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    • 2. 发明授权
    • BiCMOS semiconductor device
    • BiCMOS半导体器件
    • US5173760A
    • 1992-12-22
    • US498590
    • 1990-03-26
    • Sung-Ki MinChang-Won KahngUk-Rae ChoJong-Mil YounSuk-Gi Choi
    • Sung-Ki MinChang-Won KahngUk-Rae ChoJong-Mil YounSuk-Gi Choi
    • H01L21/8249
    • H01L21/8249
    • A method for fabricating a BiCMOS device to achieve a maximum performance through a minimum processing steps, in which the BiCMOS device comprises high integration and high performance MOS transistors, self-aligned metal contact emitter type bipolar transistors having high load driving force, high performance matching characteristics and high integration, and self-aligned polycrystalline silicon emitter type bipolar transistors having high integration and high speed characteristics in low current, thereby being used in high integration, high speed digital and precise analog system. Said method comprises a plurality of fabrication steps including ion-implantation, formation of thin film oxide layer, deposition of nitride layer, etching of oxide layer, formation of windows and others, alternately or/and sequentially in a single chip substrate.
    • 一种用于制造BiCMOS器件以通过最小处理步骤实现最大性能的方法,其中BiCMOS器件包括高集成度和高​​性能MOS晶体管,具有高负载驱动力的自对准金属接触发射极型双极晶体管,高性能匹配 特性和高集成度,以及在低电流下具有高集成度和高​​速特性的自对准多晶硅发射极型双极晶体管,从而被用于高集成度,高速数字和精确模拟系统。 所述方法包括在单个芯片衬底中交替地或/或顺序地包括离子注入,薄膜氧化物层的形成,氮化物层的沉积,氧化物层的蚀刻,窗口的形成等多个制造步骤。
    • 3. 发明授权
    • Method for making a BiCMOS semiconductor device
    • 制造BiCMOS半导体器件的方法
    • US4970174A
    • 1990-11-13
    • US244810
    • 1988-09-15
    • Sung-Ki MinChang-Won KahngUk-Rae ChoJong-Mil YounSukgi Choi
    • Sung-Ki MinChang-Won KahngUk-Rae ChoJong-Mil YounSukgi Choi
    • H01L29/73H01L21/302H01L21/331H01L21/8249H01L27/06H01L27/10H01L29/732
    • H01L21/8249Y10S148/009Y10S148/124
    • A method with less processing steps for making a BiCMOS semiconductor device which can be used both in high-integration, high-speed digital devices and in precise analog devices by forming within a single substrate a CMOS transistor, a metal contact emitter bipolymer transistor having the high load driving power and highly effective matching characteristics, and a polycrystalline silicon emitter bipolar transistor having a high-speed characteristic at a low current level. Said device includes a first and a second MOSFET, and a first and a second bipolar transistor on a first conductivity-type silicon substrate, wherein performing a second conductivity-type of ion-implantation for producing a first substrate region to thereon form the first MOSFET, and a third and a fourth substrate region to thereon form the first and second bipolar transistors, respectively on said substrate. The second MOSFET is subsequently formed in a second substrate region being located between the first and third substrate regions.
    • 一种具有较少处理步骤的方法,用于制造BiCMOS半导体器件,其可以在高集成度,高速数字器件和精确模拟器件中使用,通过在单个衬底内形成CMOS晶体管,金属接触发射二极管晶体管具有 高负载驱动功率和高效匹配特性,以及在低电流水平下具有高速特性的多晶硅发射极双极晶体管。 所述器件包括第一和第二MOSFET,以及在第一导电型硅衬底上的第一和第二双极晶体管,其中执行用于产生第一衬底区域的第二导电类型的离子注入形成第一MOSFET 以及分别在所述衬底上形成第一和第二双极晶体管的第三和第四衬底区域。 随后在位于第一和第三衬底区域之间的第二衬底区域中形成第二MOSFET。
    • 6. 发明申请
    • System and Method for Modeling Semiconductor Devices Using Pre-Processing
    • 使用预处理建模半导体器件的系统和方法
    • US20090024377A1
    • 2009-01-22
    • US11778454
    • 2007-07-16
    • Sung-Ki Min
    • Sung-Ki Min
    • G06G7/62
    • G06F17/5036
    • A system for modeling a semiconductor device comprises a pre-processing module and a simulation module. The pre-processing module stores at least one virtual model equation associated with at least one terminal of a semiconductor device. The pre-processing module receives an actual voltage value associated with the at least one terminal. The pre-processing module then calculates at least one modified voltage value for the at least one terminal based at least in part upon the virtual model equation and the actual voltage value. The simulation module receives the modified voltage value, and generates a simulation result for the semiconductor device based at least in part upon the modified voltage value.
    • 用于对半导体器件建模的系统包括预处理模块和仿真模块。 预处理模块存储与半导体器件的至少一个端子相关联的至少一个虚拟模型方程。 预处理模块接收与至少一个终端相关联的实际电压值。 预处理模块至少部分地基于虚拟模型方程和实际电压值来计算至少一个终端的至少一个修改的电压值。 模拟模块接收修改的电压值,并且至少部分地基于修改的电压值来生成半导体器件的模拟结果。
    • 7. 发明授权
    • Method for fabricating a BiCMOS device
    • BiCMOS器件制造方法
    • US4826783A
    • 1989-05-02
    • US106582
    • 1987-10-08
    • Suki-Gi ChoiSung-Ki MinChang-Won Kahng
    • Suki-Gi ChoiSung-Ki MinChang-Won Kahng
    • H01L29/94H01L21/331H01L21/78H01L21/8249H01L27/06H01L29/73H01L21/70
    • H01L21/8249Y10S148/009
    • This invention provides a method for fabricating a BiCMOS device, in which said device has a Si substrate of a first conductivity in which there is formed a first substrate region of a second conductivity for a bipolar transistor, a second substrate region of said second conductivity for a first MOSFET, having a source and drain of the first conductivity, and in which a part of said Si substrate is formed to provide a second MOSFET which has a source and drain of the second conductivity. A first nitride layer is used to prevent the substrate under a masking layer from oxidizing during the following oxidation processes, wherein the masking layer is composed of a oxide layer and the nitride layer. After some processes, the masking layer is removed. Implanting As impurities, a new oxide layer and a new nitride layer are deposited, wherein the role of the nitride layer is to protect a shallow emitter region. After that, a new clean oxide layer is grown for a gate insulator layer, and controllable clean gate oxide layer is obtained.
    • 本发明提供一种制造BiCMOS器件的方法,其中所述器件具有第一导电性的Si衬底,其中形成用于双极晶体管的第二导电性的第一衬底区域,所述第二导电性的第二衬底区域用于 第一MOSFET,其具有第一导电性的源极和漏极,并且其中形成所述Si衬底的一部分以提供具有第二导电性的源极和漏极的第二MOSFET。 第一氮化物层用于防止掩模层下的衬底在随后的氧化过程中氧化,其中掩模层由氧化物层和氮化物层组成。 在一些处理之后,去除掩模层。 植入作为杂质,沉积新的氧化物层和新的氮化物层,其中氮化物层的作用是保护浅的发射极区域。 之后,为栅极绝缘体层生长新的清洁氧化物层,并获得可控的清洁栅极氧化物层。