镜电极层的第二连接线，其中太阳能电池单元被布置成使得从一侧进入的光撞击任意太阳能电池单元的太阳能电池部分并被反射，并且反射光到达另一侧通过由与任意的太阳能电池单元相邻配置的太阳能电池单元的镜面电极层反射。

9. 发明申请

US20130328038A1 PHOSPHORESCENT MATERIAL, PROCESS FOR PRODUCING PHOSPHORESCENT MATERIAL, AND PHOSPHORESCENT ELEMENT 审中-公开
标题翻译：磷光体材料，生产磷光材料的方法和磷光体元素
公开(公告)号：US20130328038A1
公开(公告)日：2013-12-12
申请号：US14000283
申请日：2012-03-05
申请人： Masatsugu Taneda , Chihaya Adachi , Takuma Yasuda , Manabu Nakata , Yasukazu Nakata
发明人： Masatsugu Taneda , Chihaya Adachi , Takuma Yasuda , Manabu Nakata , Yasukazu Nakata
IPC分类号： H01L51/00
CPC分类号： H01L51/0087 , C07D213/16 , C07F5/02 , C07F15/0086 , C09K11/06 , C09K2211/1007 , C09K2211/1014 , C09K2211/1029 , C09K2211/185 , H01L51/0072 , H01L51/008 , H01L51/009 , H01L51/5016
摘要： Provided are a phosphorescent material which is excellent in horizontal orientation and the like when a thin film is formed, a process for efficiently producing the phosphorescent material, and a light emitting element using the phosphorescent material.The present invention provides a phosphorescent material represented by the following general formula (1), a process for producing the phosphorescent material, and a light emitting element using the phosphorescent material, wherein the phosphorescent material has a straight-chain conjugated structure, a 2-phenylpyridine ligand, a central metal and a β-diketone-type ligand, In the general formula (1), end substituents R1 and R2 each is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or the like, substituents a to l and o to s each is a hydrogen atom or the like, the central metal M is platinum or the like, and repetition numbers m and n each is an integer of 0 to 4.
摘要翻译：提供了当形成薄膜时水平取向等优异的磷光材料，有效地制造磷光材料的方法和使用磷光材料的发光元件。本发明提供由以下通式（1）表示的磷光材料，磷光材料的制造方法和使用该磷光材料的发光元件，其中，磷光发光材料具有直链共轭结构，2- 苯基吡啶配体，中心金属和β-二酮型配体在通式（1）中，末端取代基R 1和R 2各自为氢原子，具有1〜20个碳原子的烷基等，取代基a 至l和o各自为氢原子等，中心金属M为铂等，重复数m和n各自为0〜4的整数。

10. 发明申请

US20100101629A1 Light Transmissible Solar Cell Module, Process for Manufacturing Same, and Solar Cell Panel Thereof 有权
标题翻译：光传输太阳能电池模块，其制造方法及其太阳能电池板
公开(公告)号：US20100101629A1
公开(公告)日：2010-04-29
申请号：US12648878
申请日：2009-12-29
申请人： Kazuya Katoh , Yasukazu Nakata
发明人： Kazuya Katoh , Yasukazu Nakata
IPC分类号： H01L31/042 , H01L31/02
CPC分类号： H01L31/042 , H01L31/02008 , H01L31/043 , H01L31/0508 , H01L31/0547 , Y02E10/52
摘要： A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a minor electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the minor electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the minor electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.
摘要翻译：一种透光太阳能电池模块，包括：太阳能电池单元，其包括透明基板，设置在所述透明基板的一部分表面上的次要电极层和设置在所述次要电极层上的太阳能电池单元，水平; 电连接到设置在太阳能电池部分的表面侧的电极的第一连接线; 以及电连接到镜电极层的第二连接线，其中太阳能电池单元被布置成使得从一侧进入的光撞击任意太阳能电池单元的太阳能电池部分并被反射，并且反射光到达另一侧被邻近任意的太阳能电池单元布置的太阳能电池单元的次要电极层反射。

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