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    • 3. 发明授权
    • Exposure control method and method of manufacturing a semiconductor device
    • 曝光控制方法及制造半导体器件的方法
    • US07396621B2
    • 2008-07-08
    • US11819375
    • 2007-06-27
    • Tadahito FujisawaSoichi InoueSatoshi TanakaMasafumi Asano
    • Tadahito FujisawaSoichi InoueSatoshi TanakaMasafumi Asano
    • G03F7/16G03F7/20G03F7/38G03F1/14
    • G03F1/44
    • A method of manufacturing a semiconductor device includes preparing a projection exposure apparatus and a photomask, the photomask having a transparent substrate and a light shield film arranged in patterns to be transferred to a resist film on a wafer. The patterns include a circuit mask pattern, and first and second mark mask patterns having dimensions which change in accordance with exposure of the resist film. The method further includes forming first and second exposure monitor marks by causing phasing differences of 180 degrees and zero degrees, respectively, of light passing through the corresponding first and second mark mask patterns; measuring the first and second exposure monitor marks; calculating first and second effective exposures based on measured dimensions of the first and second exposure monitor marks; comparing variations of the first and second effective exposures; and changing at least one of a deposit condition of a front-end film formed under the resist film or a resist film coating condition if a variation of the first effective exposure differs from a variation of the second effective exposure.
    • 制造半导体器件的方法包括制备投影曝光设备和光掩模,所述光掩模具有透明基板和以图案排列的光屏蔽膜,以转印到晶片上的抗蚀剂膜。 图案包括电路掩模图案,以及具有根据抗蚀剂膜的曝光而变化的尺寸的第一和第二标记掩模图案。 该方法还包括通过分别通过相应的第一和第二标记掩模图案的光180度和零度的相位差来形成第一和第二曝光监视标记; 测量第一和第二曝光监视标记; 基于第一和第二曝光监视标记的测量尺寸来计算第一和第二有效曝光; 比较第一和第二有效曝光的变化; 以及如果第一有效曝光的变化与第二有效曝光的变化不同,则改变形成在抗蚀剂膜下方的前端膜的沉积条件或抗蚀剂膜涂覆条件中的至少一个。
    • 6. 发明授权
    • Exposure apparatus and method
    • 曝光装置和方法
    • US5673103A
    • 1997-09-30
    • US703530
    • 1996-08-23
    • Soichi InoueSatoshi TanakaTadahito Fujisawa
    • Soichi InoueSatoshi TanakaTadahito Fujisawa
    • G03F7/20G02B21/14
    • G03F7/70058G03F7/70075G03F7/70125G03F7/70241G03F7/7025G03F7/70425G03F7/70566
    • An exposure apparatus for reducing/projecting a plurality of patterns of a photomask, which are elongated in at least two different directions, onto a substrate through the photomask includes a polarized light source for illuminating the photomask, a polarization control unit for changing the direction of polarization of polarized light from the polarized light source, a slit filter arranged at a position where the polarized light is focused and having a slit-like opening portion elongated in a direction perpendicular to the direction of polarization of the polarized light, the slit filter transmitting polarized light, of the polarized light passing through the photomask, which has the direction of polarization, a unit for changing the direction of the opening portion of the slit filter in synchronism with a change in direction of polarization of polarized light which is made by the polarization control unit, and a unit for illuminating the photomask with the polarized light at each position where the direction of the pattern becomes parallel to the direction of polarization of the polarized light, thereby exposing a pattern, formed on the photomask, onto the substrate at the angle of a direction of polarization perpendicular to an incident plane of light incident on the substrate.
    • 用于将通过光掩模在至少两个不同方向上延伸的光掩模的多个图案减少/投影到基板上的曝光装置包括用于照射光掩模的偏振光源,用于改变光掩模的方向的偏振控制单元 偏振光从偏振光源的偏振光;狭缝滤光器,其设置在偏振光聚焦的位置处,并且具有在与偏振光的偏振方向垂直的方向上延伸的狭缝状开口部,狭缝滤光器透射 通过具有偏振方向的光掩模的偏振光的偏振光与由偏振光的偏振光的偏振方向的变化同步地改变狭缝滤光片的开口部的方向的单元 偏光控制单元,以及用于在每个po处以偏振光照射光掩模的单元 其中图案的方向变得与偏振光的偏振方向平行,从而将形成在光掩模上的图案以垂直于入射到该光源的光的入射平面的偏振方向的角度暴露在基板上 基质。