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    • 8. 发明授权
    • 2F-square memory cell for gigabit memory applications
    • 用于千兆位存储器应用的2F方形存储单元
    • US5990509A
    • 1999-11-23
    • US787418
    • 1997-01-22
    • Stuart Mcallister Burns, Jr.Hussein Jbrahim HanafiJeffrey J. Welser
    • Stuart Mcallister Burns, Jr.Hussein Jbrahim HanafiJeffrey J. Welser
    • H01L21/8242H01L21/8247H01L27/108H01L27/115H01L29/78H01L29/788H01L29/792H01L29/76H01L29/94
    • H01L27/11556H01L27/10808H01L27/10823H01L27/10841H01L27/10897H01L27/115
    • A densely packed array of vertical semiconductor devices having pillars and methods of making thereof are disclosed. The array has columns of bitlines and rows of wordlines. The gates of the transistors act as the wordlines, while the source or drain regions acts as the bitlines. The array also has vertical pillars, each having a channel formed between source and drain regions. Two transistors are formed per pillar. This is achieved by forming two gates per pillar formed on opposite pillar sidewalls which are along the bitline direction. This forms two wordlines or gates per pillar arranged in the wordline direction. The source regions are self-aligned and located below the pillars. The source regions of adjacent bit lines are isolated from each other without increasing the cell size. Two floating gates per pillar may be used for EEPROM or flash memory application. The isolated sources allow individual cells to be addressed and written via direct tunneling, in both volatile and non-volatile memory cell configurations. For Gbit DRAM applications, stack or trench capacitors may be formed on the pillars, or in trenches surrounding the pillars, respectively. When two capacitors or two floating gates are formed per pillar, the effective memory cell size is 1 bit/2F.sup.2.
    • 公开了一种具有支柱的紧密堆叠的垂直半导体器件阵列及其制造方法。 该阵列具有位线和字线行。 晶体管的栅极用作字线,而源极或漏极区域用作位线。 阵列还具有垂直柱,每个柱具有形成在源区和漏区之间的通道。 每支柱形成两个晶体管。 这通过在沿着位线方向的相对的支柱侧壁上形成的每个柱形成两个门来实现。 这在字线方向上形成了每个柱的两个字线或门。 源区域是自对准的并位于支柱下方。 相邻位线的源极区彼此隔离,而不增加单元尺寸。 每个支柱两个浮动门可用于EEPROM或闪存应用。 隔离源允许在易失性和非易失性存储单元配置中通过直接隧道来寻址和写入单个单元。 对于Gbit DRAM应用,可以在柱上或分别围绕柱的沟槽中形成堆叠或沟槽电容器。 当每个柱形成两个电容器或两个浮动栅极时,有效存储单元大小为1位/ 2F2。