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    • 1. 发明授权
    • Electrical connection defect simulation test method and system of the same
    • 电气连接缺陷模拟试验方法和系统相同
    • US08843357B2
    • 2014-09-23
    • US13039843
    • 2011-03-03
    • Su-Wei TsaiMing-Hsien Liu
    • Su-Wei TsaiMing-Hsien Liu
    • G06F17/50G06F9/455G06G7/62G06F11/26G01R31/3183
    • G06F11/261G01R31/318357
    • An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.
    • 提供电气连接缺陷模拟试验方法。 电气连接状态模拟测试方法包括以下步骤。 提供了一种被测器件,其中被测器件包括多个引脚组,每个引脚组具有多个信号引脚。 零信号从信号馈送装置发送到每个信号引脚以模拟打开状态。 对每个信号引脚进行开路测试。 被测器件的信号引脚连接到继电器矩阵。 控制继电器矩阵以使其中一个引脚组中的任何两个信号引脚电连接以模拟短路状态。 对任何两个电气连接的信号引脚进行短路测试。 本文还公开了电连接状态模拟测试系统。
    • 2. 发明申请
    • ELECTRICAL CONNECTION DEFECT SIMULATION TEST METHOD AND SYSTEM OF THE SAME
    • 电气连接缺陷模拟测试方法及其系统
    • US20120173214A1
    • 2012-07-05
    • US13039843
    • 2011-03-03
    • Su-Wei TsaiMing-Hsien Liu
    • Su-Wei TsaiMing-Hsien Liu
    • G06G7/48
    • G06F11/261G01R31/318357
    • An electrical connection defect simulation test method is provided. The electrical connection state simulation test method includes the steps as follows. A device under test is provided, wherein the device under test includes a plurality of pin groups each having a plurality of signal pins. A zero-frequency signal is transmitted from a signal-feeding device to each of the signal pins to simulate an open condition. An open test is performed on each of the signal pins. The signal pins of the device under test are connected to a relay matrix. The relay matrix is controlled to make any two of the signal pins in one of the pin groups electrically connected to simulate a short condition. A short test is performed on any two of the electrically connected signal pins. An electrical connection state simulation test system is disclosed herein as well.
    • 提供电气连接缺陷模拟试验方法。 电气连接状态模拟测试方法包括以下步骤。 提供了一种被测器件,其中被测器件包括多个引脚组,每个引脚组具有多个信号引脚。 零信号从信号馈送装置发送到每个信号引脚以模拟打开状态。 对每个信号引脚进行开路测试。 被测器件的信号引脚连接到继电器矩阵。 控制继电器矩阵以使其中一个引脚组中的任何两个信号引脚电连接以模拟短路状态。 对任何两个电气连接的信号引脚进行短路测试。 本文还公开了电连接状态模拟测试系统。
    • 4. 发明授权
    • Electrical connection defect detection system and method
    • 电气连接缺陷检测系统及方法
    • US08350575B2
    • 2013-01-08
    • US12761456
    • 2010-04-16
    • Su-Wei TsaiShang-Tsang Yeh
    • Su-Wei TsaiShang-Tsang Yeh
    • G01R31/04
    • G01R31/046
    • An electrical connection defect detection system to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection system comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module, an electrode board and a plurality of grounding paths. The electrode board comprises a detection surface to be adapted to a surface of the under-test device opposite to the under-test pin to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The grounding paths are connected to one of not-under-test pin groups respectively to further connect to the ground potential. An electrical connection defect detection method is disclosed herein as well.
    • 一种电连接缺陷检测系统,用于检测被测装置的未被测试的引脚与电路板的信号线之间的电连接是否正常。 电连接缺陷检测系统包括信号提供器,通过信号线,检测模块,电极板和多个接地路径向未测试引脚提供测试信号。 电极板包括检测表面,以适应被测试装置的与被测试针脚相对的表面,以使得检测模块检测与电极板,欠压引脚和信号线相关联的电容值 当连接正常时大于阈值。 接地路径分别连接到未被测试的引脚组之间,以进一步连接到地电位。 本文还公开了电连接缺陷检测方法。
    • 5. 发明授权
    • Electronic device testing system and method
    • 电子设备测试系统及方法
    • US07855567B2
    • 2010-12-21
    • US12060817
    • 2008-04-01
    • Su-Wei TsaiHsin-Hao Chen
    • Su-Wei TsaiHsin-Hao Chen
    • G01R31/02
    • G01R31/2813G01R31/043
    • The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.
    • 本发明提供了一种适用于确定插座的插针是否正确连接到印刷电路板的测试系统和方法。 测试系统包括测试信号源,插座,信号感测单元,固定元件和分析单元。 信号感测单元包括传感器板,探针和运算放大器。 传感器板电耦合到插座,传感器板具有探测点。 探头选择性地与传感器板的探测点接触,用于接收和输出感测信号。 运算放大器电连接到探头,用于接收,放大和输出感测信号。 固定元件用于将传感器板固定在插座和固定元件之间。
    • 7. 发明授权
    • Electrical connection defect detection device
    • 电气连接缺陷检测装置
    • US08324908B2
    • 2012-12-04
    • US12761481
    • 2010-04-16
    • Su-Wei TsaiShang-Tsang Yeh
    • Su-Wei TsaiShang-Tsang Yeh
    • G01R31/04
    • G01R31/046
    • An electrical connection defect detection device to detect whether an electrical connection between an under-test pin of an under-test device and a signal line of a circuit board is normal is provided. The electrical connection defect detection device comprises a signal provider providing a test signal to the under-test pin through the signal line, a detection module and an electrode board comprising a detection surface and at least one array of through holes. The detection surface contacts a surface of the under-test device to make the detection module detect a capacitance value associated with the electrode board, the under-test pin and the signal line larger than a threshold value when their connection is normal. The through holes are placed along the edges of the electronic board and are electrically connected to a ground potential to perform a capacitive shielding.
    • 一种电连接缺陷检测装置,用于检测被测试装置的未被测试的引脚与电路板的信号线之间的电连接是否正常。 电连接缺陷检测装置包括信号提供器,通过信号线向被测试引脚提供测试信号,检测模块和包括检测表面和至少一个通孔阵列的电极板。 检测面接触被测设备的表面,使得检测模块在连接正常时检测与电极板,欠压引脚和信号线相关联的电容值大于阈值。 通孔沿着电子板的边缘放置并且电连接到地电位以执行电容屏蔽。
    • 8. 发明申请
    • Electronic Device Testing System and Method
    • 电子设备测试系统和方法
    • US20090243642A1
    • 2009-10-01
    • US12060817
    • 2008-04-01
    • Su-Wei TsaiHsin-Hao Chen
    • Su-Wei TsaiHsin-Hao Chen
    • G01R31/02
    • G01R31/2813G01R31/043
    • The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.
    • 本发明提供了一种适用于确定插座的插针是否正确连接到印刷电路板的测试系统和方法。 测试系统包括测试信号源,插座,信号感测单元,固定元件和分析单元。 信号感测单元包括传感器板,探针和运算放大器。 传感器板电耦合到插座,传感器板具有探测点。 探头选择性地与传感器板的探测点接触,用于接收和输出感测信号。 运算放大器电连接到探头,用于接收,放大和输出感测信号。 固定元件用于将传感器板固定在插座和固定元件之间。