专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120279683A1 COOLING APPARATUS FOR COMMUNICATIONS PLATFORMS 审中-公开
标题翻译：冷却装置用于通信平台
公开(公告)号：US20120279683A1
公开(公告)日：2012-11-08
申请号：US13101562
申请日：2011-05-05
申请人： Susanne Arney , Jen-Hau Cheng , John Daly , Domhnaill Hernon , Marc S. Hodes , Christian Joncourt , Paul R. Kolodner , Krishna-Murty Kota-Venkata , Alan Lyons , Todd R. Salamon , William Scofield , Maria E. Simon , Oliver Taheny
发明人： Susanne Arney , Jen-Hau Cheng , John Daly , Domhnaill Hernon , Marc S. Hodes , Christian Joncourt , Paul R. Kolodner , Krishna-Murty Kota-Venkata , Alan Lyons , Todd R. Salamon , William Scofield , Maria E. Simon , Oliver Taheny
IPC分类号： F28F13/00 , B23P19/00
CPC分类号： H05K7/20681 , Y10T29/49826
摘要： An apparatus comprising a rack having one or more shelves, a plurality of electronics circuit boards and heat conduits and a cooler. Each board is held by one of the one or more shelves, some of the boards having a localized heat source thereon. Each heat conduit forms a heat conducting path over and adjacent to a particular one of the boards from a region adjacent to the heat source thereon to a connection zone, the zone being remote from the heat source. The cooler is located on a side of the rack and coupled to the zones such that heat is transferable from the paths to the cooler. The cooler is configured to flow a cooling fluid therein to cool localized thermal interfaces at the cooler, each interface being adjacent to and at a corresponding one of the zones.
摘要翻译：一种装置，包括具有一个或多个架子的架子，多个电子电路板和热导管以及冷却器。每个板由一个或多个搁板中的一个搁置，一些板上具有局部热源。每个热导管在与其上的热源相邻的区域上的特定一个板上并邻近其形成热传导路径到连接区域，该区域远离热源。冷却器位于机架的一侧并且连接到区域，使得热量可以从路径传递到冷却器。冷却器构造成使其中的冷却流体流动以冷却冷却器处的局部热界面，每个界面相邻并在相应的一个区域。

2. 发明授权

US07299859B2 Temperature control of thermooptic devices 失效
标题翻译：热电装置的温度控制
公开(公告)号：US07299859B2
公开(公告)日：2007-11-27
申请号：US10424697
申请日：2003-04-28
申请人： Cristian A. Bolle , Christopher Richard Doerr , Marc S. Hodes
发明人： Cristian A. Bolle , Christopher Richard Doerr , Marc S. Hodes
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： F28D15/06
摘要： A low power or passive optical apparatus provides temperature control of dynamic thermooptic devices and temperature-sensitive optical devices formed on the same substrate. The optical apparatus includes a variable heat transfer device with a conductive heat transfer component (e.g., heat pipe) and a heat-conductive interface component (e.g., heat sink) to exchange thermal energy with an external environment. In one embodiment, the heat pipe has a variable resistance and the heat sink has a fixed thermal resistance. In a second embodiment, the heat pipe has a fixed resistance and the heat sink has a variable thermal resistance. In another embodiment both the heat pipe and heat sink have variable thermal resistance. In another embodiment, the optical apparatus further includes a thermoelectric cooler and the variable heat transfer device (e.g., variable heat pipe and/or heat sink) is used to reduce the temperature range over which said thermoelectric cooler operates, resulting in a lower power requirement for the thermoelectric cooler.
摘要翻译：低功率或无源光学装置提供动态热光器件和形成在同一衬底上的温度敏感光学器件的温度控制。光学装置包括具有导电传热部件（例如，热管）和用于与外部环境交换热能的导热接口部件（例如，散热器）的可变传热装置。在一个实施例中，热管具有可变电阻并且散热器具有固定的热阻。在第二实施例中，热管具有固定的电阻，并且散热器具有可变的热阻。在另一个实施例中，热管和散热器都具有可变的热阻。在另一个实施例中，光学装置还包括热电冷却器，并且使用可变热传递装置（例如，可变热管和/或散热器）来降低所述热电冷却器所在的温度范围，导致较低的功率需求用于热电冷却器。

3. 发明申请

US20090294117A1 Vapor Chamber-Thermoelectric Module Assemblies 审中-公开
标题翻译：蒸气室 - 热电模块组件
公开(公告)号：US20090294117A1
公开(公告)日：2009-12-03
申请号：US12128478
申请日：2008-05-28
申请人： Marc S. Hodes , Alan M. Lyons
发明人： Marc S. Hodes , Alan M. Lyons
IPC分类号： F28D15/00 , G05D23/00
CPC分类号： H01L23/427 , F28D15/06 , H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： An apparatus includes a body containing a vapor chamber and having first and opposing second major surfaces and a thermoelectric module having first and opposing second major surfaces. The second major surface of the body is in thermal contact with the first major surface of the thermoelectric module. A heat sink has a first major surface in thermal contact with the second major surface of the thermoelectric module. The thermoelectric module is configured to control a flow of heat between the body and the heat sink.
摘要翻译：一种装置包括一个包含蒸汽室并具有第一和相对的第二主表面的主体和具有第一和相对的第二主表面的热电模块。主体的第二主表面与热电模块的第一主表面热接触。散热器具有与热电模块的第二主表面热接触的第一主表面。热电模块被配置为控制主体和散热器之间的热量流动。

4. 发明申请

US20100006132A1 Stacked Thermoelectric Modules 审中-公开
标题翻译：堆叠热电模块
公开(公告)号：US20100006132A1
公开(公告)日：2010-01-14
申请号：US12172396
申请日：2008-07-14
申请人： Marc S. Hodes
发明人： Marc S. Hodes
IPC分类号： H01L35/02
CPC分类号： H01L35/30
摘要： An apparatus includes a first thermally conductive body having a plurality of fingers and a second thermally conductive body having a plurality of fingers. The first and second bodies are configured such that the fingers of the first body are interdigitated with the fingers of the second body. Each of a plurality of thermoelectric modules has a first major surface and an opposing second major surface. The first major surface of each thermoelectric module is in thermal contact with one of the fingers of the first body, and the second major surface is in thermal contact with one of the fingers of the second body.
摘要翻译：一种装置包括具有多个指状物的第一导热体和具有多个指状物的第二导热体。第一和第二主体被构造成使得第一主体的指状物与第二主体的手指相互交错。多个热电模块中的每一个具有第一主表面和相对的第二主表面。每个热电模块的第一主表面与第一主体的指状物之一热接触，并且第二主表面与第二主体的指状物之一热接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式