专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120318770A1 MANUFACTURING METHOD OF CIRCUIT BOARD 审中-公开
标题翻译：电路板制造方法
公开(公告)号：US20120318770A1
公开(公告)日：2012-12-20
申请号：US13590815
申请日：2012-08-21
申请人： TZYY-JANG TSENG , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： TZYY-JANG TSENG , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K3/00 , H05K3/06 , C25D5/02
CPC分类号： H05K3/465 , C23C18/1612 , C23C18/1651 , C23C18/1653 , C23C18/1689 , H05K1/0265 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K2201/0391 , H05K2201/09509 , Y10T29/49155 , Y10T29/49165
摘要： A manufacturing method of a circuit board is provided. A circuit substrate having a first surface and at least a first circuit is provided. A dielectric layer having a second surface and covering the first surface and the first circuit is formed on the circuit substrate. The dielectric layer is irradiated by a laser beam to form a first intaglio pattern, a second intaglio pattern and at least a blind via. A first conductive layer is formed in the first intaglio pattern, the second intaglio pattern and the blind via. A barrier layer and a second conductive layer are formed in the second intaglio pattern and the blind via. Parts of the second conductive layer, parts of the barrier layer and parts of the first conductive layer are removed until the second surface of the dielectric layer is exposed, so as to form a patterned circuit structure.
摘要翻译：提供电路板的制造方法。提供具有第一表面和至少第一电路的电路基板。具有第二表面并覆盖第一表面的电介质层和第一电路形成在电路基板上。电介质层被激光束照射以形成第一凹版图案，第二凹版图案和至少一个盲孔。在第一凹版图案，第二凹版图案和盲孔中形成第一导电层。在第二凹版图案和盲孔中形成阻挡层和第二导电层。去除第二导电层的一部分，阻挡层的一部分和第一导电层的部分直到电介质层的第二表面露出，以形成图案化的电路结构。

2. 发明申请

US20090166059A1 CIRCUIT BOARD AND PROCESS THEREOF 审中-公开
标题翻译：电路板及其过程
公开(公告)号：US20090166059A1
公开(公告)日：2009-07-02
申请号：US12048909
申请日：2008-03-14
申请人： Tsung-Yuan Chen , Tzyy-Jang Tseng , Shu-Sheng Chiang , David C. H. Cheng
发明人： Tsung-Yuan Chen , Tzyy-Jang Tseng , Shu-Sheng Chiang , David C. H. Cheng
IPC分类号： H05K1/00 , H05K3/10
CPC分类号： H05K1/0219 , H05K3/20 , H05K2201/0376 , H05K2201/09236 , H05K2201/09736 , Y10T29/49155
摘要： A circuit board and process thereof are provided. The circuit board includes a dielectric layer, a main circuit, and two shielding circuits. The dielectric layer has an active surface. The main circuit is embedded in the dielectric layer and the shielding circuits are disposed at the dielectric layer. The shielding circuits are respectively located at two sides of the main circuit. The thickness of the shielding circuits is larger than the thickness of the main circuit.
摘要翻译：提供电路板及其工艺。电路板包括电介质层，主电路和两个屏蔽电路。电介质层具有活性表面。主电路嵌入电介质层，屏蔽电路设置在电介质层。屏蔽电路分别位于主电路的两侧。屏蔽电路的厚度大于主电路的厚度。

3. 发明授权

US08294034B2 Circuit board and process for fabricating the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US08294034B2
公开(公告)日：2012-10-23
申请号：US12789895
申请日：2010-05-28
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/00 , H05K1/11
CPC分类号： H05K3/465 , H05K3/184 , H05K2201/0347 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The first dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit layer and an intaglio pattern. The antagonistic activation layer is disposed on the second surface of the dielectric layer. The first conductive layer is disposed in the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer via the first conductive layer.
摘要翻译：提供了包括电路基板，第一介电层，拮抗激活层，第一导电层，第二导电层和第二介电层的电路板。电路基板具有第一表面和第一电路层。第一电介质层设置在电路基板上并覆盖第一表面和第一电路层。第一介电层具有第二表面，至少一个从第二表面延伸到第一电路层的盲孔和凹版图案。拮抗活化层设置在电介质层的第二表面上。第一导电层设置在盲孔中。第二导电层设置在凹版图案和盲孔中并覆盖第一导电层。第二导电层经由第一导电层与第一电路层电连接。

