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    • 3. 发明授权
    • Contact portion of semiconductor integrated circuit device
    • 半导体集成电路器件的接触部分
    • US4916521A
    • 1990-04-10
    • US223971
    • 1988-07-25
    • Susumu YoshikawaShizuo Sawada
    • Susumu YoshikawaShizuo Sawada
    • H01L21/768H01L23/485
    • H01L23/485H01L2924/0002
    • A first insulation layer is formed on a semiconductor substrate, and a first conductive layer is formed on the first insulation layer. A second insulation layer is formed on the first conductive layer and the first insulation layer, and a first contact hole, having a width greater than that of the first conductive layer, is formed in the second insulation layer, at a position corresponding to the first conductive layer. A second conductive layer, having a width greater than that of the first contact hole, is formed on the second insulation layer and in the first contact hole, and is formed in contact with the upper and side surfaces of the first conductive layer located inside the second contact hole. A third insulation layer is formed on the second conductive layer and the second insulation layer, and a second contact hole, having a width less than that of the second conductive layer, is formed in the third insulation layer, at a position corresponding to the second conductive layer. A third conductive layer, having a width greater than that of the second contact hole but less than that of the second conductive layer, is formed on the third conductive layer and in the second contact hole. The first conductive layer is electrically connected to the third conductive layer.
    • 在半导体衬底上形成第一绝缘层,在第一绝缘层上形成第一导电层。 第二绝缘层形成在第一导电层和第一绝缘层上,并且具有大于第一导电层的宽度的第一接触孔形成在第二绝缘层中的与第一绝缘层相对应的位置处的第一绝缘层 导电层。 在第二绝缘层和第一接触孔中形成具有大于第一接触孔的宽度的第二导电层,并且形成为与位于第一接触孔内部的第一导电层的上表面和侧表面接触 第二接触孔。 在第二绝缘层上形成第三绝缘层,第二绝缘层和宽度小于第二导电层宽度的第二接触孔形成在第三绝缘层中,对应于第二绝缘层的第二绝缘层 导电层。 在第三导电层和第二接触孔中形成具有大于第二接触孔的宽度但小于第二导电层的宽度的第三导电层。 第一导电层电连接到第三导电层。
    • 5. 发明授权
    • Solid detergent composition
    • 固体洗涤剂组合物
    • US4320033A
    • 1982-03-16
    • US201837
    • 1980-10-29
    • Susumu Yoshikawa
    • Susumu Yoshikawa
    • C11D1/72C11D1/14C11D1/75C11D1/83C11D17/00
    • C11D1/75C11D1/83C11D17/006
    • A solid detergent composition, suitable for use in personal hygiene, having improved slough loss and wear rate characteristics is presented. This solid detergent compositions contains:(A) 40 to 89.9% by weight of at least one linear alpha-olefin sulfonate having 12 to 28 carbon atoms,(B) 10 to 60% by weight of at least one, tertiary amine oxide having general formulae (I) and (II) ##STR1## wherein R.sup.1 represents an alkyl group having 16 to 24 carbon atoms, R.sup.2 represents an alkyl group having 1 to 11 carbon atoms, R.sup.3 represents an alkyl group having 1 to 3 carbon atoms, R.sup.4 and R.sup.5 independently represent an alkyl group having 12 to 24 carbon atoms and R.sup.6 represents an alkyl group having 1 to 3 carbon atoms, and(C) 0.1 to 20% by weight of water.
    • 提出了一种适用于个人卫生的固体洗涤剂组合物,具有改善的脱落和磨损率特性。 该固体洗涤剂组合物包含:(A)40至89.9重量%的至少一种具有12至28个碳原子的直链α-烯烃磺酸盐,(B)10至60重量%的至少一种具有一般性的叔胺氧化物 式(I)和(II)其中R 1表示碳原子数为16〜24的烷基,R 2表示碳原子数1〜11的烷基,R 3表示烷基 具有1至3个碳原子,R 4和R 5独立地表示具有12至24个碳原子的烷基,R 6表示具有1至3个碳原子的烷基,(C)为0.1至20重量%的水。
    • 6. 发明授权
    • Semiconductor memory device and method of manufacturing the same
    • 半导体存储器件及其制造方法
    • US07608488B2
    • 2009-10-27
    • US11874481
    • 2007-10-18
    • Yasuyuki BabaSusumu Yoshikawa
    • Yasuyuki BabaSusumu Yoshikawa
    • H01L21/82
    • H01L29/42336H01L27/0203H01L27/105H01L27/11526H01L27/11543H01L27/11546H01L29/7881
    • A manufacturing method of a semiconductor memory device for manufacturing a first semiconductor device and a second semiconductor device wherein a cell array ratio is smaller than that of the first semiconductor device, said manufacturing method has forming the height of first element-isolating insulating films of first memory cell array region of said first semiconductor device so as to be a predetermined height, by performing etching treatment under predetermined conditions using a first etching mask having a first opening for exposing the entirety of said first memory cell array region, and forming the height of second element-isolating insulating films of second memory cell array region and part of peripheral circuit region of said second semiconductor device so as to be the predetermined height, by performing etching treatment under said predetermined conditions using a second etching mask having a second opening for exposing the entirety of said second memory cell array region and a third opening for exposing part of said peripheral circuit region.
