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1. 发明授权

US09048525B2 Antenna circuit 有权
标题翻译：天线电路
公开(公告)号：US09048525B2
公开(公告)日：2015-06-02
申请号：US12918257
申请日：2009-02-17
申请人： Taiga Matsushita , Katsumi Katakura , Takakazu Murakami , Masateru Yamakage
发明人： Taiga Matsushita , Katsumi Katakura , Takakazu Murakami , Masateru Yamakage
IPC分类号： H01Q7/00 , G06K19/07 , G08B13/14 , G06K19/073 , G06K19/077 , H01Q1/22 , H01Q1/38 , H01Q1/50 , H01Q9/27
CPC分类号： H01Q7/00 , G06K19/07381 , G06K19/07749 , G06K19/0776 , H01Q1/2208 , H01Q1/38 , H01Q1/50 , H01Q9/27
摘要： An antenna circuit which includes a substrate and a planar circuit with a circuit line of a conductive material formed on a surface of the substrate, and at least one conductive pad (notch-forming part) electrically connected with the circuit line of the planar circuit. Cutting lines, such as perforations, are provided in the substrate around an outer periphery of the notch-forming part and extend into the notch-forming part on either side of connection points where the circuit line connects with the notch-forming part, The cutting lines approach each other in the notch-forming part to form a section (notch port). The antenna circuit can be destroyed even if an IC tag provided with the antenna circuit is peeled off from various directions, and the destruction rate of the circuit can be increased stably.
摘要翻译：一种天线电路，其包括基板和平面电路，所述平面电路具有形成在所述基板的表面上的导电材料的电路线以及与所述平面电路的电路线电连接的至少一个导电焊盘（切口形成部）。在基板周围的切口形成部的外周设有切割线，并且延伸到电路线与切口形成部连接的连接点的两侧的切口形成部。切割在凹口形成部分中线彼此接近以形成截面（凹口）。即使设置有天线电路的IC标签从各个方向剥离，天线电路也可能被破坏，并且可以稳定地提高电路的破坏率。

2. 发明授权

US07540427B2 IC tag 失效
标题翻译： IC标签
公开(公告)号：US07540427B2
公开(公告)日：2009-06-02
申请号：US10514495
申请日：2003-05-14
申请人： Masateru Yamakage , Katsuhisa Taguchi , Tomoyuki Hasegawa , Toru Takahara
发明人： Masateru Yamakage , Katsuhisa Taguchi , Tomoyuki Hasegawa , Toru Takahara
IPC分类号： G06K19/06
CPC分类号： G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，其具有包括形成在基板的表面上的第一粘合层，连接电子电路的两端的电子电路和IC芯片，二者形成在第一粘合层的表面上以及覆盖电子电路和IC芯片的第二粘合层。 IC标签还包括形成在对应于电子电路的两端的位置并且位于基板和第一粘合剂层之间的界面处的脱模剂层。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