4. 发明申请

US20110155441A1 CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20110155441A1
公开(公告)日：2011-06-30
申请号：US12783851
申请日：2010-05-20
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/11 , H05K3/12
CPC分类号： H05K3/06 , H05K1/0298 , H05K3/465 , H05K2201/0347 , Y10T29/49126 , Y10T29/49165
摘要： A process for fabricating a circuit board is provided. A circuit substrate having a first surface and a first circuit layer is provided. A first dielectric layer having a second surface is formed on the circuit substrate and covers the first surface and the first circuit layer. An antagonistic activation layer is formed on the second surface. The antagonistic activation layer is irradiated by a laser beam to form at least a blind via extended from the antagonistic activation layer to the first circuit layer and an intaglio pattern. A first conductive layer is formed inside the blind via. A second conductive layer is formed in the intaglio pattern and the blind via. The second conductive layer covers the first conductive layer and is electrically connected with the first circuit layer through the first conductive layer. The antagonistic activation layer is removed to expose the second surface.
摘要翻译：提供一种制造电路板的工艺。提供具有第一表面和第一电路层的电路基板。具有第二表面的第一电介质层形成在电路基板上并覆盖第一表面和第一电路层。在第二表面上形成拮抗活化层。通过激光束照射拮抗激活层，以形成从拮抗活化层延伸到第一电路层和凹版图案的至少盲目通孔。在盲通孔内形成第一导电层。在凹版图案和盲孔中形成第二导电层。第二导电层覆盖第一导电层，并通过第一导电层与第一电路层电连接。去除拮抗活化层以暴露第二表面。

5. 发明申请

US20110155440A1 CIRCUIT BOARD AND PROCESS FOR MANUFACTURING THE SAME 失效
标题翻译：电路板及其制造方法
公开(公告)号：US20110155440A1
公开(公告)日：2011-06-30
申请号：US12783837
申请日：2010-05-20
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/11 , H05K3/00
CPC分类号： H05K1/115 , H05K1/0298 , H05K3/107 , H05K3/421 , H05K2201/0376 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board including a circuit substrate, a dielectric layer, a first conductive layer and a second conductive layer is provided. The circuit substrate has a first surface and a first circuit layer. The dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The dielectric layer has a second surface, at least a blind via extended from the second surface to the first circuit layer and an intaglio pattern. The first conductive layer is disposed inside the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer through the first conductive layer.
摘要翻译：提供了包括电路基板，电介质层，第一导电层和第二导电层的电路板。电路基板具有第一表面和第一电路层。电介质层设置在电路基板上并覆盖第一表面和第一电路层。电介质层具有第二表面，至少从第二表面延伸到第一电路层的盲孔和凹版图案。第一导电层设置在盲孔内。第二导电层设置在凹版图案和盲孔中并覆盖第一导电层。第二导电层通过第一导电层与第一电路层电连接。

6. 发明申请

US20110114373A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20110114373A1
公开(公告)日：2011-05-19
申请号：US12732512
申请日：2010-03-26
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/09 , H01B13/00 , H05K1/11 , H05K1/03
CPC分类号： H05K3/465 , H05K3/0038 , H05K3/06 , H05K2203/0384 , H05K2203/0723 , Y10T29/49155
摘要： A circuit board includes a circuit substrate, a dielectric layer disposed on the circuit substrate and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via, a second intaglio pattern and a third intaglio pattern connected to the blind via. The patterned circuit structure includes at least a second circuit disposed in the second intaglio pattern and third circuits disposed in the third intaglio pattern and the blind via. Each third circuit has a first conductive layer and a second conductive layer. The materials of the first conductive layer and the second circuit are the same. The line width of the second circuit is shorter than that of each third circuit. At least a third circuit is electrically connected to the first circuit of the circuit substrate.
摘要翻译：电路板包括电路基板，设置在电路基板上的电介质层和图案化的电路结构。电介质层覆盖电路基板的第一表面和至少第一电路。电介质层具有连接到盲孔的第二表面，至少一盲孔，第二凹版图案和第三凹版图案。图案化电路结构包括至少设置在第二凹版图案中的第二电路和设置在第三凹版图案和盲孔中的第三电路。每个第三电路具有第一导电层和第二导电层。第一导电层和第二电路的材料相同。第二电路的线宽比每个第三电路的线宽短。至少第三电路电连接到电路基板的第一电路。

7. 发明申请

US20090273907A1 CIRCUIT BOARD AND PROCESS THEREOF 审中-公开
标题翻译：电路板及其过程
公开(公告)号：US20090273907A1
公开(公告)日：2009-11-05
申请号：US12112226
申请日：2008-04-30
申请人： Tsung-Yuan Chen , Tzyy-Jang Tseng , Shu-Sheng Chiang , David C. H. Cheng
发明人： Tsung-Yuan Chen , Tzyy-Jang Tseng , Shu-Sheng Chiang , David C. H. Cheng
IPC分类号： H05K3/06 , H05K1/02
CPC分类号： H05K1/0219 , H05K3/107 , H05K3/108 , H05K3/125 , H05K3/243 , H05K3/245 , H05K2201/09236 , H05K2201/09736 , H05K2203/013 , H05K2203/058 , H05K2203/1476 , Y10T29/49155
摘要： A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit.
摘要翻译：提供电路板及其工艺。电路板包括电介质层，有源电路和两个屏蔽电路。电介质层具有活性表面。有源电路设置在有源表面上，屏蔽电路分别设置在有源电路的两侧。屏蔽电路的高度大于有源电路的高度。

