专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5194333A Packing material for reversed phase chromatography and process for its preparation 失效
标题翻译：用于反相色谱的包装材料及其制备方法
公开(公告)号：US5194333A
公开(公告)日：1993-03-16
申请号：US629625
申请日：1990-12-18
申请人： Tadao Ohnaka , Katsuo Komiya , Hiroyuki Moriyama
发明人： Tadao Ohnaka , Katsuo Komiya , Hiroyuki Moriyama
IPC分类号： B01J20/286 , B01D15/32 , B01J20/281 , B01J20/32 , G01N30/88
CPC分类号： B01J20/287 , B01D15/325 , B01J20/286 , B01J20/3204 , B01J20/3272 , B01J2220/54 , Y10T428/2995 , Y10T428/31612 , Y10T428/31663
摘要： A packing material for reversed phase chromatography, which comprises silica gel with its entire surface substantially coated with repeating units of a polycarbosilane of the formula (I): ##STR1## wherein R.sub.1 is an octyl group, an octadecyl group or a phenyl group, R.sub.2 is a methyl group or a methylene group, and n is a positive integer.

2. 发明授权

US06618447B1 Multiple signal processing unit for utility wiring by receiver/LAN and utility wiring system by receiver/LAN 失效
标题翻译：多路信号处理单元，用于接收器/局域网的公共事业接线和接收器/局域网的公用接线系统
公开(公告)号：US06618447B1
公开(公告)日：2003-09-09
申请号：US09147884
申请日：1999-03-19
申请人： Tadao Ohnaka , Tetsuo Kawashima , Kensaku Naito
发明人： Tadao Ohnaka , Tetsuo Kawashima , Kensaku Naito
IPC分类号： H04L1218
CPC分类号： H04N7/106 , H03H7/461 , H04N7/108 , H04N7/173 , H04N7/17309
摘要： A unit which processes multiple signals transmitted through utility wiring by receiver/LAN has a utility wiring connecting terminal (10) connected to the utility wiring by receiver/LAN, at least one input-output terminal for connecting computer (11) connected to the terminal (10), and at least one input-output terminal for connecting receiver (12) connected to the terminal (10). First signal interference preventing circuits (13 and 19) are respectively connected between the terminal (10) and the input-output terminal (12) so as to check the reverse flow of LAN signals. Therefore, signals for a television receiver, etc., and LAN signals can be transmitted through a coaxial cable for television, etc., wired in an already existing building without causing interference between the signals.
摘要翻译：通过接收器/ LAN处理通过公用布线传输的多个信号的单元具有通过接收器/ LAN连接到公用布线的公用设施接线端子（10），用于连接到终端的计算机（11）的至少一个输入 - 输出端子（10），以及用于连接到终端（10）的接收机（12）的至少一个输入输出端子。第一信号干扰防止电路（13和19）分别连接在终端（10）和输入 - 输出端（12）之间，以便检查LAN信号的反向流。因此，用于电视接收机等的信号和LAN信号可以通过布线在现有建筑物中的电视等的同轴电缆传输，而不会引起信号之间的干扰。

3. 发明授权

US5445698A Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a multilayer circuit board 失效
标题翻译：制作由形成有铜层的电绝缘性基板构成的内部复合层的方法以及覆盖多层电路基板用铜层的偶联剂膜
公开(公告)号：US5445698A
公开(公告)日：1995-08-29
申请号：US22027
申请日：1993-02-24
申请人： Hidekazu Takano , Tokio Yoshimitsu , Akinori Hibino , Yoshihide Sawa , Motoyuki Toki , Yang Wu , Yuen C. Tak , Tadao Ohnaka
发明人： Hidekazu Takano , Tokio Yoshimitsu , Akinori Hibino , Yoshihide Sawa , Motoyuki Toki , Yang Wu , Yuen C. Tak , Tadao Ohnaka
IPC分类号： B32B15/08 , C08J5/12 , H05K3/38 , H05K3/46 , B32B31/12
CPC分类号： C08J5/12 , B32B15/08 , H05K3/385 , H05K3/389 , C08J2363/00 , H05K2203/0315 , H05K3/382 , H05K3/4611 , Y10T156/10
摘要： An internal composite layer for a multilayer circuit board, which is composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer is fabricated in accordance with the following method. That is, the copper layer is treated with a base or the base and an accelerating agent to supply hydroxyl groups to a surface thereof. Subsequently, thus treated copper layer is coated with the coupling agent, e.g., a silane coupling agent. The coupling agent is chemically bonded to the treated copper layer by the reaction of the hydroxyl groups with the coupling agent, so that an adhesion strength between the copper layer and the coupling agent is remarkably increased. In addition, since it is not necessary for forming a copper oxide layer in the surface of the copper layer, the internal composite layer shows excellent acid resistance without causing a pink-ring which usually occur around a through-hole plating.
摘要翻译：根据以下方法制造由其上形成有铜层的电绝缘基板和覆盖铜层的偶联剂膜构成的用于多层电路板的内部复合层。也就是说，铜层用碱或碱和加速剂处理以向其表面提供羟基。随后，用偶联剂例如硅烷偶联剂涂覆这样处理过的铜层。偶联剂通过羟基与偶联剂的反应与经处理的铜层化学键合，使得铜层和偶联剂之间的粘合强度显着增加。此外，由于不需要在铜层的表面形成氧化铜层，因此内部复合层显示优异的耐酸性，而不会在通孔电镀周围通常发生粉红色环。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式