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1. 发明授权

US11027479B2 Thermal control mold for making three-dimensional microstructures 有权
公开(公告)号：US11027479B2
公开(公告)日：2021-06-08
申请号：US15711254
申请日：2017-09-21
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Jae Yoong Cho
IPC分类号： B29C51/36 , B29C51/42 , B81C99/00 , B29C51/10 , B29L31/00 , G01C19/5691 , B81C1/00 , B29L31/34
摘要： Methods for fabricating three-dimensional microstructures are provided. The method includes disposing a reflow material on a mold, heating the reflow material, and creating a pressure gradient across the reflow material to reflow the material towards a bottom surface of the mold. The mold includes a molding region, a boundary region, and a thermal-isolating region disposed therebetween. The molding region includes a cavity and a projection projecting upwards from a bottom surface of the cavity. The thermal-isolating region includes at least one pocket formed adjacent to and along a perimeter of the cavity of the molding region. During heating, the temperature of the molding region is higher than that of the boundary region and the thermal-isolating region controls the thermal conductivity and mass therebetween. The material reflows towards the bottom surface of the cavity and the protrusion helps shapes the reflow material to form a substantially symmetrical three-dimensional microstructure.

2. 发明授权

US10598491B2 Stacked balanced resonators 有权
公开(公告)号：US10598491B2
公开(公告)日：2020-03-24
申请号：US15841782
申请日：2017-12-14
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Ali Darvishian
IPC分类号： G01C19/574 , H03H9/00 , H03H9/02 , H03H9/24
摘要： A resonator array comprises substantially paralleled first and second resonant layers having resonating masses. A first set of lateral drive electrodes cause the first resonating mass to vibrate along an axis in a first geometric plane. A second set of lateral drive electrodes cause the second resonating mass to vibrate along an axis in a second geometric plane in an opposite direction of the first resonating mass by about 180 degrees. Rotation in the system causes the masses to vibrate out-of-plane in opposite directions. The opposite vibrational directions of the first and second resonating masses produces a balanced system with small motion in a bonding area between the stacked resonators. As a result, there is minimal propagation of mechanical waves from the balanced system to a substrate resulting in lower anchor loss and a high Q-factor.

3. 发明申请

US20150253169A1 FLUID FLOW SENSOR 有权
标题翻译：流体流量传感器
公开(公告)号：US20150253169A1
公开(公告)日：2015-09-10
申请号：US13623084
申请日：2012-09-19
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Mahdi Sadeghi , Rebecca L. Peterson
IPC分类号： G01F1/69 , B23K20/00
CPC分类号： G01F1/69 , B23K20/004 , G01F1/698 , H01L2224/48091 , H01L2224/4813 , H01L2924/00014
摘要： A fluid flow sensor that utilizes hot-wire anemometry and is a small, light weight, cost effective, easily manufactureable, and low power consuming device. The fluid flow sensor operates by exposing a hot wire loop to a fluid stream such that the amount of heat lost to fluid convection is a function of one or more fluid-related parameters (e.g., fluid speed, fluid type, fluid density, etc.). The heat loss affects the resistance in the wire loop, which can then be used to estimate the fluid speed or other fluid-related parameter. According to an exemplary embodiment, the fluid flow sensor includes one or more wire loops that are made from pre-formed wires and are wire bonded, micro-welded or otherwise non-monolithically attached to a substrate that may or may not include embedded sensor circuitry.
摘要翻译：一种利用热线风速计的流体流量传感器，它是一种体积小，重量轻，成本低廉，易于制造且功耗低的装置。流体流量传感器通过将热线环暴露于流体流来操作，使得流体对流所损失的热量是一个或多个流体相关参数（例如流体速度，流体类型，流体密度等）的函数。）。热损失影响线环中的电阻，然后可以用它来估计流体速度或其他流体相关参数。根据示例性实施例，流体流量传感器包括一个或多个由预先形成的线制成的线圈，并且线接合，微焊接或以其它方式非单片连接到可以包括或不包括嵌入式传感器电路。

4. 发明授权

US11678578B2 Thermoelectric micro-module with high leg density for energy harvesting and cooling applications 有权
公开(公告)号：US11678578B2
公开(公告)日：2023-06-13
申请号：US17164002
申请日：2021-02-01
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Yi Yuan , Ethem Aktakka
IPC分类号： H10N10/17 , H10N10/01 , H10N10/852 , H10N10/853 , H10N10/855 , H10N19/00
CPC分类号： H10N10/17 , H10N10/01 , H10N10/852 , H10N10/853 , H10N10/855 , H10N19/101
摘要： Micro-scale thermoelectric devices having high thermal resistance and efficiency for use in cooling and energy harvesting applications and relating fabricating methods are disclosed. The thermoelectric devices include first substrates substantially parallel with second substrates. Scaffold members are deposited between the first and second substrate. The scaffold members include a plurality of cavities having sidewalls. The scaffold members may be formed from the second substrate. The sidewalls are substantially vertical with respect to the second substrate. The sidewalls may be substantially parallel. Thermoelectric materials are deposited on the sidewalls.

