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1. 发明申请

US20050121712A1 Flash memory cell and method of manufacturing the same and programming/erasing/reading method of flash memory cell 审中-公开
标题翻译：闪存单元及其制造方法和闪存单元的编程/擦除/读取方法
公开(公告)号：US20050121712A1
公开(公告)日：2005-06-09
申请号：US11040969
申请日：2005-01-21
申请人： Sung Park , Young You , Yong Kim , Yoo Jeon
发明人： Sung Park , Young You , Yong Kim , Yoo Jeon
IPC分类号： G11C11/56 , G11C16/02 , G11C16/04 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792 , H01L21/336 , H01L27/108 , H01L29/76 , H01L29/94 , H01L31/119
CPC分类号： H01L27/11521 , G11C11/5628 , G11C11/5635 , G11C11/5642 , G11C16/0458 , G11C2211/5612 , H01L27/115 , H01L29/7887
摘要： Disclosed is a flash memory cell and method of manufacturing the same, and programming/erasing/reading method thereof. The flash memory cell comprises a first tunnel oxide film formed at a given region of a semiconductor substrate, a first floating gate formed on the first tunnel oxide film, a second tunnel oxide film formed over the semiconductor substrate and along one sidewall of the first floating gate, a second floating g ate isolated from the first floating gate while contacting the second tunnel oxide film, a dielectric film formed on the first floating gate and the second floating gate, a control gate formed on the dielectric film, a first junction region formed in the semiconductor substrate below one side of the second tunnel oxide film, and a second junction region formed in the semiconductor substrate below one side of the first tunnel oxide film. Therefore, the present invention can implement 2-bit cell or 3-bit cell of a high density using the existing process technology. Further, it can reduce the manufacture cost and implement a high-integrated flash memory cell that is advantageous than a conventional flash memory cell in view of charge storage/retention as well as programming time.
摘要翻译：公开了一种闪存单元及其制造方法及其编程/擦除/读取方法。闪速存储单元包括形成在半导体衬底的给定区域的第一隧道氧化物膜，形成在第一隧道氧化物膜上的第一浮栅，形成在半导体衬底上并沿着第一浮置区的一个侧壁的第二隧道氧化膜栅极，与第一沟槽氧化膜接触时与第一浮栅隔离的第二浮置栅极，形成在第一浮置栅极和第二浮置栅极上的电介质膜，形成在电介质膜上的控制栅极，形成的第一结区域在第二隧道氧化膜的一侧以下的半导体衬底中形成的第二结区，以及形成在第一隧道氧化膜的一侧以下的半导体衬底中的第二结区。因此，本发明可以使用现有的工艺技术来实现高密度的2比特单元或3比特单元。此外，鉴于电荷存储/保持以及编程时间，它可以降低制造成本并实现比传统闪存单元有利的高集成闪存单元。

2. 发明申请

US20070289691A1 Method of manufacturing non-shrinkage ceramic substrate 审中-公开
标题翻译：非收缩陶瓷基板的制造方法
公开(公告)号：US20070289691A1
公开(公告)日：2007-12-20
申请号：US11808929
申请日：2007-06-13
申请人： Yong Kim , Young Oh , Byeung Chang , Sung Park , Ki Hong
发明人： Yong Kim , Young Oh , Byeung Chang , Sung Park , Ki Hong
IPC分类号： C03B29/00
CPC分类号： B32B18/00 , C04B35/645 , C04B2235/963 , C04B2237/343 , C04B2237/562 , C04B2237/62 , C04B2237/68 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/0179 , H05K2203/308
摘要： A method of manufacturing a non-shrinkage ceramic substrate comprises preparing a plurality of green sheets; forming internal electrodes and conductive vias in the respective green sheets; laminating the plurality of green sheets to form a multilayer ceramic substrate; forming a constrained layer on the top and bottom surfaces of the multilayer ceramic substrate by using one or more methods selected from the group consisting of an ALD (Atomic Layer Deposition) method, a sputtering method, a CVD (Chemical Vapor Deposition) method, and a sol-gel method, the constrained layer not being fired at the firing temperature of the green sheet; firing the resultant structure at the firing temperature of the green sheet; and removing the constrained layer.
摘要翻译：一种制造无收缩陶瓷基片的方法包括制备多个生片; 在相应的生片中形成内部电极和导电通孔; 层叠多个生片以形成多层陶瓷基板; 通过使用一种或多种选自ALD（原子层沉积）法，溅射法，CVD（化学气相沉积）法以及CVD法）中的一种或多种方法在多层陶瓷基板的顶表面和底表面上形成约束层溶胶 - 凝胶法，约束层在生坯的烧成温度下不被烧制; 在生片的烧成温度下烧成所得结构物; 并移除约束层。

