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    • 6. 发明申请
    • Manufacturing method of a semiconductor device
    • 半导体器件的制造方法
    • US20050260829A1
    • 2005-11-24
    • US11119930
    • 2005-05-03
    • Toshihide UematsuChuichi MiyazakiYoshiyuki AbeMinoru Kimura
    • Toshihide UematsuChuichi MiyazakiYoshiyuki AbeMinoru Kimura
    • H01L21/304H01L21/301H01L21/46
    • H01L21/304H01L21/3043
    • The reliability of a thin semiconductor device is to be improved. A tape having a ring affixed to an outer periphery thereof is affixed to a main surface of a semiconductor wafer, and, in this state, a back surface of the semiconductor wafer is subjected to grinding and polishing to thin the wafer. Thereafter, the semiconductor wafer is conveyed to a dicing apparatus in a state in which the tape with the ring is affixed to the wafer main surface without peeling of the tape, and dicing is performed from the back surface side of the semiconductor wafer to divide the wafer into individual semiconductor chips. With this method, handling of the thin semiconductor wafer by rear surface processing can be facilitated. Besides, the manufacturing process can be simplified because the replacement of the tape is not needed at the time of shift from rear surface processing to the dicing process.
    • 要提高薄半导体器件的可靠性。 将具有固定在其外周上的环的带固定到半导体晶片的主表面,并且在该状态下,对半导体晶片的背面进行研磨和抛光以使晶片变薄。 此后,半导体晶片在没有带剥离的情况下将带有环的带固定到晶片主表面的状态下被输送到切割装置,并且从半导体晶片的背面侧进行切割 晶圆成为单个半导体芯片。 利用这种方法,可以方便地利用后表面处理来处理薄的半导体晶片。 此外,可以简化制造过程,因为在从后表面处理到切割处理的转变时不需要更换带。