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1. 发明申请

US20080110667A1 PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN AND MANUFACTURING PROCESS THEREOF 失效
标题翻译：具有嵌入式电容器的印刷电路板及其制造工艺
公开(公告)号：US20080110667A1
公开(公告)日：2008-05-15
申请号：US12016919
申请日：2008-01-18
申请人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryn , Suk Cho , Ho Jeon
发明人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryn , Suk Cho , Ho Jeon
IPC分类号： H05K1/09 , H05K1/16
CPC分类号： H05K1/162 , H01L2924/0002 , H05K1/095 , H05K3/108 , H05K3/244 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/09509 , H05K2201/09881 , Y10S438/957 , Y10T29/43 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
摘要翻译：具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。还公开了印刷电路板的制造方法。

2. 发明申请

US20060196691A1 Printed circuit board with embedded capacitors therein and manufacturing process thereof 失效
公开(公告)号：US20060196691A1
公开(公告)日：2006-09-07
申请号：US11365219
申请日：2006-02-28
申请人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryu , Suk Cho , Ho Jeon
发明人： Jin Ahn , Cheol Hwang , Sung Kim , Chang Ryu , Suk Cho , Ho Jeon
IPC分类号： H05K1/03 , H05K1/16 , H05K3/06
CPC分类号： H05K1/162 , H01L2924/0002 , H05K1/095 , H05K3/108 , H05K3/244 , H05K3/4652 , H05K2201/0175 , H05K2201/0179 , H05K2201/09509 , H05K2201/09881 , Y10S438/957 , Y10T29/43 , Y10T29/435 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

3. 发明授权

US08172210B2 Holding unit for panel transmitting device 有权
标题翻译：面板发送装置保持单元
公开(公告)号：US08172210B2
公开(公告)日：2012-05-08
申请号：US12364603
申请日：2009-02-03
申请人： Ho Jeon
发明人： Ho Jeon
IPC分类号： B25B11/00 , B25B1/22 , B23Q1/25 , B23Q3/00
CPC分类号： B25J15/0052 , B25J15/0061
摘要： A holding unit for a panel transmitting device provided with a robot of an articulated joint type to hold a panel of various types and transmit between processes includes a supporting means and a plurality of moving means. An end of the supporting means is movably supported and fixed to the robot and the other end of which extends along a width direction of the panel. Each of the moving means is provided with a moving bar an end of which is provided at a side of the supporting means and is able to rotate and slide in a thickness direction and a width direction of the panel so that the other end thereof may hold the panel. With the unit, precise position adjustment can be achieved in a cost-effective manner.
摘要翻译：一种用于面板传送装置的保持单元，该装置设置有用于保持各种类型的面板并在处理之间传送的铰接接头型机器人，包括支撑装置和多个移动装置。支撑装置的一端被可移动地支撑并固定在机器人上，另一端沿面板的宽度方向延伸。每个移动装置设置有移动杆，其一端设置在支撑装置的一侧，并且能够在面板的厚度方向和宽度方向上旋转和滑动，使得其另一端可以保持面板。使用该单元，可以以成本有效的方式实现精确的位置调整。

4. 发明申请

US20100133405A1 HOLDING UNIT FOR PANEL TRANSMITTING DEVICE 有权
标题翻译：面板传输设备的控制单元
公开(公告)号：US20100133405A1
公开(公告)日：2010-06-03
申请号：US12364603
申请日：2009-02-03
申请人： Ho Jeon
发明人： Ho Jeon
IPC分类号： B25J15/00
CPC分类号： B25J15/0052 , B25J15/0061
摘要： A holding unit for a panel transmitting device provided with a robot of an articulated joint type to hold a panel of various types and transmit between processes includes a supporting means and a plurality of moving means. An end of the supporting means is movably supported and fixed to the robot and the other end of which extends along a width direction of the panel. Each of the moving means is provided with a moving bar an end of which is provided at a side of the supporting means and is able to rotate and slide in a thickness direction and a width direction of the panel so that the other end thereof may hold the panel. With the unit, precise position adjustment can be achieved in a cost-effective manner.
摘要翻译：一种用于面板传送装置的保持单元，该装置设置有用于保持各种类型的面板并在处理之间传送的铰接接头型机器人，包括支撑装置和多个移动装置。支撑装置的一端被可移动地支撑并固定在机器人上，另一端沿面板的宽度方向延伸。每个移动装置设置有移动杆，其一端设置在支撑装置的一侧，并且能够在面板的厚度方向和宽度方向上旋转和滑动，使得其另一端可以保持面板。使用该单元，可以以成本有效的方式实现精确的位置调整。

5. 发明申请

US20060115770A1 Printed circuit board including embedded capacitor and method of fabricating same 审中-公开
标题翻译：包括嵌入式电容器的印刷电路板及其制造方法
公开(公告)号：US20060115770A1
公开(公告)日：2006-06-01
申请号：US11058998
申请日：2005-02-15
申请人： Jong Hong , Chang Ryu , Ho Jeon , Seok Lee
发明人： Jong Hong , Chang Ryu , Ho Jeon , Seok Lee
IPC分类号： G03C5/00
CPC分类号： H05K1/162 , H05K3/0023 , H05K3/0082 , H05K3/064 , H05K3/108 , H05K3/181 , H05K3/184 , H05K3/4644 , H05K2201/0355 , H05K2201/09509 , H05K2201/09881 , H05K2203/0551
摘要： Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method of fabricating the same.
摘要翻译：公开了一种在嵌入式电容器的下电极层形成之后形成介质层和上电极层的嵌入式电容器的PCB，从而在其上形成有下电极层的电路层上提供微电路图案，及其制造方法。

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