3. 发明申请

US20070155033A1 Method of manufacturing light emitting diode package 审中-公开
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20070155033A1
公开(公告)日：2007-07-05
申请号：US11649914
申请日：2007-01-05
申请人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
发明人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
IPC分类号： H01L21/00
CPC分类号： B29C41/12 , B29C41/20 , B29C41/36 , B29C41/50 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2924/00014
摘要： A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.
摘要翻译：一种制造LED封装的方法。该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。这防止了由于附加界面而形成中间层而导致额外的工艺和成本，并且消除了可靠性和光提取效率的降低。

4. 发明申请

US20060121815A1 Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor 失效
标题翻译：通过毛细管成型用于制造pdp隔壁的糊剂和糊剂组合物的方法
公开(公告)号：US20060121815A1
公开(公告)日：2006-06-08
申请号：US10521196
申请日：2003-07-15
申请人： Yong Kim , Yong Kim , Sung Cho
发明人： Yong Kim , Yong Kim , Sung Cho
IPC分类号： H01J9/24
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36
摘要： Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造等离子体显示面板（PDP）的后板阻挡肋的方法，其包括以下步骤：通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中，然后烧结浆料。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高PDP的质量并降低后板的制造成本。

5. 发明申请

US20070063214A1 Light emitting diode package and method for manufacturing the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20070063214A1
公开(公告)日：2007-03-22
申请号：US11524278
申请日：2006-09-21
申请人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
发明人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/58
摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
摘要翻译：本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。荧光体分散在透镜结构的至少一部分中。

6. 发明申请

US20050156522A1 Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor 审中-公开
标题翻译：通过使用水溶液蚀刻厚膜及其组合物来制造pdp隔壁的方法
公开(公告)号：US20050156522A1
公开(公告)日：2005-07-21
申请号：US10510036
申请日：2002-04-08
申请人： Yong Kim , Jin Hwang , Yong Kim
发明人： Yong Kim , Jin Hwang , Yong Kim
IPC分类号： H01J9/24 , H01J11/12 , H01J11/36 , H01J17/49
CPC分类号： H01J9/242 , H01J11/12 , H01J11/36 , H01J2211/366
摘要： Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.
摘要翻译：公开了一种制造用于等离子体显示面板（PDP）的隔壁的方法，其包括以下步骤：通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜（或“生胶条”）肋骨，其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状，并烧结蚀刻的厚膜。这种方法造成罕见的环境污染，能够形成具有精细和复杂形状的隔肋，并且减少隔壁所需的材料成本。因此，该方法可以提高DPD的质量并降低后板的制造成本。

7. 发明申请

US20060270078A1 Method of fabricating light emitting diode package 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20060270078A1
公开(公告)日：2006-11-30
申请号：US11439189
申请日：2006-05-24
申请人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
发明人： Yong Kim , Seog Choi , Hyoung Kim , Yong Kim
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L2224/48091 , H01L2224/48227 , Y10S438/974 , H01L2924/00014
摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
摘要翻译：本发明涉及一种LED封装，并提出了一种制造LED封装的方法，包括以下步骤：提供具有LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造至少形成将形成树脂成型部件的封装基板的预定表面积。该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图形电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

8. 发明申请

US20050233763A1 Dual connection device for memory mediums and mobile communication terminals with the same 有权
标题翻译：用于存储介质的双连接设备和具有相同功能的移动通信终端
公开(公告)号：US20050233763A1
公开(公告)日：2005-10-20
申请号：US11050802
申请日：2005-02-07
申请人： Yong Kim , Yong Kim
发明人： Yong Kim , Yong Kim
IPC分类号： H04B1/38 , G06K7/00 , H04M1/00 , H04M1/02
CPC分类号： H04B1/3816 , G06K7/0021 , G06K7/0034 , H04M1/026
摘要： A dual connection device for memory mediums has a body portion electrically connected with a mobile communication terminal, a first receiving portion formed to the body portion for receiving therein a first memory medium, a second receiving portion formed to the body portion as to be arranged piled up to the first receiving portion for receiving therein a second memory medium, a first connection terminal installed in the first receiving portion so as to be electrically connected with a terminal of the first memory medium, and a second connection terminal installed in the second receiving portion so as to be electrically connected with a terminal of the second memory medium. Since a plurality of memory mediums are connected with a terminal mobile communication terminal by the connection device, it is possible to make the mobile communication terminal have a slim and compact size, accomplish a simplified assembly process, and obtain increased productivity and cost reduction due to simplification of assembly process.
摘要翻译：用于存储介质的双连接装置具有与移动通信终端电连接的主体部分，形成在主体部分上用于在其中容纳第一存储介质的第一接收部分，形成在主体部分上的第二接收部分，以布置成堆直到第一接收部分用于在其中接收第二存储介质;第一连接端子，安装在第一接收部分中以便与第一存储介质的端子电连接，第二连接端子安装在第二接收部分中以便与第二存储介质的端子电连接。由于多个存储介质通过连接装置与终端移动通信终端连接，所以可以使移动通信终端具有纤细且紧凑的尺寸，实现简化的组装过程，并且由于装配过程简化。