5. 发明授权

US10985633B2 Vibrational energy harvester with amplifier having gear assembly 有权
公开(公告)号：US10985633B2
公开(公告)日：2021-04-20
申请号：US15317327
申请日：2014-06-10
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Iman Shahosseini , Khalil Najafi
IPC分类号： H02K7/06 , H02K7/116 , H02K35/00 , H02K7/18 , F04B19/22 , F16H19/04 , F16H21/44
摘要： An energy harvester coupled to a vibration source includes a housing, a transducer, and an amplifier. The transducer may have a first part and a second part. The first part and the second part may move relative to each other along a central axis in response to a motion from the vibration source. The amplifier is coupled to the housing and operable to amplify an amplitude of the motion received from the vibration source. The amplifier has an input member coupled to the vibration source and an output member coupled to the first part of the transducer. The input member moves at a distance D1 in response to the motion from the vibration source. The output member moves the first part of the transducer in response to the input member moving. The first part of the transducer moves along the central axis by a distance D2, where D2>D1.

6. 发明授权

US10734877B2 Electromagnetic energy transducer 有权
公开(公告)号：US10734877B2
公开(公告)日：2020-08-04
申请号：US15317318
申请日：2014-06-10
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Iman Shahosseini , Khalil Najafi , Rebecca L. Peterson
IPC分类号： H02K35/00 , H02K35/02 , H02K33/16 , H02K16/00 , H02K33/00 , H02K16/02
摘要： An electromagnetic transducer includes a magnetic assembly and a coil assembly. The magnetic assembly may include an inner magnet subassembly and an outer magnet subassembly. The inner magnet subassembly and the outer magnet subassembly each have a plurality of axial magnets arranged in a stacked configuration with a spacer disposed between vertically adjacent axial magnets. The coil assembly includes an inner coil subassembly and an outer coil subassembly. The inner coil subassembly is disposed between the inner magnet subassembly and the outer magnet subassembly, and the outer coil subassembly is disposed around the outer magnet subassembly. The coil assembly and the magnetic assembly are configured to move relative to each other.

7. 发明授权

US10730748B2 Three dimensional microstructures and fabrication process 有权
公开(公告)号：US10730748B2
公开(公告)日：2020-08-04
申请号：US15709568
申请日：2017-09-20
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Tal Nagourney , Jae Yoong Cho
IPC分类号： B81C99/00 , C03B23/03 , C03B23/035 , B22D23/06 , B81C1/00 , C03B23/02 , B22D25/02
摘要： A method for fabricating three-dimensional microstructures is presented. The method includes: disposing a substantially planar reflow material between two molds; heating the reflow material while the reflow material is disposed between the two molds; and reflowing the reflow material towards the bottom surface of one of the molds by creating a pressure gradient across the reflow material. At least one of molds includes geometrics features that help to shape the reflow material and thereby form a complex three-dimensional microstructure.

8. 发明授权

US10563642B2 Modular stacked variable-compression micropump and method of making same 有权
公开(公告)号：US10563642B2
公开(公告)日：2020-02-18
申请号：US15627692
申请日：2017-06-20
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Luis P. Bernal , Seyed Amin Sandoughsaz Zardini , Ali Besharatian
IPC分类号： F04B19/00 , F04B43/04 , F04B25/00 , F04B45/04 , F04B45/047 , B01L3/00
摘要： A micropump assembly is comprised of modular stacked pump stages. The modular pump stages are preferably stacked vertically on top of each other. The stacked design allows each pumping chamber to be compressed by two pumping membranes and thereby provide twice the compression as compared to conventional planar pump designs. The stacked design also eliminates the need for bidirectional movement of the pumping membrane. Lastly, the number of stacked pumping stages can be changed post-fabrication to achieve the required pressure for a given application.

9. 发明授权

US10495663B2 High aspect-ratio low noise multi-axis accelerometers 有权
公开(公告)号：US10495663B2
公开(公告)日：2019-12-03
申请号：US15436774
申请日：2017-02-18
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN
发明人： Khalil Najafi , Yemin Tang
IPC分类号： G01P15/125 , G01P15/135 , G01P15/08
CPC分类号： G01P15/135 , G01P15/0894 , G01P15/125
摘要： The design and fabrication of a multi-axis capacitive accelerometer is presented with sub-μg resolution based on CMOS-compatible fabrication technology that can provide large proof-mass, high-aspect ratio and a large sense electrode area within a smaller footprint that previous accelerometers. In some instances, the device footprint can be reduced by placing the sense electrodes near the top or bottom of the transducer structure such that motion of the transducer causes size of the sense gap to vary in a direction that is parallel with longitudinal axis of the support beam for the transducer structure. An extra mass can also be added to the top of the transducer structure to increase sensitivity.

10. 发明授权

US10266392B2 Environment-resistant module, micropackage and methods of manufacturing same 有权
公开(公告)号：US10266392B2
公开(公告)日：2019-04-23
申请号：US14251972
申请日：2014-04-14
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN , E-PACK, INC.
发明人： Khalil Najafi , Sang-Hyun Lee , Sang Woo Lee , Jay Stewart Mitchell , Onnop Srivannavit
IPC分类号： B81B7/00 , B81C1/00 , B81C3/00
摘要： An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

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