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1. 发明申请

US20120048185A1 APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS 审中-公开
标题翻译：在线上形成非对称密封珠的装置
公开(公告)号：US20120048185A1
公开(公告)日：2012-03-01
申请号：US13290114
申请日：2011-11-06
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： B05C5/02 , H01L21/70 , B05C11/00
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/48 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78313 , H01L2224/83 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors. The micro-electronic device has a planar active surface with functional elements. The apparatus includes: a tiltable table for supporting the micro-electronic device, the table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal; and a jetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.
摘要翻译：一种用于在将微电子器件电连接到一系列导体上的一系列引线键合上形成不对称密封剂珠的装置。微电子器件具有带功能元件的平面有源表面。该装置包括：用于支撑微电子装置的可倾斜工作台，所述工作台被配置为相对于水平面以预定角度倾斜平面有源表面; 以及位于可倾斜结构上方的喷射器，用于将密封材料液滴喷射到一系列引线键合上。

2. 发明申请

US20090079097A1 ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT 审中-公开
公开(公告)号：US20090079097A1
公开(公告)日：2009-03-26
申请号：US12237387
申请日：2008-09-25
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H01L23/28
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/451 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/78313 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2924/20754 , H01L2224/05599
摘要： An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

3. 发明授权

US08063318B2 Electronic component with wire bonds in low modulus fill encapsulant 有权
标题翻译：具有低模量填充密封剂中引线键合的电子部件
公开(公告)号：US08063318B2
公开(公告)日：2011-11-22
申请号：US12364514
申请日：2009-02-03
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H01L23/28
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/48 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78313 , H01L2224/83 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.
摘要翻译：一种电子部件，其具有带有多个电导体的支撑结构，一系列引线接合，每个引线键分别从一个电导体延伸，每个引线接合具有接触电导体的端部部分和与端部连续的中间部分，封装电导体的坝密封剂珠和每个引线接合的端部部分，以及填充密封剂珠与坝密封剂的珠接触并封装每根线的中间部分债券。坝密封剂具有比填充密封剂更高的弹性模量。

4. 发明申请

US20090135569A1 ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT 有权
标题翻译：电子元件在低模块填充物中的电线
公开(公告)号：US20090135569A1
公开(公告)日：2009-05-28
申请号：US12364514
申请日：2009-02-03
申请人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H05K1/18
CPC分类号： H01L21/56 , H01L23/3157 , H01L24/48 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78313 , H01L2224/83 , H01L2224/85181 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/20753 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2924/20752 , H01L2924/20754 , H01L2224/05599
摘要： An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.
摘要翻译：一种电子部件，其具有带有多个电导体的支撑结构，一系列引线接合，每个引线键分别从一个电导体延伸，每个引线接合具有接触电导体的端部部分和与端部连续的中间部分，封装电导体的坝密封剂珠和每个引线接合的端部部分，以及填充密封剂珠与坝密封剂的珠接触并封装每根线的中间部分债券。坝密封剂具有比填充密封剂更高的弹性模量。

5. 发明授权

US08293589B2 Wire bond encapsulant control method 有权
标题翻译：电线键合密封剂控制方法
公开(公告)号：US08293589B2
公开(公告)日：2012-10-23
申请号：US12694101
申请日：2010-01-26
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of depositing encapsulant on a line of wire bonds to a die is described, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads and functional elements spaced from the contact pads. The method involves the steps of providing a die mounted to the support structure, positioning a barrier between the contact pads and the functional elements, the barrier being proximate to, but spaced from the active surface, depositing a bead of encapsulant onto the electrical contact pads while the barrier remains stationary such that the barrier prevents the encapsulant from contacting the functional elements, removing the barrier when the bead of encapsulant has been deposited. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：描述了将密封剂沉积在与管芯接合的线上的方法，所述管芯具有与支撑结构接触的后表面和与背面相对的有效表面，活性表面具有电接触焊盘和功能元件与接触垫。该方法包括以下步骤：提供安装到支撑结构的模具，在接触垫和功能元件之间定位阻挡层，阻挡层邻近但与活性表面隔开，将密封剂珠填充到电接触垫同时屏障保持静止，使得屏障防止密封剂与功能元件接触，当已经沉积密封剂珠时去除阻挡层。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

