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1. 发明授权

US4540673A Sintered aluminum nitride and semi-conductor device using the same 失效
标题翻译：烧结氮化铝和半导体器件采用相同的方法
公开(公告)号：US4540673A
公开(公告)日：1985-09-10
申请号：US373150
申请日：1982-04-29
申请人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
发明人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
IPC分类号： C22C29/16 , C04B35/581 , H01L21/318 , H01L23/15 , C04B35/58
CPC分类号： H01L21/318 , C04B35/581 , H01L23/15 , H01L2224/45124 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/14 , Y10T428/12528 , Y10T428/12576 , Y10T428/12583 , Y10T428/12674
摘要： Sintered aluminum nitride having a high thermal conductivity, which comprises at least 65% by weight of aluminum nitride, and at least one of beryllium, a beryllium compound, lithium and a lithium compound, and a semi-conductor device using the same.
摘要翻译：具有高热导率的烧结氮化铝，其包含至少65重量％的氮化铝，以及铍，铍化合物，锂和锂化合物中的至少一种，以及使用其的半导体器件。

2. 发明授权

US4345179A Resistor glass seal spark plug 失效
标题翻译：电阻玻璃密封火花塞
公开(公告)号：US4345179A
公开(公告)日：1982-08-17
申请号：US167450
申请日：1980-07-10
申请人： Tadamichi Asai , Kousuke Nakamura
发明人： Tadamichi Asai , Kousuke Nakamura
IPC分类号： H01T13/38 , H01T13/41 , H01T13/20
CPC分类号： H01T13/41
摘要： A resistor spark plug having, between a terminal screw and a center electrode, electrical conductive glass seals and a resistor glass seal therebetween, said electrical conductive glass seals containing carbon, one or more metals and glass and said resistor glass seal containing carbon, silicon carbide, glass, boron carbide or titanium carbide, and if desired a filler, has a small voltage coefficient of resistance and stable properties and is effective for reducing noise from an ignition system.
摘要翻译：一种电阻器火花塞，其在端子螺钉和中心电极之间具有导电玻璃密封件和其间的电阻器玻璃密封件，所述导电玻璃密封件包含碳，一种或多种金属和玻璃，并且所述电阻器玻璃密封件包含碳，碳化硅，玻璃，碳化硼或碳化钛，如果需要，填料具有小的电阻系数和稳定的性质，并且有效地降低了点火系统的噪音。

3. 发明授权

US4585706A Sintered aluminum nitride semi-conductor device 失效
标题翻译：烧结氮化铝半导体器件
公开(公告)号：US4585706A
公开(公告)日：1986-04-29
申请号：US769302
申请日：1985-08-26
申请人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
发明人： Yukio Takeda , Satoru Ogihara , Mitsuru Ura , Kousuke Nakamura , Tadamichi Asai , Tokio Ohkoshi , Yasuo Matsushita , Kunihiro Maeda
IPC分类号： C22C29/16 , C04B35/581 , H01L21/318 , H01L23/15 , H01L29/12 , B32B15/04
CPC分类号： H01L21/318 , C04B35/581 , H01L23/15 , H01L2224/45124 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01039 , H01L2924/14 , Y10T428/12528 , Y10T428/12576 , Y10T428/12583 , Y10T428/12674
摘要： A semi-conductor device comprising sintered aluminum nitride having a high thermal conductivity, which comprises at least 65% by weight of aluminum nitride, and at least one of beryllium, a beryllium compound, lithium and a lithium compound.
摘要翻译：包括具有高热导率的烧结氮化铝的半导体器件，其包含至少65重量％的氮化铝，以及铍，铍化合物，锂和锂化合物中的至少一种。

4. 发明授权

US5016089A Substrate for hybrid IC, hybrid IC using the substrate and its applications 失效
标题翻译：用于混合IC的基板，使用该基板的混合IC及其应用
公开(公告)号：US5016089A
公开(公告)日：1991-05-14
申请号：US293443
申请日：1989-01-04
申请人： Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
发明人： Mituru Fujii , Tadamichi Asai , Toshio Ogawa , Osamu Ito , Akira Ikegami , Mitsuru Hasegawa , Takao Kobayashi , Teizo Tamura
IPC分类号： H01L25/18 , H01C1/142 , H01C7/00 , H01C17/06 , H01C17/065 , H01C17/28 , H01C17/30 , H01L23/498 , H01L25/04 , H01L25/16 , H05K1/16
CPC分类号： H01C7/003 , H01C1/142 , H01C17/065 , H01C17/281 , H01L23/49883 , H01L25/16 , H01L2224/16225 , H01L2924/09701 , H01L2924/19107 , Y10S257/904
摘要： A substrate for hybrid IC which comprises a substrate, a thick film resistor containing glass, formed on the substrate, and a thick film conductor at the terminal of the thick film resistor, where a means for preventing diffusion of the glass from the thick film resistor into the thick film conductor is provided between the thick film resistor and the thick film conductor has a stable resistance as a thick film microresistor and is applied to various uses such as cellular radio communication system.

