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1. 发明公开

US20230381825A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD 审中-公开
公开(公告)号：US20230381825A1
公开(公告)日：2023-11-30
申请号：US18322855
申请日：2023-05-24
申请人： Tokyo Electron Limited
发明人： Yoshiki Okamoto , Akihiro Kubo , Yasushi Takiguchi
IPC分类号： B08B1/00 , B08B3/02 , B08B1/02
CPC分类号： B08B1/001 , B08B3/022 , B08B1/02 , H01L21/67051
摘要： A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.

2. 发明授权

US09570327B2 Substrate liquid treatment apparatus and substrate liquid treatment method 有权
标题翻译：底物液体处理装置及底物液体处理方法
公开(公告)号：US09570327B2
公开(公告)日：2017-02-14
申请号：US14651816
申请日：2013-12-12
申请人： TOKYO ELECTRON LIMITED
发明人： Masahiro Fukuda , Akihiro Kubo , Taro Yamamoto , Kenzi Yada , Atsushi Ookouchi
IPC分类号： B08B5/02 , B08B5/00 , H01L21/67
CPC分类号： H01L21/67051 , B08B5/00 , B08B5/02 , B08B5/023 , H01L21/67028 , H01L21/67034
摘要： A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.
摘要翻译：基板液体处理装置包括：保持和旋转晶片的卡盘（13），向晶片背面排出吹扫气体的后表面清洗喷嘴（15），以及将净化气体排出的周边清洗喷嘴16 到晶片的背面。后表面清洗喷嘴在平面图中具有从基板的中心侧向周边侧延伸的狭缝状的开口部。狭缝状开口部与被基板保持单元保持的基板之间的垂直距离随着接近基板的中心侧的开口部的端部而增大。周边清洗喷嘴将清洗气体朝向基板的中心部朝向基板的背面的区域排出，该区域位于背面清洗喷嘴的狭缝状开口部的端部的径向外侧，径向地位于衬底的周边边缘内。

3. 发明授权

US11059145B2 Dressing apparatus and dressing method for substrate rear surface polishing member 有权
公开(公告)号：US11059145B2
公开(公告)日：2021-07-13
申请号：US16059344
申请日：2018-08-09
申请人： Tokyo Electron Limited
发明人： Yoshiki Okamoto , Yasushi Takiguchi , Akihiro Kubo , Hayato Hosaka , Ryuto Ozasa
IPC分类号： B24B53/017 , B24B37/20 , B24B37/04 , B24B53/14 , B24B37/10 , B24B27/00 , B24B49/12 , B24B53/007 , B24B53/095
摘要： A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

4. 发明授权

US09669510B2 Polishing cleaning mechanism, substrate processing apparatus, and substrate processing method 有权
公开(公告)号：US09669510B2
公开(公告)日：2017-06-06
申请号：US14533133
申请日：2014-11-05
申请人： TOKYO ELECTRON LIMITED
发明人： Akihiro Kubo , Masahiro Fukuda , Taro Yamamoto , Kenji Yada , Masashi Enomoto , Noboru Nakashima
IPC分类号： B24B27/00 , B24B37/005 , B24B37/34 , B24B47/16 , B24B25/00 , B24D7/18
CPC分类号： B24B37/005 , B24B25/00 , B24B27/0061 , B24B37/34 , B24B47/16 , B24D7/18 , H01L21/0209 , H01L21/30625 , H01L21/67046 , H01L21/67253
摘要： There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

5. 发明授权

US11554389B2 Substrate cleaning apparatus and substrate cleaning method 有权
公开(公告)号：US11554389B2
公开(公告)日：2023-01-17
申请号：US17152870
申请日：2021-01-20
申请人： Tokyo Electron Limited
发明人： Akihiro Kubo , Yasushi Takiguchi , Teruhiko Kodama , Yoshiki Okamoto
IPC分类号： B08B1/04 , B08B11/02 , B08B3/04 , H01L21/02 , H01L21/687 , H01L21/67 , B08B1/00
摘要： A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

