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1. 发明申请

US20160169766A1 LEAKAGE DETERMINING METHOD, SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM 审中-公开
标题翻译：泄漏确定方法，基板处理装置和储存介质
公开(公告)号：US20160169766A1
公开(公告)日：2016-06-16
申请号：US14965684
申请日：2015-12-10
申请人： TOKYO ELECTRON LIMITED
发明人： Seiji ISHIBASHI , Hiromitsu SAKAUE , Yoshiaki SASAKI
IPC分类号： G01M3/02 , H01L21/67 , G01N33/00
CPC分类号： H01L21/67098 , G01M3/205 , G01M3/226 , G01M3/3209 , G01M3/3272 , G01N33/0036 , H01L21/67196 , H01L21/67253
摘要： A leakage determining method determines whether or not atmospheric air enters a vacuum transfer chamber for transferring a substrate under a vacuum atmosphere between a preliminary vacuum chamber and a processing chamber. The method includes controlling a pressure in the vacuum transfer chamber to a preset pressure by supplying a pressure control gas into the vacuum transfer chamber; performing supply control, when the substrate is not transferred, by reducing the amount of the pressure control gas supplied into the vacuum transfer chamber or stopping the supply of the pressure control gas; and measuring an oxygen concentration in the vacuum transfer chamber after the supply control of the pressure control gas and determining leakage of atmospheric air into the vacuum transfer chamber by determining whether or not atmospheric air whose amount exceeds a preset allowable level enters the vacuum transfer chamber based on temporal changes of the measured oxygen concentration.
摘要翻译：泄漏确定方法确定大气空气是否进入真空传送室，用于在真空气氛下在预备真空室和处理室之间传送基板。该方法包括通过向真空传送室中供应压力控制气体来将真空传送室中的压力控制到预定压力; 通过减少供给到真空传送室中的压力控制气体的量或停止供给压力控制气体，进行供给控制，当基板未被传送时; 并且在压力控制气体的供给控制之后测量真空转移室中的氧气浓度，并且通过确定超过预设容许水平的大气空气是否进入真空传送室，确定大气进入真空传送室的泄漏对测量的氧浓度的时间变化。

2. 发明公开

US20240120225A1 APPARATUS FOR TRANSFERRING SUBSTRATE, SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATE 审中-公开
公开(公告)号：US20240120225A1
公开(公告)日：2024-04-11
申请号：US18273446
申请日：2022-01-12
申请人： Tokyo Electron Limited
发明人： Takehiro SHINDO , Akinori SHIMAMURA , Hiromitsu SAKAUE , Dongwei LI
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67709 , H01L21/67017
摘要： Provided is an apparatus that transfers a substrate inside a substrate transfer chamber by a substrate transfer module using magnetic levitation. The apparatus includes: a substrate transfer chamber having a floor portion provided with a first magnet and connected, through an opening portion, to a substrate processing chamber in which the substrate is processed; and a substrate transfer module including a substrate holder configured to hold the substrate, and a second magnet configured such that a repulsive force acts between the first magnet and the second magnet. The substrate transfer module is movable inside the substrate transfer chamber by the magnetic levitation based on the repulsive force. The substrate transfer module performs loading/unloading of the substrate by directly entering into the substrate transfer chamber via the opening portion, or delivers the substrate to and from a substrate transfer mechanism fixedly provided inside the substrate transfer chamber.

3. 发明申请

US20210143035A1 VACUUM PROCESSING DEVICE 有权
公开(公告)号：US20210143035A1
公开(公告)日：2021-05-13
申请号：US16612322
申请日：2018-04-24
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687
摘要： In a vacuum processing device, a loading/unloading port, a normal pressure transfer chamber and a vacuum transfer chamber are arranged in that order from a front side toward a rear side, and load-lock chambers are connected to the normal pressure transfer chamber. The position in the front-rear direction in a movement range of a wafer W in the normal pressure transfer chamber overlaps with the positions in the front-rear direction of the load-lock chambers. Three vacuum processing modules are connected to each of the left and right sides of the vacuum transfer chamber. Vacuum processing units are arranged in each of the vacuum processing modules in a front-rear direction when viewed from the vacuum transfer chamber side. Wafer mounting shelves for holding wafers W in the load-lock chambers are arranged in the front-rear direction when viewed from the vacuum transfer chamber side.

4. 发明申请

US20190198369A1 SUBSTRATE PROCESSING APPARATUS AND METHOD OF OPERATING SUBSTRATE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20190198369A1
公开(公告)日：2019-06-27
申请号：US16224952
申请日：2018-12-19
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE , Junpei SASAKI
IPC分类号： H01L21/677 , B25J18/04 , B25J9/10
CPC分类号： H01L21/67742 , B25J9/107 , B25J18/04 , H01L21/67748 , H01L21/6776
摘要： A substrate processing apparatus, includes: a substrate transfer mechanism configured to advance and retreat a holding body that holds a substrate by symmetrically arranging two link mechanisms each including a driving arm and a driven arm; a processing module; a rotation angle measuring part configured to measure a rotation angle the driving arms; a holding body detection part configured to detect that a specific portion of the holding body is located at a predetermined position; and a controller configured to execute a step of acquiring a measurement value of the rotation angle of the driving arm, a step of obtaining a moving average of the measurement value of the rotation angle, and a step of obtaining a correction amount of the rotation angle so that a substrate transfer position of the holding body of the substrate transfer mechanism for the processing module becomes a reference position.

