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1. 发明申请

US20120314365A1 COOLING STRUCTURE FOR ELECTRONIC DEVICE 有权
标题翻译：电子设备冷却结构
公开(公告)号：US20120314365A1
公开(公告)日：2012-12-13
申请号：US13517190
申请日：2012-01-27
申请人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
发明人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L2924/0002 , H01L2924/00
摘要： A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
摘要翻译：发电部件（3）安装在电路板（2）的一个表面上。散热构件（4）设置在壳体（1）的一个表面和相对的壁（12）之间。散热构件（4）具有沿特定方向延伸并与发热部件（3）接触的板（41）和从板（41）向相对壁突出的翅片（42） 12）。在与散热构件（4）重叠的壳体的相对壁（12）的区域中，设置空气入口（1c）以沿指定方向延伸。散热构件（4）在两个端部沿规定方向通过导热间隔件（9）与相对的壁（12）接触，并且在翅片（42）之间形成间隙（8））和相对的壁（12）。

2. 发明授权

US08711561B2 Cooling structure for electronic device 有权
标题翻译：电子设备冷却结构
公开(公告)号：US08711561B2
公开(公告)日：2014-04-29
申请号：US13517190
申请日：2012-01-27
申请人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
发明人： Subaru Matsumoto , Kou Komori , Daisuke Katayama , Katsumi Otani
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L2924/0002 , H01L2924/00
摘要： A heat generating component (3) is mounted on one surface of a circuit board (2). A heat release member (4) is disposed between the one surface and an opposite wall (12) of a housing (1). The heat release member (4) has a plate (41) that extends in a specified direction and is in contact with the heat generating component (3), and fins (42) that project from the plate (41) toward the opposite wall (12). In a region of the opposite wall (12) of the housing overlapping with the heat release member (4), an air inlet (1c) is provided so as to extend in the specified direction. The heat release member (4) is, at both end portions thereof in the specified direction, in contact with the opposite wall (12) via heat-conductive spacers (9), and a gap (8) is formed between the fins (42) and the opposite wall (12).
摘要翻译：发电部件（3）安装在电路板（2）的一个表面上。散热构件（4）设置在壳体（1）的一个表面和相对的壁（12）之间。散热构件（4）具有沿特定方向延伸并与发热部件（3）接触的板（41）和从板（41）向相对壁突出的翅片（42） 12）。在与散热构件（4）重叠的壳体的相对壁（12）的区域中，设置空气入口（1c）以沿指定方向延伸。散热构件（4）在两个端部沿规定方向通过导热间隔件（9）与相对的壁（12）接触，并且在翅片（42）之间形成间隙（8））和相对的壁（12）。

3. 发明授权

US07168552B2 Article joining system 有权
标题翻译：文章加盟制度
公开(公告)号：US07168552B2
公开(公告)日：2007-01-30
申请号：US11294623
申请日：2005-12-05
申请人： Daisuke Katayama
发明人： Daisuke Katayama
IPC分类号： B65G47/68 , B65G43/00 , G06F7/00
CPC分类号： B65G47/681 , B65G43/10 , B65G47/31
摘要： A conveyance path for conveying articles though an accumulation conveyor, then through a carry-out conveyor, and then through a joining station is disclosed. After a flow of articles and at a time when there are no articles present on a portion of the conveyance path, an article spacing control of the carry-out conveyor and the carry-out of an article to the joining station are stopped. In the conveyance path where an article is present on a portion of the conveyance path, the speed control of an article in the accumulation conveyor is conducted at a speed higher than a constant speed, the speed control of the carry-out conveyor is conducted at a speed higher than the constant speed, and the article spacing control is conducted at a spacing narrower than a prescribed spacing.
摘要翻译：一种输送路径，用于通过堆积输送机输送物品，然后通过输送输送机，然后通过连接站。在物品流动之后，当输送路径的一部分上没有物品的时候，停止输送输送机的物品间隔控制和物品到接合台的进出。在输送路径的一部分上存在物品的输送路径中，以高于恒定速度的方式进行堆积输送机中的物品的速度控制，输送输送机的速度控制在速度高于恒定速度，并且物品间距控制以比规定间隔窄的间隔进行。

