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1. 发明授权

US08513681B2 Light emitting device, light emitting device package and lighting system including the same 有权
标题翻译：发光装置，发光装置封装和包括其的照明系统
公开(公告)号：US08513681B2
公开(公告)日：2013-08-20
申请号：US13526411
申请日：2012-06-18
申请人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
发明人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
IPC分类号： H01L27/15
CPC分类号： H01L33/60 , H01L33/0033 , H01L33/145 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/48 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device including a second conductive type semiconductor layer; an active layer over the second conductive type semiconductor layer; a first conductive type semiconductor layer over the active layer; a second electrode in a first region under the second conductive type semiconductor layer; a current blocking layer including a metal; and a first electrode over the first conductive type semiconductor layer. Further, the first electrode has at least one portion that vertically overlaps the current blocking layer.
摘要翻译：一种发光器件，包括第二导电类型半导体层; 在所述第二导电类型半导体层上方的有源层; 在有源层上的第一导电类型半导体层; 在第二导电类型半导体层下面的第一区域中的第二电极; 包括金属的电流阻挡层; 以及位于第一导电类型半导体层上的第一电极。此外，第一电极具有与电流阻挡层垂直重叠的至少一个部分。

2. 发明授权

US08222661B2 Light emitting device, light emitting device package and lighting system including the same 有权
标题翻译：发光装置，发光装置封装和包括其的照明系统
公开(公告)号：US08222661B2
公开(公告)日：2012-07-17
申请号：US12772985
申请日：2010-05-03
申请人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
发明人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/0033 , H01L33/145 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/48 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device including a second conductive type semiconductor layer; an active layer over the second conductive type semiconductor layer; a first conductive type semiconductor layer over the active layer; a second electrode in a first region under the second conductive type semiconductor layer; a current blocking layer including a metal; and a first electrode over the first conductive type semiconductor layer. Further, the first electrode has at least one portion that vertically overlaps the current blocking layer.
摘要翻译：一种发光器件，包括第二导电类型半导体层; 在所述第二导电类型半导体层上方的有源层; 在有源层上的第一导电类型半导体层; 在第二导电类型半导体层下面的第一区域中的第二电极; 包括金属的电流阻挡层; 以及位于第一导电类型半导体层上的第一电极。此外，第一电极具有与电流阻挡层垂直重叠的至少一个部分。

3. 发明申请

US20100276715A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME 有权
标题翻译：发光装置，发光装置包装和包括其的照明系统
公开(公告)号：US20100276715A1
公开(公告)日：2010-11-04
申请号：US12772985
申请日：2010-05-03
申请人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
发明人： Sung Min Hwang , Hyun Don Song , Hyun Kyong Cho
IPC分类号： H01L33/02 , H01L33/36 , H01L33/46
CPC分类号： H01L33/60 , H01L33/0033 , H01L33/145 , H01L33/40 , H01L33/405 , H01L33/42 , H01L33/48 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device including a second conductive type semiconductor layer; an active layer over the second conductive type semiconductor layer; a first conductive type semiconductor layer over the active layer; a second electrode in a first region under the second conductive type semiconductor layer; a current blocking layer including a metal; and a first electrode over the first conductive type semiconductor layer. Further, the first electrode has at least one portion that vertically overlaps the current blocking layer.
摘要翻译：一种发光器件，包括第二导电类型半导体层; 在所述第二导电类型半导体层上方的有源层; 在有源层上的第一导电类型半导体层; 在第二导电类型半导体层下面的第一区域中的第二电极; 包括金属的电流阻挡层; 以及位于第一导电类型半导体层上的第一电极。此外，第一电极具有与电流阻挡层垂直重叠的至少一个部分。

4. 发明授权

US08344401B2 Light emitting device, light emitting device package and lighting system including the same 有权
标题翻译：发光装置，发光装置封装和包括其的照明系统
公开(公告)号：US08344401B2
公开(公告)日：2013-01-01
申请号：US12724791
申请日：2010-03-16
申请人： Hyun Kyong Cho , Hyun Don Song , Chang Hee Hong , Hyung Gu Kim
发明人： Hyun Kyong Cho , Hyun Don Song , Chang Hee Hong , Hyung Gu Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , F21K9/23 , F21Y2113/13 , F21Y2115/10 , H01L33/007 , H01L33/0079 , H01L33/16 , H01L33/382 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Provided are a light emitting device, a light emitting device package and a lighting system including the same. The light emitting device (LED) comprises a light emitting structure comprising a second conductive type semiconductor layer, an active layer, and a first conductive type semiconductor layer and a first electrode over the light emitting structure. A portion of the light emitting structure is sloped at a predetermined angle.
摘要翻译：提供了一种发光器件，发光器件封装以及包括该发光器件的照明系统。发光器件（LED）包括发光结构，该发光结构包括在发光结构上的第二导电类型半导体层，有源层和第一导电类型半导体层以及第一电极。发光结构的一部分以预定角度倾斜。

5. 发明申请

US20110198644A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置包装和照明系统
公开(公告)号：US20110198644A1
公开(公告)日：2011-08-18
申请号：US13020157
申请日：2011-02-03
申请人： Sung Min HWANG , Hyun Don Song , Woon Kyung Choi
发明人： Sung Min HWANG , Hyun Don Song , Woon Kyung Choi
IPC分类号： H01L33/48
CPC分类号： H01L33/44 , H01L33/50 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting device package includes a sub mount; a light emitting device on the sub mount, and configured to generate light of a first wavelength; a dielectric layer disposed on the sub mount; and a fluorescent layer on the dielectric layer, and configured to convert the light of the first wavelength into light of a second wavelength, wherein the dielectric layer includes a plurality of layers having at least two different refractive indices, that transmits the light of the first wavelength and reflects the light of the second wavelength.
摘要翻译：发光器件封装包括副安装座; 在所述副安装件上的发光器件，并且被配置为产生第一波长的光; 设置在所述副安装座上的电介质层; 以及在所述电介质层上的荧光层，并且被配置为将所述第一波长的光转换成第二波长的光，其中所述介电层包括具有至少两个不同折射率的多个层，所述多个层透射所述第一波长的光波长并反射第二波长的光。

