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    • 2. 发明申请
    • COOLING STRUCTURE FOR ELECTRONIC DEVICE
    • 电子设备冷却结构
    • US20120314365A1
    • 2012-12-13
    • US13517190
    • 2012-01-27
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • H05K7/20
    • H01L23/467H01L23/36H01L2924/0002H01L2924/00
    • A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
    • 发电部件(3)安装在电路板(2)的一个表面上。 散热构件(4)设置在壳体(1)的一个表面和相对的壁(12)之间。 散热构件(4)具有沿特定方向延伸并与发热部件(3)接触的板(41)和从板(41)向相对壁突出的翅片(42) 12)。 在与散热构件(4)重叠的壳体的相对壁(12)的区域中,设置空气入口(1c)以沿指定方向延伸。 散热构件(4)在两个端部沿规定方向通过导热间隔件(9)与相对的壁(12)接触,并且在翅片(42)之间形成间隙(8) )和相对的壁(12)。
    • 3. 发明申请
    • ELECTRONIC DEVICE COOLING STRUCTURE
    • 电子设备冷却结构
    • US20120033381A1
    • 2012-02-09
    • US13265281
    • 2010-08-17
    • Subaru MatsumotoKou KomoriYasufumi Takahashi
    • Subaru MatsumotoKou KomoriYasufumi Takahashi
    • H05K7/20
    • H01L23/3672F28F3/027H01L23/467H01L2924/0002H05K7/20145H01L2924/00
    • A cooling structure (10A) for an electronic device includes: a housing provided with an air inlet and an air outlet; a fan; and a circuit board (2) disposed in the housing. A heat generating component (3) is mounted on one surface of the circuit board (2). A heat release member (4) having fins (45) and a heat transfer plate (41) is disposed between the one surface of the circuit board (2) and an opposite wall (12) of the housing. The heat release member (4) extends, in an arrangement direction of the fins (45), beyond both sides of the heat generating component (3). For example, in an intermediate zone, a resistant layer (8) for suppressing heat transfer from the fins (45) to the opposite wall (12) is formed between the opposite wall (12) and the fins (45).
    • 一种用于电子设备的冷却结构(10A)包括:设有空气入口和空气出口的壳体; 粉丝; 和设置在壳体中的电路板(2)。 发电部件(3)安装在电路板(2)的一个表面上。 具有翅片(45)和传热板(41)的散热构件(4)设置在电路板(2)的一个表面和壳体的相对的壁(12)之间。 散热构件(4)在翅片(45)的布置方向上延伸超过发热部件(3)的两侧。 例如,在中间区域中,在相对的壁(12)和翅片(45)之间形成有用于抑制从翅片(45)向相对壁(12)的传热的抵抗层(8)。
    • 4. 发明授权
    • Cooling structure for electronic device
    • 电子设备冷却结构
    • US08711561B2
    • 2014-04-29
    • US13517190
    • 2012-01-27
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • Subaru MatsumotoKou KomoriDaisuke KatayamaKatsumi Otani
    • H05K7/20
    • H01L23/467H01L23/36H01L2924/0002H01L2924/00
    • A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
    • 发电部件(3)安装在电路板(2)的一个表面上。 散热构件(4)设置在壳体(1)的一个表面和相对的壁(12)之间。 散热构件(4)具有沿特定方向延伸并与发热部件(3)接触的板(41)和从板(41)向相对壁突出的翅片(42) 12)。 在与散热构件(4)重叠的壳体的相对壁(12)的区域中,设置空气入口(1c)以沿指定方向延伸。 散热构件(4)在两个端部沿规定方向通过导热间隔件(9)与相对的壁(12)接触,并且在翅片(42)之间形成间隙(8) )和相对的壁(12)。
    • 6. 发明申请
    • OUTDOOR HEAT EXCHANGER, AND AIR CONDITIONING DEVICE FOR VEHICLE
    • 户外换热器和车用空调装置
    • US20140137592A1
    • 2014-05-22
    • US14232162
    • 2012-07-11
    • Subaru MatsumotoKou Komori
    • Subaru MatsumotoKou Komori
    • B60H1/00
    • B60H1/00321F25B39/00F28D1/05375F28D1/05391F28D2021/0084F28D2021/0085F28F1/128F28F19/00
    • A corrugated fin (6) disposed between flat tubes (5) having a cross-sectional shape extended in a first direction includes a plurality of plate portions (6A) and a plurality of folded portions (6B). Each plate portion (6A) has a plurality of louvers (7) formed by cutting and raising, the louvers (7) being inclined with respect to the first direction and being substantially continuous with each other in the first direction. Each plate portion (6A) has an extension portion (60) projecting windward in the first direction from a joining region (8) where the folded portions (6B) are joined to the flat tubes (5). A foremost louver (7a) that is located on the most windward side among the louvers (7) is disposed entirely within the extension portion (60). Each plate portion (6A) has a front flat portion (61) located windward of the foremost louver (7a). The front flat portion (61) has an area larger than half of that of the extension portion (60).
    • 设置在具有沿第一方向延伸的横截面形状的扁平管(5)之间的波纹状散热片(6)包括多个板部(6A)和多个折叠部(6B)。 每个板部分(6A)具有通过切割和升高形成的多个百叶窗(7),百叶窗(7)相对于第一方向倾斜并且在第一方向上基本上彼此连续。 每个板部分(6A)具有从折叠部分(6B)接合到扁平管(5)的接合区域(8)沿第一方向向上突出的延伸部分(60)。 在百叶窗(7)中位于最上风侧的最重的百叶窗(7a)全部设置在延伸部分(60)内。 每个板部分(6A)具有位于最前面的百叶窗(7a)的向上的前平坦部分(61)。 前平坦部分(61)的面积大于延伸部分(60)的面积的一半。
    • 7. 发明授权
    • Electronic device cooling structure
    • 电子设备冷却结构
    • US08576565B2
    • 2013-11-05
    • US13265281
    • 2010-08-17
    • Subaru MatsumotoKou KomoriYasufumi Takahashi
    • Subaru MatsumotoKou KomoriYasufumi Takahashi
    • H05K7/20
    • H01L23/3672F28F3/027H01L23/467H01L2924/0002H05K7/20145H01L2924/00
    • A cooling structure (10A) for an electronic device includes: a housing provided with an air inlet and an air outlet; a fan; and a circuit board (2) disposed in the housing. A heat generating component (3) is mounted on one surface of the circuit board (2). A heat release member (4) having fins (45) and a heat transfer plate (41) is disposed between the one surface of the circuit board (2) and an opposite wall (12) of the housing. The heat release member (4) extends, in an arrangement direction of the fins (45), beyond both sides of the heat generating component (3). For example, in an intermediate zone, a resistant layer (8) for suppressing heat transfer from the fins (45) to the opposite wall (12) is formed between the opposite wall (12) and the fins (45).
    • 一种用于电子设备的冷却结构(10A)包括:设有空气入口和空气出口的壳体; 粉丝; 和设置在壳体中的电路板(2)。 发电部件(3)安装在电路板(2)的一个表面上。 具有翅片(45)和传热板(41)的散热构件(4)设置在电路板(2)的一个表面和壳体的相对的壁(12)之间。 散热构件(4)在翅片(45)的布置方向上延伸超过发热部件(3)的两侧。 例如,在中间区域中,在相对的壁(12)和翅片(45)之间形成有用于抑制从翅片(45)向相对壁(12)的传热的抵抗层(8)。