5. 发明申请

US20170117169A1 SUBSTRATE COOLING METHOD, SUBSTRATE TRANSFER METHOD, AND LOAD-LOCK MECHANISM 审中-公开
公开(公告)号：US20170117169A1
公开(公告)日：2017-04-27
申请号：US15334179
申请日：2016-10-25
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE , Shinya OKANO
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/67109 , H01L21/67167 , H01L21/67173 , H01L21/67201 , H01L21/67742
摘要： A substrate cooling method is for, using a load-lock mechanism for controlling a pressure therein between a first pressure close to an atmospheric pressure and a second pressure in a vacuum state, cooling a substrate transferred from the second module to the first module. The method includes maintaining a pressure in the chamber to the second pressure, allowing the chamber to communicate with a second module, and loading the substrate into the chamber; locating the substrate to a cooling position close to the cooling member; exhausting the chamber such that the pressure in the chamber becomes a third pressure where a region between a surface of the cooling member and a backside of the substrate satisfies a molecular flow condition. The method further includes introducing a purge gas into the chamber to increase the pressure in the chamber to the first pressure, and cooling the substrate by the cooling member.

6. 发明公开

US20230317488A1 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20230317488A1
公开(公告)日：2023-10-05
申请号：US18021157
申请日：2021-08-12
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE
IPC分类号： H01L21/677 , H01L21/687
CPC分类号： H01L21/67751 , H01L21/68742 , H01L21/68764 , H01L21/68785
摘要： There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force; and a substrate processing chamber disposed on an upper surface side of the substrate transfer chamber to process the substrate, the substrate processing chamber having an opening having a size that allows at least a part of the stage on which the substrate is placed to pass therethrough, the opening being open toward the inside of the substrate transfer chamber. The substrate is processed in a state where the stage on which the substrate is placed is inserted into the substrate processing chamber through the opening by raising the substrate transfer module and the opening is closed by the traveling plate.

7. 发明申请

US20220199442A1 SUBSTRATE TRANSFER APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20220199442A1
公开(公告)日：2022-06-23
申请号：US17553158
申请日：2021-12-16
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE , Toshiaki KODAMA
IPC分类号： H01L21/677 , G01N21/95
摘要： The present disclosure relates to a substrate transfer apparatus for transferring a substrate to a substrate processing apparatus in a reduced pressure atmosphere. The apparatus comprises a substrate holder to hold the substrate; and a substrate measurer, provided on the substrate holder, to measure a position of the substrate with respect to the substrate holder.

8. 发明申请

US20170217017A1 SUBSTRATE TRANSFER TEACHING METHOD AND SUBSTRATE PROCESSING SYSTEM 审中-公开
公开(公告)号：US20170217017A1
公开(公告)日：2017-08-03
申请号：US15422293
申请日：2017-02-01
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE
IPC分类号： B25J9/16 , H01L21/67 , H01L21/687 , B25J13/08
CPC分类号： H01L21/68742 , H01L21/67259 , H01L21/67748 , H01L21/681 , Y10S901/03 , Y10S901/46
摘要： A method includes a first step of vertically moving the arm or the pins from a reference position in one direction by a predetermined distance, a second step of moving the arm in a horizontal direction, a third step of vertically moving the arm or the pins moved in the one direction in the other direction by a distance equal to or greater than the predetermined distance, a fourth step of detecting a horizontal position of the substrate held by the arm with respect to the arm. The steps are repeated. Whenever the processes are performed, the reference position in the first step is shifted in the one direction by the predetermined distance, and a vertical position of the arm or the pins which is obtained when the horizontal position of the substrate detected in the fourth step is deviated from a preset position is taught as the delivery position.

9. 发明申请

US20170162421A1 Transfer Device and Correction Method 审中-公开
公开(公告)号：US20170162421A1
公开(公告)日：2017-06-08
申请号：US15364910
申请日：2016-11-30
申请人： TOKYO ELECTRON LIMITED
发明人： Hiromitsu SAKAUE , Seiji ISHIBASHI
IPC分类号： H01L21/687 , H01L21/677
CPC分类号： H01L21/68707 , H01L21/67706 , H01L21/67742 , H01L21/67748 , H01L21/68
摘要： A transfer device includes a rotation driving mechanism for rotationally driving a first linear arm and a second linear arm to move a holding part between a waiting location and a transfer location; a rotation angle detection mechanism for detecting rotation angles of the first linear arm and the second linear arm; a position detection sensor for detecting a position of the second linear arm; a calculation part for calculating a position of the holding part based on the rotation angles of the first linear arm and the second linear arm; and a control part for comparing a position information of the holding part with a position information of the second linear arm and allowing the transfer location to which the target object is transferred to be collected, based on a difference between the position information of the holding part and the position information of the second linear arm.

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