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1. 发明授权

US06776692B1 Closed-loop control of wafer polishing in a chemical mechanical polishing system 有权
标题翻译：在化学机械抛光系统中晶圆抛光的闭环控制
公开(公告)号：US06776692B1
公开(公告)日：2004-08-17
申请号：US09609426
申请日：2000-07-05
申请人： Steven Zuniga , Manoocher Birang
发明人： Steven Zuniga , Manoocher Birang
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , B24B49/16
摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.
摘要翻译：抛光晶片（10）的技术包括闭环控制。晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。将计算出的厚度分布与目标厚度分布进行比较。基于比较的结果调整至少一个载体头部腔室中的压力。可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

2. 发明授权

US06572446B1 Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane 失效
标题翻译：化学机械抛光垫调节元件，具有离散点和柔顺膜
公开(公告)号：US06572446B1
公开(公告)日：2003-06-03
申请号：US09664603
申请日：2000-09-18
申请人： Thomas H. Osterheld , Manoocher Birang , Robert D. Tolles , Steven Zuniga , Charles C. Garretson
发明人： Thomas H. Osterheld , Manoocher Birang , Robert D. Tolles , Steven Zuniga , Charles C. Garretson
IPC分类号： B24B5100
CPC分类号： B24B37/20 , B24B37/26 , B24B53/017
摘要： A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.
摘要翻译：垫调节组件包括具有可与抛光垫接触的末端执行器的调节头，设置在末端执行器底部的多个向下突出的可移动调节元件; 以及设置在调节元件上方并与其相邻的柔顺背衬构件，其中由柔性背衬构件施加的力被传递到可移动调节元件以移动调节元件。在一个方面，加压电路将来自压力源的压力施加到柔性背衬构件上，以使柔顺背衬构件抵靠可动调节元件弯曲。

3. 发明授权

US6159079A Carrier head for chemical mechanical polishing a substrate 有权
公开(公告)号：US6159079A
公开(公告)日：2000-12-12
申请号：US149806
申请日：1998-09-08
申请人： Steven Zuniga , Hung Chen , Manoocher Birang
发明人： Steven Zuniga , Hung Chen , Manoocher Birang
IPC分类号： B24B37/30 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

4. 发明授权

US07018275B2 Closed-loop control of wafer polishing in a chemical mechanical polishing system 有权
标题翻译：在化学机械抛光系统中晶圆抛光的闭环控制
公开(公告)号：US07018275B2
公开(公告)日：2006-03-28
申请号：US10886000
申请日：2004-07-06
申请人： Steven Zuniga , Manoocher Birang
发明人： Steven Zuniga , Manoocher Birang
IPC分类号： B24B11/00
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , B24B49/16
摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.
摘要翻译：抛光晶片（10）的技术包括闭环控制。晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。将计算出的厚度分布与目标厚度分布进行比较。基于比较的结果调整至少一个载体头部腔室中的压力。可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

5. 发明申请

US20050020185A1 Closed-loop control of wafer polishing in a chemical mechanical polishing system 有权
标题翻译：在化学机械抛光系统中晶圆抛光的闭环控制
公开(公告)号：US20050020185A1
公开(公告)日：2005-01-27
申请号：US10886000
申请日：2004-07-06
申请人： Steven Zuniga , Manoocher Birang
发明人： Steven Zuniga , Manoocher Birang
IPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , B24B49/16 , H01L21/304 , B24B49/00 , B24B1/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , B24B49/16
摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.
摘要翻译：抛光晶片（10）的技术包括闭环控制。晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。将计算出的厚度分布与目标厚度分布进行比较。基于比较的结果调整至少一个载体头部腔室中的压力。可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

6. 发明授权

US06514124B1 Carrier head for chemical mechanical polishing a substrate 有权
标题翻译：载体头用于化学机械抛光底物
公开(公告)号：US06514124B1
公开(公告)日：2003-02-04
申请号：US09693618
申请日：2000-10-20
申请人： Steven Zuniga , Hung Chen , Manoocher Birang
发明人： Steven Zuniga , Hung Chen , Manoocher Birang
IPC分类号： B24B100
CPC分类号： B24B37/30
摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.
摘要翻译：用于化学机械抛光装置的载体头包括具有唇部的柔性膜，以接合基底以形成用于改善真空吸附的密封。