6. 发明授权

US08809884B2 Light emitting device including an electrode on a textured surface, light emitting device package and lighting system 有权
标题翻译：发光器件包括纹理表面上的电极，发光器件封装和照明系统
公开(公告)号：US08809884B2
公开(公告)日：2014-08-19
申请号：US12909184
申请日：2010-10-21
申请人： Sung Min Hwang , Hyun Don Song
发明人： Sung Min Hwang , Hyun Don Song
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/22 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package and a lighting system. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a second electrode under the second conductive semiconductor layer; a first texture over a first region of the first conductive semiconductor layer; an A-electrode over the first region of the first conductive semiconductor layer; and a B-electrode over a second region of the first conductive semiconductor layer, wherein the B-electrode includes a pad electrode connected to a wire.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在第二导电半导体层下方的第二电极; 在所述第一导电半导体层的第一区域上的第一纹理; 在所述第一导电半导体层的所述第一区域上方的A电极; 以及在所述第一导电半导体层的第二区域上的B电极，其中所述B电极包括连接到导线的焊盘电极。

7. 发明申请

US20110095306A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110095306A1
公开(公告)日：2011-04-28
申请号：US12909184
申请日：2010-10-21
申请人： Sung Min Hwang , Hyun Don Song
发明人： Sung Min Hwang , Hyun Don Song
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/22 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： Disclosed are a light emitting device, a light emitting device package and a lighting system. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a second electrode under the second conductive semiconductor layer; a first texture over a first region of the first conductive semiconductor layer; an A-electrode over the first region of the first conductive semiconductor layer; and a B-electrode over a second region of the first conductive semiconductor layer, wherein the B-electrode includes a pad electrode connected to a wire.
摘要翻译：公开了一种发光器件，发光器件封装和照明系统。本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在第二导电半导体层下方的第二电极; 在所述第一导电半导体层的第一区域上的第一纹理; 在所述第一导电半导体层的所述第一区域上方的A电极; 以及在所述第一导电半导体层的第二区域上的B电极，其中所述B电极包括连接到导线的焊盘电极。

8. 发明授权

US08759841B2 Light emitting device package and lighting system 有权
标题翻译：发光装置封装和照明系统
公开(公告)号：US08759841B2
公开(公告)日：2014-06-24
申请号：US13020157
申请日：2011-02-03
申请人： Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
发明人： Sung Min Hwang , Hyun Don Song , Woon Kyung Choi
IPC分类号： H01L27/15
CPC分类号： H01L33/44 , H01L33/50 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting device package includes a sub mount; a light emitting device on the sub mount, and configured to generate light of a first wavelength; a dielectric layer disposed on the sub mount; and a fluorescent layer on the dielectric layer, and configured to convert the light of the first wavelength into light of a second wavelength, wherein the dielectric layer includes a plurality of layers having at least two different refractive indices, that transmits the light of the first wavelength and reflects the light of the second wavelength.
摘要翻译：发光器件封装包括副安装座; 在所述副安装件上的发光器件，并且被配置为产生第一波长的光; 设置在所述副安装座上的电介质层; 以及在所述电介质层上的荧光层，并且被配置为将所述第一波长的光转换成第二波长的光，其中所述介电层包括具有至少两个不同折射率的多个层，所述多个层透射所述第一波长的光波长并反射第二波长的光。

9. 发明申请

US20100237372A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100237372A1
公开(公告)日：2010-09-23
申请号：US12693263
申请日：2010-01-25
申请人： Sun Kyung KIM , Hyun Don Song , Jin Wook Lee
发明人： Sun Kyung KIM , Hyun Don Song , Jin Wook Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/20
摘要： A light emitting device including a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first photonic crystal structure on the light emitting structure; a lower encapsulant on the first photonic crystal structure; and a second photonic crystal structure on the lower encapsulant.
摘要翻译：一种发光器件，包括包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 在发光结构上的第一光子晶体结构; 第一光子晶体结构上的较低密封剂; 以及在下封装材料上的第二光子晶体结构。

10. 发明授权

US08482034B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08482034B2
公开(公告)日：2013-07-09
申请号：US13439668
申请日：2012-04-04
申请人： Hyun Don Song
发明人： Hyun Don Song
IPC分类号： H01L21/07
CPC分类号： H01L33/387 , H01L33/44
摘要： A light emitting device including a light emitting structure having a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a first electrode on the light emitting structure; and a photon escape layer on the light emitting structure. Further, the photon escape layer has a refractive index that is between a refractive index of the light emitting structure and a refractive index of an encapsulating material with respect to the light emitting structure such that an escape probability for photons emitted by the light emitting structure is increased.
摘要翻译：一种发光器件，包括具有第一导电半导体层，有源层和第二导电半导体层的发光结构; 在发光结构上的第一电极; 和发光结构上的光子逸出层。此外，光子逃逸层具有在发光结构的折射率与封装材料相对于发光结构的折射率之间的折射率，使得由发光结构发射的光子的逸出概率为增加。

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