5. 发明授权

US5204166A Thick film resistor composition, hybrid IC using the composition, and process for producing the hybrid IC 失效
标题翻译：厚膜电阻器组成，使用组合物的混合IC，以及用于制造混合IC的工艺
公开(公告)号：US5204166A
公开(公告)日：1993-04-20
申请号：US659682
申请日：1991-02-25
申请人： Osamu Ito , Tadamichi Asai , Toshio Ogawa , Noritaka Kamimura , Yoshishige Endou , Takao Kobayashi , Hiromi Isomae , Masaki Kamiakutsu , Michio Otani , Katsuo Ebisawa
发明人： Osamu Ito , Tadamichi Asai , Toshio Ogawa , Noritaka Kamimura , Yoshishige Endou , Takao Kobayashi , Hiromi Isomae , Masaki Kamiakutsu , Michio Otani , Katsuo Ebisawa
IPC分类号： H01C17/06 , H01C7/00 , H01C17/065 , H01L27/01 , H05K1/16
CPC分类号： H01L27/013 , H01C17/06553 , H01C17/06566 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/256
摘要： The present invention relates to a thick film resistor material which is suitable especially for thick film hybrid IC having conductor, resistor, semiconductor element and the like in which Cu is used as the conductor and furthermore, a thick film resistor composition which can be fired in a reducing atmosphere. The present invention further relates to a thick film hybrid IC using the thick film resistor composition as a resistor and a method for making it.
摘要翻译：本发明涉及一种厚膜电阻材料，其特别适用于其中使用Cu作为导体的导体，电阻器，半导体元件等的厚膜混合IC，此外，还可以在减少气氛。本发明还涉及使用厚膜电阻器组合物作为电阻器的厚膜混合IC及其制造方法。

6. 发明授权

US5196915A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5196915A
公开(公告)日：1993-03-23
申请号：US437825
申请日：1989-11-17
申请人： Osamu Ito , Tadamichi Asai , Toshio Ogawa , Mitsuru Hasegawa , Akira Ikegami , Yoshishige Endoh , Michio Ootani , Katsuo Ebisawa
发明人： Osamu Ito , Tadamichi Asai , Toshio Ogawa , Mitsuru Hasegawa , Akira Ikegami , Yoshishige Endoh , Michio Ootani , Katsuo Ebisawa
IPC分类号： H01B1/06
CPC分类号： H01B1/06
摘要： In a semiconductor device such as hybrid IC, thermal heads, etc., a thick film resistor of the semiconductor device contains a boride particle of a metal dispersed in a glass matrix, the particle having a particles size of 0.005 to 0.1 .mu.m. Generation of a thermal stress can be suppressed and the electroconductive particles themselves form isotropic electroconductive passages by such dispersion, and the semiconductor devices can have a distinguished electroconductivity. Preferable boride of a metal is LaB.sub.6, which gives distinguished resistor characteristics.
摘要翻译：在诸如混合IC，热敏头等的半导体器件中，半导体器件的厚膜电阻器包含分散在玻璃基质中的金属的硼化物颗粒，该颗粒的粒径为0.005至0.1μm。可以抑制热应力的产生，并且导电颗粒本身通过这种分散形成各向同性导电通道，并且半导体器件可以具有显着的导电性。优选的金属硼化物是LaB6，其具有显着的电阻特性。

7. 发明授权

US4873022A Electrically conductive paste, electronic circuit component and method for producing same 失效
标题翻译：导电胶，电子电路部件及其制造方法
公开(公告)号：US4873022A
公开(公告)日：1989-10-10
申请号：US139792
申请日：1987-12-30
申请人： Toshio Ogawa , Mituru Fujii , Tadamichi Asai , Akira Ikegami , Hiroshi Ohtsu , Kazuhiko Ato
发明人： Toshio Ogawa , Mituru Fujii , Tadamichi Asai , Akira Ikegami , Hiroshi Ohtsu , Kazuhiko Ato
IPC分类号： H01B1/16 , H05K1/09 , H05K3/38
CPC分类号： H05K1/092 , H01B1/16 , Y10T428/24917
摘要： The present invention provides an electronic circuit component having a ceramic base and more particularly to a conductive paste for circuit film and an electronic circuit component having a copper film circuit of 10 .mu.m of less in film thickness formed from said conductive paste and a method for making the electronic circuit component.The characteristic of the present invention resides in a conductive paste comprising 100 parts by weight of copper powder of 1 .mu.m or less in average particle size, 0.01-4 parts by weight of at least one of S, Te and Se and 1-10 parts by weight of a frit glass as a binder.Further, there is provided an electronic circuit component having a copper film circuit containing 0.005-2 parts by weight of at least one of S, Te and Se and an effective amount of a glass as a binder for 100 parts by weight of copper which is produced by forming a circuit pattern of said conductive paste on an insulating base by flexo-printing method or the like and then firing the pattern.Especially, since a copper film of 10 .mu.m or less in thickness can be easily formed by printing method, an electronic circuit component having fine circuit pattern comparable to conventional gold film can be provided. This electronic circuit component is excellent as electronic circuit components which require low circuit loss.
摘要翻译：本发明提供了一种具有陶瓷基底的电子电路部件，更具体地说，涉及一种用于电路膜的导电膏和具有由所述导电膏形成的薄膜厚度小于10μm的铜膜电路的电子电路部件，制作电子电路组件。本发明的特征在于，包含平均粒径为1μm以下的铜粉末100重量份，S，Te，Se中的至少一种为0.01-4重量份，以及1-10重量份重量份的玻璃料作为粘合剂。此外，提供了一种电子电路部件，其具有包含0.005-2重量份的S，Te和Se中的至少一个的铜膜电路和有效量的作为100重量份铜的粘合剂的玻璃，其为通过柔性印刷法等在绝缘基底上形成所述导电膏的电路图案，然后点燃图案而制成。特别是由于可以通过印刷法容易地形成厚度在10μm以下的铜膜，所以可以提供具有与常规金膜相当的精细电路图案的电子电路元件。该电子电路部件作为需要低电路损耗的电子电路部件是优异的。

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