4. 发明申请

US20120315745A1 CRYSTALLINE SILICON FILM FORMING METHOD AND PLASMA CVD APPARATUS 审中-公开
标题翻译：晶体硅薄膜成型方法和等离子体CVD装置
公开(公告)号：US20120315745A1
公开(公告)日：2012-12-13
申请号：US13499150
申请日：2010-09-28
申请人： Daisuke Katayama , Minoru Honda , Masayuki Kohno , Toshio Nakanishi
发明人： Daisuke Katayama , Minoru Honda , Masayuki Kohno , Toshio Nakanishi
IPC分类号： H01L21/20 , C23C16/511
CPC分类号： C23C16/24 , C23C16/511 , H01J37/32192 , H01J37/3222 , H01J2237/3321 , H01L21/02381 , H01L21/02532 , H01L21/02573 , H01L21/0262 , H05H1/46
摘要： A high-quality crystalline silicon film can be formed at a high film forming rate by performing a plasma CVD process. In a crystalline silicon film forming method for forming a crystalline silicon film on a surface of a processing target object by using a plasma CVD apparatus for introducing microwave into a processing chamber through a planar antenna having a multiple number of holes and generating plasma, the crystalline silicon film forming method includes generating plasma by exciting a film forming gas containing a silicon compound represented as SinH2n+2 (n is equal to or larger than 2) by the microwave; and depositing a crystalline silicon film on the surface of the processing target substrate by performing the plasma CVD process with the plasma.
摘要翻译：通过进行等离子体CVD工艺，能够以高成膜速度形成高质量的结晶硅膜。在通过使用等离子体CVD装置通过具有多个孔的平面天线将微波引入处理室并产生等离子体的用于在处理对象物体的表面上形成结晶硅膜的结晶硅膜形成方法中，硅膜形成方法包括通过微波激发含有表示为SinH2n + 2（n等于或大于2）的硅化合物的成膜气体来产生等离子体; 以及通过用等离子体进行等离子体CVD处理，在处理对象基板的表面上沉积晶体硅膜。

5. 发明申请

US20080073614A1 Metal removing solution and metal removing method using the same 审中-公开
标题翻译：金属去除溶液及使用其的金属去除方法
公开(公告)号：US20080073614A1
公开(公告)日：2008-03-27
申请号：US11903837
申请日：2007-09-25
申请人： Daisaku Akiyama , Daisuke Katayama
发明人： Daisaku Akiyama , Daisuke Katayama
IPC分类号： C09K13/08
CPC分类号： H05K3/26 , C23F1/30 , C23F1/44 , H05K3/108 , H05K3/181 , H05K2201/0761
摘要： A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.
摘要翻译：本发明的金属去除溶液是用于除去钯，锡，银，钯合金，银合金和锡合金的溶液，金属去除溶液含有链硫代羰基化合物。本发明的除去钯，锡，银，钯合金，银合金，锡合金的除去方法是从包含铜或铜合金的系统中选择除去铜或铜合金以外的金属的方法，通过使用含有链硫代羰基化合物的金属去除溶液，选自钯，锡，银，钯合金，银合金和锡合金中的至少一种。因此，本发明提供能够除去钯，锡，银，钯合金，银合金和锡合金的金属去除溶液，该溶液具有优异的除去钯，锡，银，钯合金，银合金，锡合金等而不侵蚀铜，并且由于溶液不含任何有毒物质，因此具有优异的可操作性; 以及使用上述金属去除溶液的除去方法。

6. 发明申请

US20060155420A1 Article joining system 有权
标题翻译：文章加盟制度
公开(公告)号：US20060155420A1
公开(公告)日：2006-07-13
申请号：US11294623
申请日：2005-12-05
申请人： Daisuke Katayama
发明人： Daisuke Katayama
IPC分类号： G06F7/00
CPC分类号： B65G47/681 , B65G43/10 , B65G47/31
摘要： When article is conveyed only with one conveyance path, in a conveyance path where article is not conveyed, the article spacing control of a carry-out conveyor and the carry-out of article to a joining apparatus are stopped. In a conveyance path where article is conveyed, the speed control of article in the accumulation conveyor is conducted at a speed higher than the constant speed, the speed control of the carry-out conveyor is conducted at a speed higher than the constant speed, and the article spacing control is conducted at a spacing narrower than the prescribed spacing.
摘要翻译：当仅用一个输送路径输送物品时，在不输送物品的输送路径中，停止输送输送机的物品间隔控制和物品到接合装置的进出。在输送物品的输送路径中，堆积输送机中的物品的速度控制以高于恒定速度的速度进行，输送输送机的速度控制以高于恒速的速度进行，并且物品间距控制以比规定间隔窄的间距进行。

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