7. 发明申请

US20050037698A1 Carrier head with a flexible membrane 失效
标题翻译：带头的柔性膜
公开(公告)号：US20050037698A1
公开(公告)日：2005-02-17
申请号：US10946186
申请日：2004-09-20
申请人： Steven Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
发明人： Steven Zuniga , Manoocher Birang , Hung Chen , Sen-Hou Ko
IPC分类号： B24B37/30 , B24B37/32 , B24B49/16 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32
摘要： A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
摘要翻译：描述了用于化学机械抛光装置的载体头。承载头具有底座，刚体，膜和加压结构。刚体相对于基座可移动并包括向下延伸的突出部。膜具有用于基底的安装表面。膜延伸到底部下方以在基底和膜之间提供腔室。加压结构向刚体施加向下的压力，以使刚体的下表面压在膜的内表面上。

8. 发明申请

US20050186892A1 Profile control platen 有权
标题翻译：型材控制台板
公开(公告)号：US20050186892A1
公开(公告)日：2005-08-25
申请号：US11029287
申请日：2005-01-05
申请人： Hung Chen , Steven Zuniga , Charles Garretson , Thomas Osterheld , Sen-Hou Ko , Mohsen Salek
发明人： Hung Chen , Steven Zuniga , Charles Garretson , Thomas Osterheld , Sen-Hou Ko , Mohsen Salek
IPC分类号： B24B37/16 , B24B41/047 , B24B1/00
CPC分类号： B24B37/16
摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
摘要翻译：用于基板的化学机械抛光的压板包括可以放置抛光垫的表面，支撑结构和控制器。表面具有第一区域和第二区域，并且可操作以在抛光期间对抛光垫施加力。支撑结构位于第二区域下方并且可操作以使第二区域施加比第一区域更多的力。控制器可操作以调节由第二区域施加的力的量。

9. 发明申请

US20050126708A1 Retaining ring with slurry transport grooves 审中-公开
标题翻译：带浆料输送槽的保持环
公开(公告)号：US20050126708A1
公开(公告)日：2005-06-16
申请号：US10732966
申请日：2003-12-10
申请人： Hung Chen , Steven Zuniga
发明人： Hung Chen , Steven Zuniga
IPC分类号： B24B37/04 , B24B41/06 , H01L21/306
CPC分类号： B24B37/32
摘要： A retaining ring for chemical mechanical polishing has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The bottom surface includes a plurality of channels, each channel extending from the inner diameter surface to the outer diameter surface and having a rounded ceiling.
摘要翻译：用于化学机械抛光的保持环具有大致环形体，其具有顶表面，底表面，内径表面和外径表面。底表面包括多个通道，每个通道从内径表面延伸到外径表面并且具有圆形天花板。

10. 发明申请

US20070197141A1 Polishing apparatus with grooved subpad 有权
标题翻译：抛光装置带有凹槽的底垫
公开(公告)号：US20070197141A1
公开(公告)日：2007-08-23
申请号：US11707651
申请日：2007-02-15
申请人： Steven Zuniga , Peter McReynolds , Erik Rondum , Benjamin Bonner , Henry Au , Gregory Menk , Gopalakrishna Prabhu , Anand Iyer , Garlen Leung
发明人： Steven Zuniga , Peter McReynolds , Erik Rondum , Benjamin Bonner , Henry Au , Gregory Menk , Gopalakrishna Prabhu , Anand Iyer , Garlen Leung
IPC分类号： B24B7/30 , B24B7/00 , B24B5/00 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
摘要翻译：描述了抛光装置。抛光装置包括可旋转压板，驱动机构，用于逐渐推进具有沿着线性方向的研磨表面的抛光片横过压板，压板上的子垫以支撑抛光片，子板具有形成在其中的凹槽，以及真空源连接到子垫的凹槽，并被配置为施加足以将抛光片的一部分拉入到子垫的凹槽中以在抛光表面中引起凹槽的真空。

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