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    • 4. 发明申请
    • OPERATING METHOD OF NON-VOLATILE MEMORY DEVICE
    • 非易失性存储器件的操作方法
    • US20070290273A1
    • 2007-12-20
    • US11554455
    • 2006-10-30
    • HANG-TING LUEERH-KUN LAISZU-YU WANG
    • HANG-TING LUEERH-KUN LAISZU-YU WANG
    • H01L29/76
    • H01L29/42324G11C16/0466G11C16/0483H01L21/28282H01L27/115H01L27/11568H01L29/513
    • An operating method of non-volatile memory device is provided. The device includes memory cells having a semiconductor substrate, a stack layer, and source and drain regions disposed below a surface of the substrate and separated by a channel region. The stack layer includes an insulating layer disposed on the channel region, a charge storage layer disposed on the insulating layer, a multi-layer tunneling dielectric structure on the charge storage layer, and a gate disposed on the multi-layer tunneling dielectric structure. A negative bias is supplied to the gate to inject electrons into the charge storage layer through the multi-layer tunneling dielectric structure by −FN tunneling so that the threshold voltage of the device is increased. A positive bias is supplied to the gate to inject holes into the charge storage layer through the multi-layer tunneling dielectric structure by +FN tunneling so that the threshold voltage of the device is decreased.
    • 提供了一种非易失性存储器件的操作方法。 该器件包括具有半导体衬底,堆叠层以及设置在衬底的表面下方并由沟道区分隔开的源极和漏极区的存储单元。 堆叠层包括设置在沟道区上的绝缘层,设置在绝缘层上的电荷存储层,电荷存储层上的多层隧道电介质结构,以及设置在多层隧道电介质结构上的栅极。 向栅极提供负偏压,通过多沟道介质结构通过-FN隧穿将电子注入电荷存储层,从而增加器件的阈值电压。 向栅极提供正偏压,以通过+ FN隧穿通过多层隧道电介质结构将空穴注入电荷存储层,使得器件的阈值电压降低。
    • 10. 发明申请
    • NON-VOLATILE MEMORY SEMICONDUCTOR DEVICE HAVING AN OXIDE-NITRIDE-OXIDE (ONO) TOP DIELECTRIC LAYER
    • 具有氧化氮氧化物(ONO)顶层电介质层的非易失性存储器半导体器件
    • US20090280611A1
    • 2009-11-12
    • US12506993
    • 2009-07-21
    • HANG-TING LUEErh-Kun Lai
    • HANG-TING LUEErh-Kun Lai
    • H01L21/336H01L21/28
    • H01L29/792H01L29/513
    • A non-volatile memory (NVM) cell includes a silicon substrate having a main surface, a source region in a portion of the silicon substrate, a drain region in a portion of the silicon substrate, and a well region disposed in a portion of the silicon substrate between the source and drain regions. The cell includes a bottom oxide layer formed on the main surface of the substrate. The bottom oxide layer is disposed on a portion of the main surface proximate the well region. The cell includes a charge storage layer disposed above the bottom oxide layer, a dielectric tunneling layer disposed above the charge storage layer and a control gate formed above the dielectric tunneling layer. The dielectric tunneling layer includes a first oxide layer, a nitride layer and a second oxide layer. Erasing the NVM cell includes applying a positive gate voltage to inject holes from the gate.
    • 非易失性存储器(NVM)单元包括具有主表面的硅衬底,硅衬底的一部分中的源极区域,硅衬底的一部分中的漏极区域和设置在硅衬底的一部分中的阱区域 硅衬底在源区和漏区之间。 电池包括形成在基板的主表面上的底部氧化物层。 底部氧化物层设置在靠近阱区域的主表面的一部分上。 电池包括设置在底部氧化物层上方的电荷存储层,设置在电荷存储层上方的电介质隧道层和形成在电介质隧道层上方的控制栅极。 介电隧道层包括第一氧化物层,氮化物层和第二氧化物层。 擦除NVM单元包括施加正栅极电压以从栅极注入孔。