3. 发明申请

US20100328162A1 ANTENNA CIRCUIT 有权
标题翻译：天线电路
公开(公告)号：US20100328162A1
公开(公告)日：2010-12-30
申请号：US12918257
申请日：2009-02-17
申请人： Taiga Matsushita , Katsumi Katakura , Takakazu Murakami , Masateru Yamakage
发明人： Taiga Matsushita , Katsumi Katakura , Takakazu Murakami , Masateru Yamakage
IPC分类号： H01Q1/38
CPC分类号： H01Q7/00 , G06K19/07381 , G06K19/07749 , G06K19/0776 , H01Q1/2208 , H01Q1/38 , H01Q1/50 , H01Q9/27
摘要： The present invention provides an antenna circuit which comprises a substrate, a planar circuit consisting of a circuit line of a conductive material formed on a surface of the substrate, and at least one notch-forming part connected with the circuit line of the planar circuit, wherein cutting lines are provided in the substrate around an outer periphery of the notch-forming part, each of the cutting lines on both sides of the circuit line connected with the notch-forming part are extended in the direction of the inside of the notch-forming part from the outside of the notch-forming part, up to the substrate and the notch-forming part, and the cutting lines are approached each other in the notch-forming part to form a notch part. The antenna circuit can be destroyed even if an IC tag comprising the antenna circuit is peeled off from various direction, and the destruction rate of the circuit can be increased stably.
摘要翻译：本发明提供一种天线电路，包括基板，由形成在基板的表面上的导电材料的电路线构成的平面电路以及与平面电路的电路线连接的至少一个切口形成部，其特征在于，在所述基板周围的切口形成部的外周设置有切割线，与所述切口形成部连接的所述电路线的两侧的切断线在所述切口形成部的内侧的方向延伸，从凹口形成部分的外部形成部分直到基板和切口形成部分，并且切口线在凹口形成部分中彼此接近以形成切口部分。即使包括天线电路的IC标签从各个方向剥离，天线电路也可能被破坏，并且可以稳定地提高电路的破坏率。

4. 发明授权

US07294917B2 IC tag 有权
标题翻译： IC标签
公开(公告)号：US07294917B2
公开(公告)日：2007-11-13
申请号：US10535843
申请日：2003-11-20
申请人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
发明人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
IPC分类号： H01L23/02
CPC分类号： G06K19/0776 , G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，该IC标签具有层叠在基板的表面上的第一粘合剂层，包含旁路线的电路线和连接到电子电路的IC芯片的电子电路，第一粘合剂层的表面，层叠以覆盖电子电路和IC芯片的第二粘合剂层，以及部分地形成在与由电子电路和IC芯片组成的电路部分对应的位置形成的脱模剂层，所述基板和所述第一粘合层之间的界面，其中，在所述旁路管线与所述电路线之间的连接处的所述旁路管线的切线与所述连接处的所述电路线的切线所形成的角度为10度以上。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

5. 发明申请

US20060139174A1 Ic tag 有权
标题翻译： Ic标签
公开(公告)号：US20060139174A1
公开(公告)日：2006-06-29
申请号：US10535843
申请日：2003-11-20
申请人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
发明人： Taiga Matsushita , Masateru Yamakage , Yasukazu Nakata
IPC分类号： G08B13/14
CPC分类号： G06K19/0776 , G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，该IC标签具有层叠在基板的表面上的第一粘合剂层，包含旁路线的电路线和连接到电子电路的IC芯片的电子电路，第一粘合剂层的表面，层叠以覆盖电子电路和IC芯片的第二粘合剂层，以及部分地形成在与由电子电路和IC芯片组成的电路部分对应的位置形成的脱模剂层，所述基板和所述第一粘合层之间的界面，其中，在所述旁路管线与所述电路线路之间的连接处的所述旁路管线的切线与所述连接处的所述电路线的切线所形成的角度为10度以上。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

6. 发明授权

US06927099B2 Process for producing semiconductor device and semiconductor device 失效
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US06927099B2
公开(公告)日：2005-08-09
申请号：US10871290
申请日：2004-06-17
申请人： Yasukazu Nakata , Masateru Yamakage , Naoki Hasegawa
发明人： Yasukazu Nakata , Masateru Yamakage , Naoki Hasegawa
IPC分类号： G02B27/18 , G03B21/10 , G03B21/14 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/29 , H01L21/44
CPC分类号： H01L23/293 , H01L21/563 , H01L24/31 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83859 , H01L2224/83874 , H01L2224/83951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A process for producing a semiconductor device which comprises, in a process comprising mounting a semiconductor element in accordance with a flip chip bonding process, bonding the semiconductor element to a circuit board with a thermosetting resin, coating peripheral portions of the bonded semiconductor element with a photocurable resin and forming a fillet by photocuring the photocurable resin; and a semiconductor device comprising a semiconductor element mounted on a circuit board in accordance with a flip chip bonding process, wherein the semiconductor element is bonded to the circuit board with a thermosetting resin at portions directly under the semiconductor element, and a fillet is formed with a photocurable resin at peripheral portions of the semiconductor element. The semiconductor device can be efficiently produced in accordance with the flip chip bonding process and exhibits excellent resistance to heat and moisture and reliability.
摘要翻译：一种制造半导体器件的方法，包括在根据倒装芯片接合工艺安装半导体元件的工艺中，将半导体元件与热固性树脂接合到电路板上，将接合的半导体元件的周边部分用光固化树脂，并通过光固化光固化树脂形成圆角; 以及半导体器件，其包括根据倒装芯片接合工艺安装在电路板上的半导体元件，其中半导体元件在半导体元件正下方的部分处用热固性树脂粘合到电路板上，并且形成具有半导体元件的周边部分的光固化树脂。可以根据倒装芯片接合工艺有效地制造半导体器件，并且显示出优异的耐热湿度和可靠性。