6. 发明授权

US11532487B2 Substrate processing apparatus 有权
公开(公告)号：US11532487B2
公开(公告)日：2022-12-20
申请号：US16872441
申请日：2020-05-12
申请人： Tokyo Electron Limited
发明人： Akihiro Kubo , Yasushi Takiguchi , Teruhiko Kodama , Yoshiki Okamoto , Hayato Hosaka
IPC分类号： H01L21/461 , H01L21/67 , B24B37/04 , H01L21/306
摘要： A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

7. 发明授权

US10840079B2 Substrate processing apparatus, substrate processing method and storage medium 有权
公开(公告)号：US10840079B2
公开(公告)日：2020-11-17
申请号：US15824274
申请日：2017-11-28
申请人： TOKYO ELECTRON LIMITED
发明人： Yasushi Takiguchi , Taro Yamamoto , Yoshiki Okamoto , Hayato Hosaka , Teruhiko Kodama , Akihiro Kubo , Ryuto Ozasa , Yuji Ariuchi , Shinsuke Kimura
IPC分类号： B24B37/04 , B24B37/10 , B24B41/06 , H01L21/02 , H01L21/687 , H01L21/67 , H01L21/683 , G03F7/20
CPC分类号： H01L21/02016 , B24B37/042 , B24B37/10 , B24B41/061 , G03F7/70691 , H01L21/0209 , H01L21/02013 , H01L21/67046 , H01L21/67219 , H01L21/67225 , H01L21/67288 , H01L21/6838 , H01L21/6875 , H01L21/68742 , H01L21/68764 , H01L21/68792
摘要： A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

8. 发明授权

US10328546B2 Polishing cleaning mechanism, substrate processing apparatus, and substrate processing method 有权
公开(公告)号：US10328546B2
公开(公告)日：2019-06-25
申请号：US15499402
申请日：2017-04-27
申请人： TOKYO ELECTRON LIMITED
发明人： Akihiro Kubo , Masahiro Fukuda , Taro Yamamoto , Kenji Yada , Masashi Enomoto , Noboru Nakashima
IPC分类号： B24D7/18 , B24B25/00 , B24B27/00 , B24B37/34 , B24B47/16 , B24B49/16 , H01L21/02 , H01L21/67 , B24B37/005 , H01L21/306
摘要： There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.

9. 发明授权

US10074542B2 Substrate processing method and substrate processing apparatus 有权
公开(公告)号：US10074542B2
公开(公告)日：2018-09-11
申请号：US15267183
申请日：2016-09-16
申请人： TOKYO ELECTRON LIMITED
发明人： Akihiro Kubo , Teruhiko Kodama
IPC分类号： B24B37/20 , H01L21/304 , H01L21/67 , H01L21/02 , H01L21/308
CPC分类号： H01L21/304 , B24B37/20 , H01L21/02052 , H01L21/0274 , H01L21/3043 , H01L21/3086 , H01L21/6704 , H01L21/67051 , H01L21/67092 , H01L21/67219 , H01L21/68728 , H01L21/68742 , H01L21/6875
摘要： There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.

10. 发明申请

US20210308828A1 DRESSING APPARATUS AND DRESSING METHOD FOR SUBSTRATE REAR SURFACE POLISHING MEMBER 有权
公开(公告)号：US20210308828A1
公开(公告)日：2021-10-07
申请号：US17347824
申请日：2021-06-15
申请人： Tokyo Electron Limited
发明人： Yoshiki Okamoto , Yasushi Takiguchi , Akihiro Kubo , Hayato Hosaka , Ryuto Ozasa
IPC分类号： B24B53/017 , B24B37/04 , B24B37/20 , B24B37/10 , B24B27/00 , B24B49/12 , B24B53/007 , B24B53/095 , B24B53/14
摘要： A dressing apparatus includes a bus member which is equipped with a ceiling plate and a circular or polygonal cylindrical skirt portion provided at a bottom surface of the ceiling plate and which is configured to accommodate a polishing pad from thereabove. The bus member includes a dual fluid nozzle configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad; a dress board configured to come into contact with the polishing surface of the polishing pad; and a rinse nozzle configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad and the dress board. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion.

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