9. 发明授权

US08779037B2 Polycarbonate resin composition with excellent flame retardancy 有权
标题翻译：具有优异阻燃性的聚碳酸酯树脂组合物
公开(公告)号：US08779037B2
公开(公告)日：2014-07-15
申请号：US12919423
申请日：2008-12-28
申请人： Seon Mo Son , Kyung Mo Park , Sung Tae Ahn , Yong Kim
发明人： Seon Mo Son , Kyung Mo Park , Sung Tae Ahn , Yong Kim
IPC分类号： C08K5/52 , C08L69/00 , C08K5/42 , C08K5/521 , C08L33/12 , C08L27/18 , C08K5/523 , C08L25/12
CPC分类号： C08L69/00 , C08K5/42 , C08K5/521 , C08K5/523 , C08L25/12 , C08L27/18 , C08L33/12 , C08L2666/04
摘要： A polycarbonate resin composition is provided. The composition comprises (A) 50 to 90% by weight of a polycarbonate resin, (B) 5 to 30% by weight of a polymethyl methacrylate resin, (C) 5 to 20% by weight of a phosphate compound, (D) 0.01 to 2% by weight of a metal sulfonate as an organic salt, and (E) 0.05 to 2% by weight of a fluorinated olefin. The composition is highly flame retardant and scratch resistant.
摘要翻译：提供聚碳酸酯树脂组合物。该组合物包含（A）50〜90重量％的聚碳酸酯树脂，（B）5〜30重量％的聚甲基丙烯酸甲酯树脂，（C）5〜20重量％的磷酸酯化合物，（D）0.01 至2重量％的作为有机盐的金属磺酸盐，和（E）0.05至2重量％的氟化烯烃。该组合物具有高度阻燃和耐划伤性。

10. 发明授权

US08599829B2 System and method for hardware acceleration in a hybrid wired/wireless local area network 有权
标题翻译：混合有线/无线局域网硬件加速的系统和方法
公开(公告)号：US08599829B2
公开(公告)日：2013-12-03
申请号：US13299151
申请日：2011-11-17
申请人： Richard Martin , Yong Kim
发明人： Richard Martin , Yong Kim
IPC分类号： H04W4/00 , H04L12/28
CPC分类号： H04W24/02 , G01S5/0252 , H04L1/1607 , H04L12/2856 , H04L12/2872 , H04L41/08 , H04L47/125 , H04L47/14 , H04L47/15 , H04L47/24 , H04L47/2408 , H04L47/70 , H04L47/767 , H04L47/785 , H04L47/805 , H04L47/824 , H04L47/825 , H04L47/828 , H04L49/205 , H04L49/351 , H04L49/602 , H04L63/0272 , H04L63/08 , H04L63/0838 , H04L63/102 , H04L63/104 , H04L67/14 , H04L67/18 , H04L67/327 , H04L69/14 , H04L69/18 , H04L69/32 , H04L69/324 , H04L69/329 , H04L69/40 , H04W16/16
摘要： Aspects of the invention may be found in a system and method for hardware acceleration in a hybrid wired/wireless local area network. In according with various embodiments of the invention, hardware acceleration may comprise creating at least one policy to be distributed among one or more of a plurality of access point groups. At least one policy may be associated with a particular one of the access point groups. The associated policy may be identified and distributed to one or more access points in an access point group. The distribution of the policy may be conditioned on the occurrence of an event. An identified policy may be distributed to a particular access point group upon occurrence of the event.
摘要翻译：可以在用于混合有线/无线局域网中的硬件加速的系统和方法中找到本发明的方面。根据本发明的各种实施例，硬件加速可以包括创建要分布在多个接入点组中的一个或多个中的至少一个策略。至少一个策略可以与特定的一个接入点组相关联。相关联的策略可以被识别并分发到接入点组中的一个或多个接入点。政策的分配可能是事件发生的条件。在发生事件时，识别的策略可以被分发到特定接入点组。

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