6. 发明授权

US07659141B2 Wire bond encapsulant application control 有权
标题翻译：电线键合密封剂应用控制
公开(公告)号：US07659141B2
公开(公告)日：2010-02-09
申请号：US11860541
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of applying encapsulant to a die mounted to a support structure by providing a die mounted to the support structure, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads, positioning a barrier proximate the electrical contact pads and spaced from the active surface to define a gap and, depositing a bead of encapsulant onto the electrical contact pads such that one side of the bead contacts the barrier and a portion of the bead extends into the gap and onto the active surface. Placing a barrier over the active surface so that it defines a narrow gap allows the geometry of the encapsulant front (the line of contact between the encapsulant and the active surface) can be more closely controlled. Any variation in the flowrate of encapsulant from the needle tends to cause bulges or valleys in the height of the bead and or the PCB side of the bead. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：一种通过提供安装到支撑结构的模具将密封剂施加到安装到支撑结构上的模具的方法，模具具有与支撑结构接触的后表面和与背面相对的活动表面，活性表面具有电接触焊盘，邻近电接触焊盘定位屏障并且与有源表面间隔开以限定间隙，并且将密封剂珠填充到电接触焊盘上，使得焊道的一侧接触屏障并且一部分焊珠延伸成间隙和活动表面。在活性表面上设置阻挡层，使得其限定窄的间隙允许密封剂前部的几何形状（密封剂和活性表面之间的接触线）可以被更加严密地控制。密封剂从针头流出的任何变化趋向于在珠子的高度和珠子的PCB侧产生凸起或凹陷。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

7. 发明申请

US20100244282A1 ASSEMBLY OF ELECTRONIC COMPONENTS 失效
标题翻译：电子元件组装
公开(公告)号：US20100244282A1
公开(公告)日：2010-09-30
申请号：US12813472
申请日：2010-06-10
申请人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
发明人： Kia Silverbrook , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
IPC分类号： H01L23/49 , H01L23/498
CPC分类号： H01L24/85 , H01L21/56 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/4899 , H01L2224/78313 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/859 , H01L2224/8592 , H01L2224/8593 , H01L2224/85947 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs.
摘要翻译：具有支撑结构的电子部件组件，具有多个接触焊盘的集成电路芯片，具有多个导体的印刷电路板，所述集成电路管芯和所述PCB通过管芯附着膜安装到所述支撑结构，它们彼此相邻并且彼此分开，并且引线将电接触焊盘电连接到导体。每个线接合的中间部分粘附到管芯附着膜上以降低引线接合弧的轮廓。

8. 发明授权

US07803659B2 Method of encapsulating wire bonds 失效
标题翻译：封装线接合方法
公开(公告)号：US07803659B2
公开(公告)日：2010-09-28
申请号：US12611922
申请日：2009-11-03
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , H01L21/56 , H01L23/13 , H01L24/00 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method encapsulating wire bonds that extend between a die and conductors on a supporting substrate, by contacting an edge of a profiling blade with the encapsulant material to form a bead of the encapsulant on the edge, positioning the edge such that the bead contacts the die and, moving the profiling blade relative to the die to cover the wire bonds with the encapsulant. Wiping the encapsulant over the wire bonds with a profiling blade provides control of the encapsulant front as well as the height of the encapsulant relative to the die. The movement of the profiling surface relative to the die can closely controlled to shape the encapsulant to a desired form. Using the example of a printhead die, the encapsulant can be shaped to present an inclined face rising from the nozzle surface to a high point over the wire bonds. This can be used by the printhead maintenance facilities to maintain contact pressure on the wiping mechanism. However, it will be appreciated that the encapsulant can be shaped to have ridges, gutters, grooves and so on by using a particular shape of profiling blade edge and relative movement with the die.
摘要翻译：一种封装线接合的方法，其通过使成型叶片的边缘与密封剂材料接触而在模具和导体之间延伸在支撑衬底上，以在边缘上形成密封剂的珠粒，定位边缘使得胎圈与模具接触并且使成型刀片相对于管芯移动以覆盖与密封剂的引线接合。通过线材与成型刀片擦拭密封剂提供密封剂前端以及密封剂相对于管芯的高度的控制。轮廓表面相对于模具的移动可以被紧密地控制，以将密封剂成形为期望的形式。使用打印头芯片的示例，密封剂可以被成形为呈现从喷嘴表面升高到线接合处的高点的倾斜面。这可以被打印头维护设施用来保持擦拭机构的接触压力。然而，应当理解，通过使用特定形状的成型叶片边缘和与模具的相对运动，密封剂可以成形为具有脊，沟槽，凹槽等。