7. 发明申请

US20050009241A1 Process for producing semiconductor device and semiconductor device 失效
公开(公告)号：US20050009241A1
公开(公告)日：2005-01-13
申请号：US10871290
申请日：2004-06-17
申请人： Yasukazu Nakata , Masateru Yamakage , Naoki Hasegawa
发明人： Yasukazu Nakata , Masateru Yamakage , Naoki Hasegawa
IPC分类号： G02B27/18 , G03B21/10 , G03B21/14 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/29 , H01L21/44 , H01L21/00 , H01L21/48 , H01L21/84
CPC分类号： H01L23/293 , H01L21/563 , H01L24/31 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83859 , H01L2224/83874 , H01L2224/83951 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： A process for producing a semiconductor device which comprises, in a process comprising mounting a semiconductor element in accordance with a flip chip bonding process, bonding the semiconductor element to a circuit board with a thermosetting resin, coating peripheral portions of the bonded semiconductor element with a photocurable resin and forming a fillet by photocuring the photocurable resin; and a semiconductor device comprising a semiconductor element mounted on a circuit board in accordance with a flip chip bonding process, wherein the semiconductor element is bonded to the circuit board with a thermosetting resin at portions directly under the semiconductor element, and a fillet is formed with a photocurable resin at peripheral portions of the semiconductor element. The semiconductor device can be efficiently produced in accordance with the flip chip bonding process and exhibits excellent resistance to heat and moisture and reliability.

8. 发明申请

US20060273179A1 Ic tag 失效
标题翻译： Ic标签
公开(公告)号：US20060273179A1
公开(公告)日：2006-12-07
申请号：US10514495
申请日：2003-05-14
申请人： Masateru Yamakage , Katsuhisa Taguchi , Tomoyuki Hasegawa , Toru Takahara
发明人： Masateru Yamakage , Katsuhisa Taguchi , Tomoyuki Hasegawa , Toru Takahara
IPC分类号： G06K19/06 , G06K19/02
CPC分类号： G06K19/0739 , G06K19/07749
摘要： The present invention provides an IC tag which has a structure comprising a first adhesive layer formed on a surface of a substrate sheet, an electronic circuit and an IC chip connecting both ends of the electronic circuit, both formed on the surface of the first adhesive layer, and a second adhesive layer covering the electronic circuit and the IC chip. The IC tag further includes a release agent layer formed at positions corresponding to the both ends of the electronic circuit and located at the interface between the substrate sheet and the first adhesive layer. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.
摘要翻译：本发明提供一种IC标签，其具有包括形成在基板的表面上的第一粘合层，连接电子电路的两端的电子电路和IC芯片，二者形成在第一粘合层的表面上以及覆盖电子电路和IC芯片的第二粘合层。 IC标签还包括形成在对应于电子电路的两端的位置并且位于基板和第一粘合剂层之间的界面处的脱模剂层。当附着在物品上的IC标签被剥离时，内置的电子电路肯定会损坏。

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