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    • 2. 发明申请
    • Positively photosensitive resin composition and method of pattern formation
    • 积极感光树脂组合物和图案形成方法
    • US20050147914A1
    • 2005-07-07
    • US10510704
    • 2003-04-18
    • Tadashi HatanakaTakayasu Nihira
    • Tadashi HatanakaTakayasu Nihira
    • G03C1/76G03F7/00G03F7/022G03F7/023G03F7/039G03F7/40
    • G03F7/0233G03F7/0007G03F7/0226
    • The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
    • 本发明提供一种能够以通常浓度的四甲基氢氧化铵水溶液显影,具有高灵敏度和优异分辨率的正型感光性树脂组合物,耐热性,平坦化性,透明性,低吸水性等优异。 此外,本发明提供一种通过使用该组合物任意形成具有半圆形或梯形截面的图案的方法。 本发明的正型感光性树脂组合物包含碱溶性树脂,1,2-醌二叠氮化合物,具有至少两个环氧基的交联化合物和表面活性剂,碱溶性树脂是包含羧酸的共聚物 基团的丙烯酸类单体,含羟基的丙烯酸类单体和N-取代的马来酰亚胺作为必需成分。 通过改变后烘烤条件,组合物可任意形成具有半圆形或梯形截面的图案。
    • 3. 发明授权
    • Positive photosensitive polyimide resin composition
    • 正光敏聚酰亚胺树脂组合物
    • US06875554B2
    • 2005-04-05
    • US10381736
    • 2001-10-03
    • Tadashi HatanakaTomonari NakayamaTakayasu Nihira
    • Tadashi HatanakaTomonari NakayamaTakayasu Nihira
    • G03F7/037C08G73/10C08L79/08G03F7/022G03F7/023G03F7/004G03F7/038
    • G03F7/0233
    • A positive photosensitive polyimide resin composition comprising: (a) a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one solvent solubilizing functional group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, (b) a photosensitive orthoquinonediazide compound, and (c) from 0.1 to 50 wt %, based on the total weight of all polymers of the composition, of a component (c1) or (c2), wherein: component (c1) is a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, and component (c2) is a polyamic acid comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g.
    • 一种正型光敏聚酰亚胺树脂组合物,其包含:(a)由1至100摩尔%的衍生自二胺的二价有机基团的溶剂可溶性聚酰亚胺,其具有至少一种溶剂增溶官能团,所述聚酰亚胺具有比浓粘度 范围为0.05至5.0dl / g,(b)光敏正二叠氮化合物,和(c)基于组合物的所有聚合物的总重量,0.1至50重量%的组分(c1)或(c2) 其中:成分(c1)是由1〜100摩尔%的来自二胺的二价有机基团构成的溶剂可溶性聚酰亚胺,其具有至少1个选自由以下组成的组中的官能团:长链烷基, 至少6个碳原子和氟化烷基,所述聚酰亚胺的比浓粘度范围为0.05-5.0dl / g,组分(c2)是由1至100mol%的衍生自 二胺,至少有o 选自具有至少6个碳原子的长链烷基和氟化烷基的官能团,所述聚酰亚胺的比浓粘度为0.05-5.0dl / g。
    • 4. 发明授权
    • Positively photosensitive resin composition and method of pattern formation
    • 积极感光树脂组合物和图案形成方法
    • US07001705B2
    • 2006-02-21
    • US10510704
    • 2003-04-18
    • Tadashi HatanakaTakayasu Nihira
    • Tadashi HatanakaTakayasu Nihira
    • G03F7/023G03F7/30
    • G03F7/0233G03F7/0007G03F7/0226
    • The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
    • 本发明提供一种能够以通常浓度的四甲基氢氧化铵水溶液显影,具有高灵敏度和优异分辨率的正型感光性树脂组合物,耐热性,平坦化性,透明性,低吸水性等优异。 此外,本发明提供一种通过使用该组合物任意形成具有半圆形或梯形截面的图案的方法。 本发明的正型感光性树脂组合物包含碱溶性树脂,1,2-醌二叠氮化合物,具有至少两个环氧基的交联化合物和表面活性剂,碱溶性树脂是包含羧酸的共聚物 基团的丙烯酸类单体,含羟基的丙烯酸类单体和N-取代的马来酰亚胺作为必需成分。 通过改变后烘烤条件,组合物可任意形成具有半圆形或梯形截面的图案。
    • 6. 发明申请
    • Positive-type photosensitive resin composition and cured film manufactured therefrom
    • 正型感光性树脂组合物及其制造的固化膜
    • US20070020559A1
    • 2007-01-25
    • US11491156
    • 2006-07-24
    • Tadashi Hatanaka
    • Tadashi Hatanaka
    • G03C1/00
    • G03F7/168G03F7/027G03F7/0392G03F7/2004Y10S430/128
    • A positive-type photosensitive resin composition comprising component (A): an alkali-soluble resin having a functional group which undergoes heat crosslinking reaction with a compound of component (B), a functional group for film curing which undergoes thermoset reaction with a compound of component (C), and a number average molecular weight of 2,000 to 30,000; component (B): a compound having two or more vinyl ether groups per molecule; component (C): a compound having two or more blocked isocyanate groups per molecule; component (D): a photoacid generator; and component (E): a solvent. A production process of the positive-type photosensitive resin composition comprising mixing the above-mentioned components and maintaining the mixture at a temperature higher than room temperature. A cured film manufactured by using the positive-type photosensitive resin composition. The composition has a high sensitivity and little film reduction of unexposed part, maintains a high transmittance even after baking at a high temperature or resist stripping treatment, and cause no reduction of film thickness. Therefore, the composition provides a cured film suited as a film material for several displays.
    • 一种正型感光性树脂组合物,其特征在于,含有成分(A):具有与组分(B)的化合物进行热交联反应的官能团的碱溶性树脂,用于膜固化的官能团,其与 组分(C),数均分子量为2,000至30,000; 组分(B):每分子具有两个或多个乙烯基醚基团的化合物; 组分(C):每分子具有两个或多个封端异氰酸酯基团的化合物; 组分(D):光酸产生剂; 和组分(E):溶剂。 正型感光性树脂组合物的制造方法包括混合上述组分并将混合物保持在高于室温的温度。 使用正型感光性树脂组合物制造的固化膜。 该组合物具有高的敏感性和较少的未曝光部分的膜的还原,即使在高温下烘烤或抗蚀剂剥离处理也保持高透射率,并且不会降低膜厚度。 因此,组合物提供适合作为几种显示器的膜材料的固化膜。