    • 一种用于制造第一半导体器件的半导体存储器件的制造方法和其中电池阵列比小于第一半导体器件的半导体器件的制造方法,所述制造方法形成第一元件隔离绝缘膜的高度 所述第一半导体器件的存储单元阵列区域为预定高度,通过使用具有用于暴露所述第一存储单元阵列区域的整体的第一开口的第一蚀刻掩模在预定条件下进行蚀刻处理,并且形成 第二存储单元阵列区域的第二元件隔离绝缘膜和所述第二半导体器件的外围电路区域的一部分以预定高度,通过使用具有用于曝光的第二开口的第二蚀刻掩模在所述预定条件下进行蚀刻处理 所述第二存储单元阵列区域的整体a d用于暴露所述外围电路区域的一部分的第三开口。
    • 7. 发明申请
    • Nonvolatile semiconductor memory and fabrication method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US20070012989A1
    • 2007-01-18
    • US11342524
    • 2006-01-31
    • Susumu Yoshikawa
    • Susumu Yoshikawa
    • H01L29/788
    • H01L27/11521G11C16/0408H01L27/115H01L27/11519
    • A nonvolatile semiconductor memory includes a first and a second active area configured to extend in the column direction in parallel; an element isolating region configured to electrically separate the first and the second active area; a plurality of word lines configured to extend in the row direction and be constituted by respective main parts and respective ends; and a plurality of memory cell transistors configured to be disposed on intersections between the respective main parts of the plurality of word lines and the second active area. Each memory cell transistor comprises a gate insulating film, a floating gate electrode, an inter-gate insulating film, and a control gate electrode, constituting a memory cell array; a short-circuit region configured to electrically short circuit the ends of the plurality of word lines; and a trench configured to separate the ends from the main parts of the plurality of word lines.
    • 非易失性半导体存储器包括被配置为在列方向上并行延伸的第一和第二有源区域; 元件隔离区域,被配置为电分离第一和第二有源区域; 多个字线,被构造成在行方向上延伸并由相应的主要部分和相应的端部构成; 以及多个存储单元晶体管,被配置为设置在所述多个字线的各个主要部分和所述第二有效区域之间的交叉点上。 每个存储单元晶体管包括构成存储单元阵列的栅绝缘膜,浮栅电极,栅极间绝缘膜和控制栅电极; 短路区域,被配置为使多个字线的端部电短路; 以及沟槽,其被配置为将端部与多个字线的主要部分分开。
    • 8. 发明授权
    • Nonvolatile semiconductor memory and fabrication method for the same
    • 非易失性半导体存储器及其制造方法相同
    • US07732854B2
    • 2010-06-08
    • US11984489
    • 2007-11-19
    • Susumu Yoshikawa
    • Susumu Yoshikawa
    • H01L29/788
    • H01L27/11521G11C16/0408H01L27/115H01L27/11519
    • A nonvolatile semiconductor memory includes a first and a second active area configured to extend in the column direction in parallel; an element isolating region configured to electrically separate the first and the second active area; a plurality of word lines configured to extend in the row direction and be constituted by respective main parts and respective ends; and a plurality of memory cell transistors configured to be disposed on intersections between the respective main parts of the plurality of word lines and the second active area. Each memory cell transistor comprises a gate insulating film, a floating gate electrode, an inter-gate insulating film, and a control gate electrode, constituting a memory cell array; a short-circuit region configured to electrically short circuit the ends of the plurality of word lines; and a trench configured to separate the ends from the main parts of the plurality of word lines.
    • 非易失性半导体存储器包括被配置为在列方向上并行延伸的第一和第二有源区域; 元件隔离区域,被配置为电分离第一和第二有源区域; 多个字线,被构造成在行方向上延伸并由相应的主要部分和相应的端部构成; 以及多个存储单元晶体管,被配置为设置在所述多个字线的各个主要部分和所述第二有效区域之间的交叉点上。 每个存储单元晶体管包括构成存储单元阵列的栅绝缘膜,浮栅电极,栅极间绝缘膜和控制栅电极; 短路区域,被配置为使多个字线的端部电短路; 以及沟槽,其被配置为将端部与多个字线的主要部分分开。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体存储器件及其制造方法
    • US20080258201A1
    • 2008-10-23
    • US11874481
    • 2007-10-18
    • Yasuyuki BABASusumu Yoshikawa
    • Yasuyuki BABASusumu Yoshikawa
    • H01L29/788H01L21/3065
    • H01L29/42336H01L27/0203H01L27/105H01L27/11526H01L27/11543H01L27/11546H01L29/7881
    • A manufacturing method of a semiconductor memory device for manufacturing a first semiconductor device and a second semiconductor device wherein a cell array ratio is smaller than that of the first semiconductor device, said manufacturing method has forming the height of first element-isolating insulating films of first memory cell array region of said first semiconductor device so as to be a predetermined height, by performing etching treatment under predetermined conditions using a first etching mask having a first opening for exposing the entirety of said first memory cell array region, and forming the height of second element-isolating insulating films of second memory cell array region and part of peripheral circuit region of said second semiconductor device so as to be the predetermined height, by performing etching treatment under said predetermined conditions using a second etching mask having a second opening for exposing the entirety of said second memory cell array region and a third opening for exposing part of said peripheral circuit region.
    • 一种用于制造第一半导体器件的半导体存储器件的制造方法和其中电池阵列比小于第一半导体器件的半导体器件的制造方法,所述制造方法形成第一元件隔离绝缘膜的高度 所述第一半导体器件的存储单元阵列区域为预定高度,通过使用具有用于暴露所述第一存储单元阵列区域的整体的第一开口的第一蚀刻掩模在预定条件下进行蚀刻处理, 第二存储单元阵列区域的第二元件隔离绝缘膜和所述第二半导体器件的外围电路区域的一部分以预定高度,通过使用具有用于曝光的第二开口的第二蚀刻掩模在所述预定条件下进行蚀刻处理 所述第二存储单元阵列区域的整体a d用于暴露所述外围电路区域的一部分的第三开口。