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    • 3. 发明授权
    • Hole metal-filling method
    • 孔金属填充法
    • US06638858B2
    • 2003-10-28
    • US10020700
    • 2001-10-30
    • David C. H. Cheng
    • David C. H. Cheng
    • H01L2144
    • H05K3/4046H01L21/4853H05K2201/0347H05K2201/0355H05K2201/0382H05K2201/10234
    • A hole metal-filling method, applied to hole filling and electroplating a printed circuit board which has been mechanical-drilled with holes. A plurality of holes is drilled in a substrate. The substrate is placed on a platform. A plurality of metal balls is disposed on a surface of the substrate. By vibrating the platform, a part of the metal balls roll into the holes, while the metal balls not rolling into the holes are removed. The substrate is then placed on a press down unit. The metal balls in the holes are pressed to level with surfaces of the substrate. The substrate is directly electroplated for forming a plating layer closely dovetail to the metal balls.
    • 孔金属填充方法,适用于已经机械钻孔的印刷电路板的孔填充和电镀。 在基板上钻出多个孔。 将基板放置在平台上。 多个金属球设置在基板的表面上。 通过振动平台,金属球的一部分滚动到孔中,而不会滚动到孔中的金属球被去除。 然后将基板放置在压下单元上。 孔中的金属球被压制以与基底的表面平齐。 将基板直接电镀以形成与金属球紧密接合的镀层。
    • 4. 发明授权
    • Method of forming IC package having downward-facing chip cavity
    • 形成具有向下的芯片腔的IC封装的方法
    • US06506632B1
    • 2003-01-14
    • US10078211
    • 2002-02-15
    • Jao-Chin ChengChih-Peng FanDavid C. H. Cheng
    • Jao-Chin ChengChih-Peng FanDavid C. H. Cheng
    • H01L2144
    • H01L24/82H01L21/568H01L21/6835H01L23/49816H01L23/5389H01L24/24H01L24/97H01L2224/45144H01L2224/73267H01L2224/82005H01L2224/82039H01L2224/82047H01L2224/97H01L2924/01029H01L2924/01033H01L2924/01075H01L2924/01078H01L2924/01079H01L2924/01082H01L2924/014H01L2924/10253H01L2924/14H01L2924/15311H01L2924/181H01L2924/18162H01L2224/82H01L2924/00
    • A method of forming an integrated circuit package with a downward-facing chip cavity. A substrate comprising an insulating core layer and a conductive layer is provided. A through-hole is formed in the substrate and an adhesive tape is attached to the surface of the conductive layer. A silicon chip is attached to the exposed adhesive tape surface at the bottom of the first opening. The chip has an active surface and a back surface. The chip further includes a plurality of bonding pads on the active surface. The back surface of the chip is attached to the adhesive tape. A patterned dielectric layer is formed filling the first opening and covering a portion of the adhesive tape, the active surface, the bonding pad and the insulating core layer. The patterned dielectric layer has a plurality of openings that exposes the bonding pads and some through holes. A metallic layer is formed over the exposed surface of the openings and the upper surface of the patterned dielectric layer by electroplating. The adhesive tape is removed. The metallic layer and the conductive layer are patterned. A patterned solder resistant layer is formed over the metallic layer and the conductive layer. The patterned solder resistant layer has a plurality of openings that expose a portion of the conductive layer. A solder ball implant is conducted to form electrical connection between the solder balls and the conductive layer.
    • 一种形成具有朝下的芯片腔的集成电路封装的方法。 提供了包括绝缘芯层和导电层的衬底。 在基板中形成通孔,并且在导电层的表面上附着粘合带。 硅芯片附着在第一开口底部的暴露的胶带表面上。 芯片具有活性表面和背面。 所述芯片还包括在所述有源表面上的多个接合焊盘。 芯片的背面附着在胶带上。 形成图案化的介电层,填充第一开口并覆盖粘合带,活性表面,接合焊盘和绝缘芯层的一部分。 图案化电介质层具有暴露接合焊盘和一些通孔的多个开口。 通过电镀在开口的暴露表面和图案化电介质层的上表面上形成金属层。 去除胶带。 金属层和导电层被图案化。 在金属层和导电层之上形成图案化的阻焊层。 图案化的阻焊层具有暴露导电层的一部分的多个开口。 导电焊球植入物以形成焊球和导电层之间的电连接。