9. 发明申请

US20090081833A1 WIRE BOND ENCAPSULANT APPLICATION CONTROL 有权
标题翻译： WIRE BOND ENCAPSULANT应用控制
公开(公告)号：US20090081833A1
公开(公告)日：2009-03-26
申请号：US11860541
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/56
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of applying encapsulant to a die mounted to a support structure by providing a die mounted to the support structure, the die having a back surface in contact with the support structure and an active surface opposing the back surface, the active surface having electrical contact pads, positioning a barrier proximate the electrical contact pads and spaced from the active surface to define a gap and, depositing a bead of encapsulant onto the electrical contact pads such that one side of the bead contacts the barrier and a portion of the bead extends into the gap and onto the active surface. Placing a barrier over the active surface so that it defines a narrow gap allows the geometry of the encapsulant front (the line of contact between the encapsulant and the active surface) can be more closely controlled. Any variation in the flowrate of encapsulant from the needle tends to cause bulges or valleys in the height of the bead and or the PCB side of the bead. The fluidic resistance generated by the gap between the barrier and the active surface means that the amount of encapsulant that flows into the gap and onto the active surface is almost constant. The reduced flow variations make the encapsulant front closely correspond to the shape of the barrier. Greater control of the encapsulant front allows the functional elements of the active surface of the die to be closer to the contact pads.
摘要翻译：一种通过提供安装到支撑结构的模具将密封剂施加到安装到支撑结构上的模具的方法，模具具有与支撑结构接触的后表面和与背面相对的活动表面，活性表面具有电接触焊盘，邻近电接触焊盘定位屏障并且与有源表面间隔开以限定间隙，并且将密封剂珠填充到电接触焊盘上，使得焊道的一侧接触屏障并且一部分焊珠延伸成间隙和活动表面。在活性表面上设置阻挡层，使得其限定窄的间隙允许密封剂前部的几何形状（密封剂和活性表面之间的接触线）可以被更加严密地控制。密封剂从针头流出的任何变化趋向于在珠子的高度和珠子的PCB侧产生凸起或凹陷。由阻挡层和活性表面之间的间隙产生的流体阻力意味着流入间隙和活性表面上的密封剂的量几乎恒定。减少的流动变化使得密封剂前端紧密对应于屏障的形状。密封剂前沿的更好的控制允许模具的有效表面的功能元件更接近接触垫。

10. 发明申请

US20090081832A1 METHOD OF REDUCING WIRE BOND PROFILE HEIGHT IN INTEGRATED CIRCUITS MOUNTED TO CIRCUIT BOARDS 有权
标题翻译：在电路板安装的集成电路中减少线束配置高度的方法
公开(公告)号：US20090081832A1
公开(公告)日：2009-03-26
申请号：US11860539
申请日：2007-09-25
申请人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
发明人： Laval Chung-Long-Shan , Kiangkai Tankongchumruskul , Kia Silverbrook
IPC分类号： H01L21/56
CPC分类号： H01L23/3157 , H01L21/56 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/78 , H01L2224/85205 , H01L2224/8592 , H01L2224/85947 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/20753 , H01L2924/20752 , H01L2924/00 , H01L2224/45099 , H01L2924/20754 , H01L2224/05599
摘要： A method of profiling a wire bond between a contact pad on a die, and a conductor on a supporting structure, by electrically connecting the contact pad on the die to the conductor on the supporting structure with a wire bond, the wire bond extending in an arc from the contact pad to the conductor, pushing on the wire bond to collapse the arc and plastically deform the wire bond, and then releasing the wire bonds such that the plastic deformation maintains the wire bond in a flatter profile shape. The strength of the wire bond is known to be relatively small; of the order of 3 to 5 grams force. However, the Applicant's work has found that the wire bond structure is robust enough to withstand a certain degree of work hardening from plastic deformation. The arc of the wire bond can be deformed into a flatter profile without compromising the electrical connection with the PCB.
摘要翻译：通过用导线接合将模具上的接触垫与支撑结构上的导体电连接在一起，在芯片上的接触焊盘与支撑结构上的导体之间形成引线接合的方法，电弧从接触焊盘到导体，推动导线接合以使电弧塌陷并塑性变形引线接合，然后释放引线接合，使得塑性变形使线接合保持平坦的轮廓形状。已知线键的强度相对较小; 的次数为3〜5克力。然而，申请人的工作已经发现，线接合结构足够坚固以承受塑性变形的一定程度的加工硬化。引线接合的弧可以变形成更扁平的轮廓，而不会损害与PCB的电连接。

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