8. 发明授权

US08365401B2 Circuit board and manufacturing method thereof 有权
标题翻译：电路板及其制造方法
公开(公告)号：US08365401B2
公开(公告)日：2013-02-05
申请号：US12732512
申请日：2010-03-26
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/465 , H05K3/0038 , H05K3/06 , H05K2203/0384 , H05K2203/0723 , Y10T29/49155
摘要： A circuit board includes a circuit substrate, a dielectric layer disposed on the circuit substrate and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via, a second intaglio pattern and a third intaglio pattern connected to the blind via. The patterned circuit structure includes at least a second circuit disposed in the second intaglio pattern and third circuits disposed in the third intaglio pattern and the blind via. Each third circuit has a first conductive layer and a second conductive layer. The materials of the first conductive layer and the second circuit are the same. The line width of the second circuit is shorter than that of each third circuit. At least a third circuit is electrically connected to the first circuit of the circuit substrate.
摘要翻译：电路板包括电路基板，设置在电路基板上的电介质层和图案化电路结构。电介质层覆盖电路基板的第一表面和至少第一电路。电介质层具有连接到盲孔的第二表面，至少一盲孔，第二凹版图案和第三凹版图案。图案化电路结构包括至少设置在第二凹版图案中的第二电路和设置在第三凹版图案和盲孔中的第三电路。每个第三电路具有第一导电层和第二导电层。第一导电层和第二电路的材料相同。第二电路的线宽比每个第三电路的线宽短。至少第三电路电连接到电路基板的第一电路。

9. 发明申请

US20120312588A1 CIRCUIT BOARD 审中-公开
标题翻译：电路板
公开(公告)号：US20120312588A1
公开(公告)日：2012-12-13
申请号：US13588882
申请日：2012-08-17
申请人： TZYY-JANG TSENG , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： TZYY-JANG TSENG , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/11 , H05K1/09 , H05K1/02
CPC分类号： H05K3/465 , H05K3/0038 , H05K3/06 , H05K2203/0384 , H05K2203/0723 , Y10T29/49155
摘要： A circuit board includes a circuit substrate, a dielectric layer disposed on the circuit substrate and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via, a second intaglio pattern and a third intaglio pattern connected to the blind via. The patterned circuit structure includes at least a second circuit disposed in the second intaglio pattern and third circuits disposed in the third intaglio pattern and the blind via. Each third circuit has a first conductive layer and a second conductive layer. The materials of the first conductive layer and the second circuit are the same. The line width of the second circuit is shorter than that of each third circuit. At least a third circuit is electrically connected to the first circuit of the circuit substrate.
摘要翻译：电路板包括电路基板，设置在电路基板上的电介质层和图案化电路结构。电介质层覆盖电路基板的第一表面和至少第一电路。电介质层具有连接到盲孔的第二表面，至少一盲孔，第二凹版图案和第三凹版图案。图案化电路结构包括至少设置在第二凹版图案中的第二电路和设置在第三凹版图案和盲孔中的第三电路。每个第三电路具有第一导电层和第二导电层。第一导电层和第二电路的材料相同。第二电路的线宽比每个第三电路的线宽短。至少第三电路电连接到电路基板的第一电路。

10. 发明申请

US20110155428A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20110155428A1
公开(公告)日：2011-06-30
申请号：US12785725
申请日：2010-05-24
申请人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
发明人： Tzyy-Jang Tseng , Shu-Sheng Chiang , Tsung-Yuan Chen
IPC分类号： H05K1/02 , H05K1/09 , B05D3/06 , B05D3/10 , H05K3/00
CPC分类号： H05K3/465 , C23C18/1612 , C23C18/1651 , C23C18/1653 , C23C18/1689 , H05K1/0265 , H05K3/0032 , H05K3/0035 , H05K3/045 , H05K3/107 , H05K2201/0391 , H05K2201/09509 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes a circuit substrate, a dielectric layer, and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit, a first intaglio pattern, and a second intaglio pattern. The patterned circuit structure includes at least a second circuit and a plurality of third circuits. The second circuit is disposed in the first intaglio pattern. The third circuits are disposed in the second intaglio pattern and the blind via. Each third circuit has a first conductive layer, a second conductive layer, and a barrier layer. The first conductive layer is located between the barrier layer and the second intaglio pattern and between the barrier layer and the blind via. The second conductive layer covers the barrier layer.
摘要翻译：电路板包括电路基板，电介质层和图案化电路结构。电介质层覆盖电路基板的第一表面和至少第一电路。电介质层具有第二表面，至少从第二表面延伸到第一电路的盲孔，第一凹版图案和第二凹版图案。图案化电路结构至少包括第二电路和多个第三电路。第二电路设置在第一凹版图案中。第三电路设置在第二凹版图案和盲孔中。每个第三电路具有第一导电层，第二导电层和阻挡层。第一导电层位于阻挡层和第二凹版图案之间以及阻挡层和盲孔之间。第二导电层覆盖阻挡层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式